FPGA & CPLD
Products (6352)
10AX115R3F40E2SG - Arria 10 GX 1150K LE FPGA, 28nm | Intel
The Intel 10AX115R3F40E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) fabricated on TSMC's 20 nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O in a 1517-ball Flip-Chip BGA (FCBGA) package. The device delivers up to 1.5 GHz core performance with hardened floating-point DSP blocks, 28.05 Mbit on-chip RAM, and integrated transceivers supporting up to 14.1 Gbps data rates. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as DSP slices, block RAM, and high-speed transceivers. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than ASICs (no NRE cost, fully re-programmable), more parallel than CPUs/GPUs (hardware-level parallelism), and far higher performance per watt than software-defined solutions for fixed-function data paths. The Arria 10 family specifically targets mid-range applications where Stratix 10 performance is overkill but Cyclone V capability is insufficient. Key differentiating features include hardened variable-precision DSP with IEEE 754 single-precision floating-point support, 28.05 Mbit embedded memory (M20K blocks), 24 transceiver channels, hard memory controllers for DDR4/DDR3/QDR IV, and a hardened PCI Express Gen3 IP core. The -2 speed grade balances timing margin and power consumption, while the E2 industrial temperature grade supports 0C to +100C ambient operation. The 1517-ball FCBGA package provides high signal density and excellent thermal performance via the flip-chip solder-bump array. Typical applications include 100G/40G optical transport networking line cards, software-defined radio (SDR) baseband processing, hardware-accelerated video processing (4K/8K broadcast), PCIe Gen3 accelerator cards, and high-performance industrial imaging systems. The integrated 14.1 Gbps transceivers eliminate the need for external SerDes in many connectivity applications. When designing with this device, plan PCB layout carefully: the 1.0 mm ball pitch FCBGA requires HDI stackup with microvia-in-pad technology, matched-length routing for the 28 Gbps-capable transceivers, and a substantial ground/power plane array beneath the package to support the multi-rail power distribution. Tool compatibility requires Intel Quartus Prime Pro Edition software. This page synthesizes distributor pricing, drop-in package-compatible alternatives within the Arria 10 family, and practical design notes not consolidated in the manufacturer datasheet.
10AX115R3F40I2SG - Arria 10 GX FPGA, 1.15M LE, F40 FCBGA | Intel
The Intel 10AX115R3F40I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) featuring 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O pins in a 1517-ball FCBGA (F40) package. It is the industrial-grade, -I2 speed-grade variant of the 10AX115 device family, offering a balanced trade-off of performance and power for mid-tier applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect fabric, and embedded resources such as transceivers, memory blocks, and DSP slices. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) → FPGAs → SRAM-based high-density FPGAs → SoC FPGAs with transceivers. Arria 10 devices represent Intel's mid-range FPGA family, positioned between low-power Cyclone and high-performance Stratix families, and are widely used in communications infrastructure, broadcast video, and high-performance computing. Key features of the 10AX115R3F40I2SG include 24 high-speed transceiver channels (up to 17.4 Gbps), hard memory controllers supporting DDR4 and DDR3, integrated PCI Express Gen3 hard IP blocks, and a hardened floating-point DSP architecture. The device also embeds variable-precision DSP blocks, partial reconfiguration support, and a 20-channel fabric clock network. The Arria 10 architecture uses TSMC's 20nm process, providing a favorable performance-per-watt profile versus prior-generation 28nm devices. The integrated transceivers, hard memory controllers, and PCIe Gen3 IP eliminate the need for soft IP implementations, freeing FPGA fabric for application logic. Typical applications include 4K/8K video processing and broadcast infrastructure, 100G/400G optical transport network line cards, 5G baseband processing, radar and electronic warfare front-ends, and high-performance test & measurement equipment. The high logic density and built-in 17.4 Gbps transceivers make it particularly suited for protocol bridging, packet processing, and high-throughput DSP applications. When designing with this device, ensure the F40 FCBGA land pattern matches Arria 10 family pin-compatible variants, plan power-rail sequencing for the 0.95V core and 1.2V transceiver supplies, and provide adequate PCB thermal dissipation for the high-density flip-chip BGA. This page synthesizes distributor pricing, drop-in alternatives within the same F40 FCBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
10AX115R4F40E3LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
The Intel / Altera 10AX115R4F40E3LG is a high-density Arria 10 GX field-programmable gate array (FPGA) integrating approximately 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O pins in a 1517-ball flip-chip BGA (FCBGA) package. The Arria 10 GX family combines a 20nm process technology with hardened transceivers and DSP blocks, delivering up to 28.05 Gbps transceiver data rates and 1.5 Tbps aggregate serial bandwidth for high-throughput compute, networking and video processing applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP slices, and hardened IP blocks such as transceivers and PCIe interfaces. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within integrated circuits, sitting alongside ASICs and ASSPs in the silicon design landscape. Unlike fixed-function ASICs, FPGAs are re-programmed in the field via HDL bitstreams, enabling rapid prototyping, hardware acceleration, and time-to-market advantages in compute-intensive designs. Key features of the 10AX115R4F40E3LG include 28.05 Gbps backplane-capable transceivers, hardened Gen3 PCIe x8 IP blocks, up to 1,518 18x19 multipliers in the variable-precision DSP blocks, and a 0.9V core voltage with on-chip voltage regulation. The device is built on TSMC's 20nm process and integrates 1.5 Tbps of serial bandwidth, making it suitable for 100G/400G datapath aggregation, broadcast video processing, and PCIe Gen3 accelerator cards. The 1517-ball FCBGA (also denoted F40) uses flip-chip packaging for superior signal integrity at multi-gigahertz speeds. The architecture combines a mid-range logic capacity with high-end serial transceivers, providing a balanced cost/performance profile for applications that need both parallel DSP throughput and high-speed serial I/O. Designers leverage the hardened Gen3 PCIe IP and the high-DSP-count fabric to accelerate signal-processing pipelines, while the embedded memory subsystem (68.8 Mbits) eliminates the need for external SRAM in many workloads. Typical applications include 100G/400G Ethernet line cards, broadcast Studio and 4K/8K video processing, military radar and electronic-warfare DSP, medical imaging accelerators, and high-performance compute (HPC) co-processors. The Arria 10 GX family is also widely deployed in 5G fronthaul/backhaul equipment and ASIC prototyping platforms. When designing with the 10AX115R4F40E3LG, plan the PCB stack-up carefully: the FCBGA-1517 package requires high-density interconnect (HDI) with micro-vias and matched impedance routing for the transceiver channels. Use Altera's Quartus Prime design suite for synthesis, place-and-route, and timing closure. Expect multi-month lead times due to the silicon wafer allocation cycle. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated on the official Altera/Intel product page.
10AX115R4F40E3SG - Arria 10 GX FPGA, 1.15M LE, F40, 1517-FCBGA | Intel
The Intel / Altera 10AX115R4F40E3SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, built on a 20 nm process and supplied in a 1517-pin FC-FBGA (F40) package. Per the verified web data, this device belongs to the Arria 10 GX family with 0.9 V core voltage, integrates 66 megabits of embedded memory, 342 DSP blocks, and supports up to 24 transceivers at 14.1 Gbps, delivering up to 1.5 TFLOPs of DSP throughput. An FPGA is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing to implement arbitrary digital functions. The Arria 10 GX family (Arria -> mid-range FPGA -> programmable logic -> semiconductor IC) is Intel's mid-to-high-end transceiver-rich family optimized for high-bandwidth signal processing, bridging the gap between Cyclone low-cost parts and Stratix high-performance parts. It supports serial transceivers up to 14.1 Gbps and hardened floating-point DSP blocks, making it a common choice for DSP-heavy applications. Key features of the 10AX115R4F40E3SG include up to 1,150,000 logic elements, 68,857,856 embedded memory bits, 342 user I/O pins, integrated PCI Express Gen3 hard IP blocks, and dual-core ARM Cortex-A9 hard processor system support in the SoC variants. The -3 speed grade is the highest commercial speed bin, while the F40 package is the 1517-pin flip-chip fine-pitch BGA. The R4 prefix denotes 24 transceivers at 14.1 Gbps with the 10/12.5 Gbps backplane profile, and E3 denotes the extended commercial temperature range with Pb-free packaging. Architecturally, the Arria 10 GX uses a monolithic 20 nm fabric with 14.1 Gbps transceivers, hardened Gen3 PCIe, and floating-point capable DSP blocks. The 1.15M-LE fabric provides ample capacity for multi-channel DSP pipelines, image processing pipelines, or 100G Ethernet MAC aggregation. Each DSP block can be configured as a single-precision floating-point multiplier or as multiple fixed-point multipliers. Typical applications include high-performance computing acceleration, ASIC prototyping, 100G Ethernet line cards, radar baseband processing, medical imaging, and 4K video broadcast equipment. The wide transceiver count suits multi-channel backplane or optical-module interfacing. A key design consideration for the 1517-FCBGA is PCB stack-up: the F40 package requires a high-density interconnect PCB with microvia build-up layers (typically a 10-12 layer stack-up with 1-2-1 or 1-2-1-2-1 microvia construction) to fan out the 1.0 mm pitch BGA. Thermal management requires a heatsink plus airflow for most workloads exceeding 30 W. Power estimation should be done with the Intel PowerPlay / Quartus Early Power Estimator before final board design. This page synthesizes distributor pricing, F40-package drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone datasheet, giving procurement and FPGA engineers a single reference for evaluation, sourcing, and PCB layout planning.
10AX115R4F40I3LG - Arria 10 GX FPGA, 1.15M LE, 342 I/O, 1517-FCBGA | Intel
The Intel 10AX115R4F40I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20 nm process, integrating approximately 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 general-purpose I/O lanes in a 1517-ball Fine-pitch Chip-Ball Grid Array (FCBGA) package. The device operates from a 0.9 V core supply and is rated for the industrial temperature range (-40 °C to +100 °C), making it suitable for harsh-environment embedded systems. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs are positioned between general-purpose microcontrollers (lower performance, fixed architecture) and ASICs (higher performance, non-recurring engineering cost, fixed function). Within the programmable logic hierarchy, the Arria 10 GX family targets mid- to high-end applications requiring a balance of logic density, transceiver bandwidth, and power efficiency - bridging the gap between Cyclone V/10 (low-cost) and Stratix 10 (high-performance). Key features of the 10AX115R4F40I3LG include up to 28.05 Gbps backplane-capable transceivers, hard PCI Express Gen3 hard IP blocks, hard memory controllers supporting DDR4/DDR3/QDRII+/RLDRAM3, up to 1,518 DSP blocks for fixed- and floating-point signal processing, and partial reconfiguration support. The 'GX' suffix denotes integrated 28 Gbps transceivers optimized for high-speed serial connectivity. The device supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, with optional encryption and dual-image boot for secure remote updates. Typical applications include high-performance digital signal processing (radar, beamforming, software-defined radio), 100G/400G Ethernet line cards, ASIC prototyping, medical imaging accelerators, and test & measurement backplanes. Designers pair the FPGA with external DDR4 memory, a flash configuration device (EPCQ-L), and a power management solution that meets Intel's PowerTree guidelines (typically using Intel Enpirion or Renesas ISL series regulators).
10AX115R4F40I3SG - Arria 10 GX FPGA, 1.15M LEs, 1517-FCBGA | Altera
The Altera 10AX115R4F40I3SG is a member of the Arria 10 GX FPGA family, integrating approximately 1,150,000 logic elements, 68,857,600 bits of embedded memory, and a 20 nm process core in a 1517-ball FCBGA package. Operating from a 0.9 V core supply and engineered for industrial temperature environments, this 10AX115 device variant is positioned for mid- to high-density digital signal processing, high-throughput data-path acceleration, and serial-link aggregation applications. The part number decodes as follows: 10AX = Arria 10 GX family, 115 = 1.15 M logic elements, R4 = speed/temperature grade, F40 = 1517-ball F40 FBGA package, I3 = industrial temperature range, S = lead-free, G = RoHS-compliant. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality, interconnect, and I/O behavior are defined by configuration memory rather than fixed mask interconnect, enabling post-fabrication reprogramming. FPGAs sit in the broader taxonomy of programmable logic devices alongside CPLDs, and are widely used for parallel compute pipelines, hardware-accelerated networking, ASIC prototyping, and embedded DSP. Within Intel PSG (formerly Altera) lineups, Arria 10 GX sits between the lower-cost Cyclone series and the high-end Stratix family, offering mid-tier logic density with integrated transceivers and hard IP blocks. Key features include 342 user I/O pins, embedded DSP blocks with hardened floating-point support, up to 24 transceiver channels supporting multi-gigabit serial protocols, distributed and M20K block RAM, partial reconfiguration support, and PCI Express hard IP. The device is hardened with variable-precision DSP blocks, allowing efficient implementation of FFTs, FIR filters, and matrix-multiply operations directly in fabric. The integrated transceivers reach data rates suitable for 10 GbE, 40 GbE, PCIe Gen2/Gen3, and backplane interconnect, eliminating the need for external PHYs in many designs. Typical applications for the 10AX115R4F40I3SG include radar signal processing in defense systems, 4K video broadcast equipment, medical imaging accelerators, base-station baseband, and ASIC emulation/prototyping platforms. The wide logic capacity and high I/O count make it well-suited to designs requiring parallel pipelines with hundreds of channels of I/O bandwidth. The 1517-ball FCBGA package provides ample signal escape routing for high-density board layouts, typically requiring high-layer-count PCBs. When designing with this device, ensure proper power-rail sequencing across the 0.9 V core and auxiliary supplies, follow Intel's pinout and signal-integrity guidelines for the F40 package, and verify Quartus Prime device support for the I3 industrial temperature grade. Designers should also consider using the Intel Transceiver Toolkit for high-speed serial link validation. This page synthesizes distributor pricing, drop-in same-family Arria 10 alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.
10AX115S1F45E1SG - Arria 10 GX 1150K LE FPGA | Intel | 1932-BGA
The Intel (Altera) 10AX115S1F45E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/O in a 1932-ball FCBGA package with a -1 speed grade and industrial temperature rating. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, configurable interconnect, and dedicated hard IP blocks. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> semiconductors, sitting between ASICs (Application-Specific Integrated Circuits, which offer higher density/perf at higher NRE) and microcontrollers (which execute sequential code rather than implement parallel hardware). The Arria 10 family is Intel's mid-range 20 nm FPGA line optimized for high-throughput transceiver, DSP, and partial-reconfiguration applications. The 10AX115S1F45E1SG variant delivers 1,150,000 logic elements (LEs), approximately 53 Mbits of M20K embedded SRAM, 624 general-purpose I/O pins, and integrated 12.5 Gbps transceivers along with hard PCI Express Gen3 and DDR4 memory controller IP blocks. The device operates from a 0.9 V core supply with on-chip voltage regulation, supports up to 2 GB of DDR4 SDRAM through hardened memory controllers, and integrates hardened floating-point DSP blocks capable of up to 1.5 TFLOPS. The F45 package designation indicates a 45 mm FCBGA with 1932 balls in a 1.0 mm pitch. The Arria 10 GX architecture combines a 20 nm TSMC process, an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, variable-precision DSP blocks, and a hardened partial reconfiguration controller. This combination enables hardware-accelerated signal processing at lower power per operation than previous-generation 28 nm FPGAs, with typical designs achieving 30-50% lower dynamic power at equivalent throughput. Typical applications include high-performance digital signal processing (radar, software-defined radio, beamforming), 100G/400G Ethernet packet processing, video broadcast and 8K display processing, ASIC prototyping, and PCIe Gen3 accelerator cards. The integrated 12.5 Gbps transceivers and hardened PCI Express Gen3 hard IP make the 10AX115S1F45E1SG particularly well-suited for applications requiring high-bandwidth serial I/O without consuming soft logic resources. When designing with this FPGA, ensure the PCB has a 1.0 mm pitch BGA land pattern with adequate breakout routing for the 1932 balls, and provision multiple low-noise power rails (0.9 V core, 1.8 V/2.5 V/3.3 V auxiliary). Use Intel Quartus Prime for synthesis and place-and-route; the device is supported by Quartus 16.0 and later. Designers should also budget for thermal management: at typical workloads, the F45 package can dissipate 25-40 W requiring forced-air cooling. This page synthesizes distributor pricing, drop-in Arria 10 alternatives, application notes, and PCB design considerations that go beyond the manufacturer datasheet summary.
10AX115S1F45I1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel 10AX115S1F45I1SG is an Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,560 bits of embedded memory, and 1560 18x19 multipliers inside a 1932-ball FCBGA (F45) package, manufactured on a 20 nm process and supplied from a 0.9 V core rail. It is configured by Ordering Part Number suffix 'S1' (transceiver count), 'F45' (1932-ball package), 'I1' (industrial speed grade), and 'SG' (lead-free RoHS). The 'GX' suffix denotes hardened 14.1 Gbps transceivers and is intended for high-bandwidth serial connectivity. A Field-Programmable Gate Array (FPGA) is a reprogrammable digital integrated circuit whose logic and routing are defined by user-supplied configuration bitstreams, allowing hardware to be re-architected per use case. FPGAs sit within the broader hierarchy: programmable logic -> ASIC prototyping -> accelerator silicon -> semiconductor. The Arria 10 family targets mid-range applications that need DSP/FPGA integration with transceivers, bridging between low-cost Cyclone parts and high-end Stratix devices. Key features include 624 general-purpose I/Os, 1560 DSP blocks (18x19), embedded Hard IP for PCI Express Gen3 and 10/40/100 GbE, 14.1 Gbps transceivers, and Hard Memory Controllers for DDR4 with ECC. The 1932-ball FCBGA at 1.0 mm ball pitch is intended for top-tier PCBs with high-density escape routing. Arria 10 GX combines a mid-density programmable fabric with hardened serial interfaces and memory controllers, balancing flexibility against power efficiency. Its transceiver and PCIe Gen3 hard IPs shorten time-to-protocol-compliance for telecom and broadcast designs. Typical applications include 100G optical transport, military radar baseband processing, medical imaging accelerators, ASIC prototyping, and high-performance DSP pipelines. Designers should follow Intel's Arria 10 layout guidelines, including matched-length serial lanes, decoupling on every transceiver supply pin, and pin migration across SX/AX/ST variants when planning second-source. This page consolidates distributor pricing, same-package Arria 10 drop-in alternatives, and PCB/thermal design guidance not found in the standalone datasheet.
10AX115S2F45E1SG - Arria 10 GX 1150K LE FPGA, 624 I/O, F45 | Altera
The Altera (Intel) 10AX115S2F45E1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/Os in a 1932-ball FCBGA package. Speed grade -2 and temperature grade E1 place it in the extended-temperature, mid-speed tier of the Arria 10 GX family, with transceivers up to 17.4 Gbps. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric, block RAM, DSP blocks, and high-speed transceivers are configured by the user after manufacture. FPGAs sit at the same hierarchy tier as ASICs but offer post-silicon flexibility, making them ideal for prototyping, low-volume production, and designs where standards or algorithms evolve. The Arria 10 GX family adds hardened floating-point DSP and PCI Express Gen3 hard IP, placing it between the lower-cost Cyclone series and the high-end Stratix family. Key features include 1,150,000 logic elements, 68.86 Mbits embedded RAM, 1,518 variable-precision DSP blocks, 24 transceivers at up to 17.4 Gbps, and 4 PCIe Gen3 hard IP blocks. The 1932-ball FCBGA uses a 45x45 mm substrate optimized for high-speed signal integrity. Hard memory controllers support DDR4 up to 2400 Mbps and QDR4/RLDRAM3, while the security features include bitstream encryption and JTAG protection. The Arria 10 architecture combines a 20 nm process with a dual-register adaptive logic module (ALM) for high logic utilization, plus hardened floating-point DSP that delivers up to 1.5 TFLOPS peak. Transceiver tiles support backplane, chip-to-chip, and optical interfaces including CPRI, 10G/40G Ethernet, and 12G SDI, making the family uniquely capable of bridging wired telecom, broadcast, and DSP pipelines. Typical applications include 100G/40G Ethernet line cards, radar and electronic warfare beamformers, professional 4K/8K video processing, test and measurement instrumentation, and PCI Express Gen3 acceleration cards. The integrated transceivers and DSP throughput position the device for protocols where software-defined radio or wire-speed processing is required. When designing with this device, ensure the Quartus Prime power estimator (Early Power Estimator or PowerPlay) is run early, since -2 speed grade and 17.4 Gbps transceivers create significant thermal load. Use the Arria 10 GX Transceiver Signal Integrity Development Kit footprint patterns as starting references for the 1932-ball FCBGA layout. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster way to validate supply and compare options for the Arria 10 GX family.
10AX115S2F45E2LG - Arria 10 GX FPGA 1150K LE, 624 I/O | Altera
The Altera (Intel) 10AX115S2F45E2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) fabricated on a 20 nm process, offering 1,150,000 logic elements, 68,857,600 bits of embedded memory, and 624 user I/O pins housed in a 1932-ball FCBGA package. Operating from a 0.9 V core supply with industrial-grade temperature support, it targets mid-to-high-end programmable logic designs that demand high throughput transceivers, large on-chip RAM, and substantial DSP bandwidth in a single device. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that can be configured by the designer to implement custom digital circuits. Within the broader taxonomy, the Arria 10 family sits between the lower-power Cyclone series and the high-performance Stratix series, delivering an optimal balance of transceiver speed, logic density, and power efficiency for applications such as wireless baseband, broadcast video, and high-performance industrial imaging. The GX variant specifically integrates 28.05 Gbps-capable transceivers optimized for backplane and chip-to-chip serial links. Key features include 1,150,000 logic elements (LEs), 68,857,600 embedded memory bits, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 28.05 Gbps multi-gigabit transceivers, and hard PCIe Gen3 / Gen4 IP cores. The 1932-ball FCBGA package exposes 624 general-purpose I/Os plus high-speed serial lanes, supporting parallel memory interfaces (DDR4/QDRIV+) and external flash configuration. The industrial-grade speed grade (-2) and extended temperature screening (E2) make the part suitable for thermally and electrically demanding deployments. The 20 nm SoC-style architecture integrates ARM-based hard processor system support alongside programmable fabric, simplifying mixed control-and-payload designs. Hard memory controllers, hardened floating-point DSP blocks, and partial reconfiguration support reduce power per operation while accelerating time-to-market for algorithmic workloads. The Arria 10 family is widely used in defense, test & measurement, and medical imaging where deterministic throughput matters. Typical applications include 100G/400G optical transport, software-defined radio, high-frame-rate video processing, ASIC prototyping, and PCI Express acceleration cards. Designers also deploy it in radar, EW, and high-energy physics data acquisition. The wide transceiver count and large memory subsystem allow multiple high-bandwidth data paths to coexist without external bridging. When designing with this device, follow Intel's power-thermal-PCB guidance for FCBGA-1932 packages: provide a symmetrical via array under the package, multiple decoupling capacitors near each power rail, and use the Quartus Prime toolchain with the Arria 10 device family libraries for synthesis and timing closure. Plan configuration scheme (active serial, fast passive parallel) before board layout. This page synthesizes distributor availability, real-time pricing, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path from concept to qualified BOM.
10AX115S2F45E2SG - Arria 10 GX 1.15M LE FPGA, 28.05 Gbps | Intel
The Intel 10AX115S2F45E2SG is a high-density Arria 10 GX field-programmable gate array (FPGA) built on 20 nm process technology, providing 1,150,000 logic elements and up to 28.05 Gbps transceivers in a 1932-ball FC-FBGA (F45) package. The device integrates 68,857,856 embedded memory bits, 1,518 embedded 18x19 multipliers, and 624 user I/O pins, with a hardened 32-bit ARM Cortex-A9 MPCore hard processor subsystem variant in the SoC class and a programmable 14.2 Gbps serial transceiver fabric. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnects, and dedicated hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs and ASICs, and the Arria 10 family occupies Intel's mid-range position between the lower-power Cyclone series and the high-performance Stratix 10 family. The Arria 10 GX adds integrated transceivers supporting backplane, chip-to-chip, and optical-module interconnect. Key features of the 10AX115S2F45E2SG include 1.5 GHz maximum core fabric performance, 1,518 hardened 18x19 multipliers (2,268 18x18 equivalents) supporting IEEE 754 single-precision floating-point via the Variable Precision DSP block, and 24 transceivers at up to 28.05 Gbps per channel. The 1932-ball FC-FBGA package supports high-density board designs and exposes 624 general-purpose I/Os plus dedicated configuration, clock, and JTAG pins. Two on-chip PCIe Gen3 hard IP blocks support x1/x2/x4/x8 lane configurations. The 10AX115S2F45E2SG uses TSMC's 20 nm planar process with Intel's Adaptive Logic Module (ALM) architecture, in which each ALM contains eight-input fracturable look-up-tables with adaptive register allocation. The device integrates 4 fractional PLLs, 8 I/O PLLs, and up to 28.05 Gbps serial transceivers with adaptive equalization and pre-emphasis. Hard memory controllers support DDR4, DDR3, QDR II+, and RLDRAM 3 with optional ECC. Typical applications include 100G optical transport network line cards, 4K broadcast video processing and display walls, ASIC prototyping in the data center, high-performance computing (HPC) fabric bridges, PCIe Gen3 accelerator cards, and 100G Ethernet MAC/PHY bridging. The Arria 10 GX family is also widely deployed in radar signal processing for military and aerospace applications where high logic density and DSP throughput are required. When designing with this device, follow Intel's Arria 10 GX PCB design guidelines for the F45 package: route all 12 transceiver channels in matched-length differential pairs with controlled 100-ohm differential impedance, provide solid GND stitching vias adjacent to each high-speed signal via, and pair each transceiver with a dedicated 100-ohm AC-coupling capacitor. Use the Quartus Prime Pin Planner to validate pin assignments against the F45 ball-grid map before tape-out, and leverage Intel's Transceiver Toolkit for in-system signal-integrity verification. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Arria 10 GX family, and practical PCB design notes that are not consolidated in any single manufacturer document.
10AX115S2F45I2LG - Arria 10 GX 1150K LE FPGA, 1932-FCBGA | Intel
The Intel 10AX115S2F45I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) from Intel's 20 nm product family, offering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/O pins in a 1932-ball Flip-Chip BGA (FCBGA) package. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured after manufacture. The Arria 10 family sits in the mid-range of Intel's FPGA portfolio between the lower-power Cyclone series and the high-performance Stratix series, balancing logic density, transceiver bandwidth, and DSP capability for cost-sensitive applications that still demand high throughput. Key features include 1,150,000 logic elements (LE), 68.86 Mbits of embedded block RAM (eMLABs + M20K combined), up to 624 general-purpose user I/O, integrated 28.05 Gbps transceivers supporting protocols such as PCIe Gen3 x8, 10/40/100 Gigabit Ethernet, Interlaken, and CPRI, plus dedicated variable-precision DSP blocks for high-throughput fixed- and floating-point arithmetic. The device integrates dual ARM Cortex-A9 hard processor cores enabling embedded system-on-chip designs without an external CPU. The 10AX115S2F45I2LG is built on TSMC's 20 nm process and uses a flip-chip BGA substrate for high pin-count signal integrity. The "2" speed grade and "I2" industrial temperature range (-40C to +100C ambient) make this part a common choice for designers needing industrial-grade operation with mid-speed timing closure. The F45 designation identifies the 45 mm body FCBGA with the specific ballmap variant. Typical applications include high-speed wireline communications, 100G optical transport platforms, radar and electronic warfare digital signal processing, test and measurement equipment with high channel density, and broadcast video infrastructure. The integrated transceivers also suit PCIe Gen3 host cards and accelerator cards in data-center workloads. When designing with the 10AX115S2F45I2LG, ensure the PCB supports the 45 mm FCBGA land pattern with the correct via-in-pad or dog-bone fanout, and follow Intel's Arria 10 PCB layout guidelines for power distribution network decoupling and transceiver channel routing. This page consolidates real-time distributor pricing, parametric drop-in alternatives, and PCB design notes not available on any single manufacturer datasheet, helping engineers compare sourcing options and design headroom at a glance.
10AX115S2F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Altera
The Altera (Intel) 10AX115S2F45I2SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/Os, housed in a 1932-ball FCBGA package. Built on a 20nm process, the device integrates up to 24 transceiver channels supporting data rates up to 14.1 Gbps, a hard memory controller, and a dual-core ARM Cortex-A9 MPCore hard processor subsystem on selected Arria 10 variants. The 'S2' speed grade, 'F45' package code, industrial temperature grade ('I2'), and 'G' lead-free RoHS suffix are decoded directly from the order string per the Altera ordering guide. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be rewired after manufacture to implement arbitrary digital functions. FPGAs occupy the top tier of the digital semiconductor family tree: programmable logic -> logic IC -> integrated circuit, sitting between fixed-function ASICs and software-defined microcontrollers in flexibility vs unit-cost trade-off. The Arria 10 family targets mid-range, transceiver-rich designs balancing logic capacity, DSP throughput, and power efficiency. Key features of the 10AX115S2F45I2SG include 1,150,000 logic elements, 68,857,856 bits (8,557,232 bytes) of embedded SRAM, 624 user I/O pins routed across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and high-speed serial protocols, and 24 transceiver channels rated up to 14.1 Gbps for protocols such as PCIe Gen3 x8, 10GbE, CPRI, and SATA. The device also integrates 1,518 DSP blocks for fixed- and floating-point signal processing, a hard memory controller supporting DDR4, DDR3, QDR IV, and RLDRAM III, and fractional PLLs with on-chip oscillators. The Arria 10 GX architecture is built on TSMC's 20nm low-power process with a monolithic die that combines a logic fabric, embedded transceivers, and hardened IP blocks, reducing power by up to 40% compared to the previous 28nm Stratix V generation. Per the Altera product page, the 10AX115S2F45I2SG is qualified for industrial temperature range (-40C to +100C for case, depending on usage), supports JTAG boundary-scan and configuration via fast passive parallel, active serial, or JTAG interfaces, and is pin-compatible within the Arria 10 GX F45 package family. Typical applications include high-performance digital signal processing in radar and beamforming systems, 10G/40G Ethernet aggregation switches, PCIe Gen3 accelerator cards, software-defined radio base stations, video broadcast and encoding platforms, and test-and-measurement instrumentation. The wide transceiver bandwidth also suits FPGA prototyping of ASIC designs and high-throughput medical imaging systems. Industrial-grade qualification makes the 10AX115S2F45I2SG suitable for harsh-environment deployments. When designing with this device, ensure the PCB BGA land pattern matches the 1932-ball FCBGA footprint exactly and that the stackup supports the transceiver channel requirements (typically 6-8 layers with controlled-impedance routing). Thermal management is critical - the 0.9V core can dissipate significant power at full transceiver utilization, and a heatsink or cold-plate interface to the top of the package is typically required. The Quartus Prime design suite must be licensed to generate bitstreams for this device family. This page consolidates distributor pricing for the 10AX115S2F45I2SG, drop-in compatible alternatives within the Arria 10 family and competitor equivalents, and engineering design notes not aggregated in any single manufacturer document.
10AX115S3F45E2LG - Arria 10 GX 1150K LE FPGA | Intel | 1932-FCBGA
The Intel (formerly Altera) 10AX115S3F45E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20 nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/O in a 1932-ball FCBGA package (speed grade -2, F45 footprint, 0.9 V core). It is the Extended-temperature, lead-free, RoHS-compliant variant of the 10AX115 Arria 10 GX family, intended for high-throughput transceiver-based designs. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic, interconnect, I/O, and DSP blocks are configured by the customer after manufacture. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and combine parallel hardware fabric, embedded memory blocks, DSP slices, and (in the Arria 10 GX case) multi-gigabit transceivers, allowing a single device to implement functions that would otherwise require multiple ASICs, processors, and serializer/deserializer chips. The Arria 10 GX family in particular targets mid-range transceiver-heavy applications between Cyclone V and Stratix 10. Key features of the 10AX115S3F45E2LG include up to 28.05 Gbps backplane-capable transceivers, hardened floating-point DSP blocks, partial reconfiguration, and dedicated PCIe Gen3 hard IP blocks. The 1932-ball FCBGA package supports the full -2 extended temperature range while exposing the device's high I/O count and transceiver channels needed for parallel processing and serial connectivity. Architecturally, the Arria 10 GX device uses a 20 nm SoC-style fabric with hard ARM-friendly memory controllers and high-speed serial interface tiles. The 10AX115 tier is the high-density variant, providing roughly 1.15 M logic elements with the standard transceiver-to-logic ratio, optimized for data-pipeline, video, and digital-signal-processing workloads where both serial bandwidth and parallel compute matter. Typical applications include high-speed video broadcast equipment, medical imaging, 4K/8K video processing, test and measurement instruments with embedded FPGA data acquisition, and mid-range wireless baseband pre-processing. Designers choose the 10AX115S3F45E2LG when they need the high logic capacity and transceiver bandwidth of Arria 10 GX but in the lower-cost -2 speed grade rather than the fastest -1 grade. When designing with this device, pay close attention to PCB stackup, transceiver channel routing, and power delivery: Arria 10 devices require multiple voltage rails (typically 0.9 V core, 1.1 V auxiliary, and 1.8 V I/O) with strict sequencing. Reference Intel's Arria 10 GX Device Design Guidelines and the Arria 10 Transceiver PHY User Guide for power-tree and signal-integrity recommendations. This page synthesizes distributor pricing, qualified same-footprint drop-in alternatives from the Arria 10 family, and design notes not found in the manufacturer datasheet, helping engineers source, substitute, and validate the 10AX115S3F45E2LG for new and existing designs.
10AX115S3F45E2SG - Arria 10 GX 1150K LE FPGA, 28nm, F45 | Intel
The Intel (formerly Altera) 10AX115S3F45E2SG is an Arria 10 GX family Field-Programmable Gate Array (FPGA) built on TSMC's 20nm process, integrating approximately 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/Os into a 1932-ball FCBGA package with -2 speed grade and -40C to +100C extended operating temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than at the factory. FPGAs sit at the top of the programmable logic device (PLD) hierarchy alongside CPLDs and are widely deployed for parallel DSP pipelines, custom high-speed interfaces, and ASIC prototyping. The Arria 10 GX family targets mid-range applications that require both high logic density and integrated transceivers at lower cost than Stratix-class parts. Key features of the 10AX115S3F45E2SG include 1,150,000 logic elements (LEs), 68.86 Mbits of embedded SRAM, 1,518 embedded DSP blocks (18x19 multipliers), up to 24 high-speed transceiver channels at up to 17.4 Gbps (chip-to-chip and backplane capable), and hard PCI Express Gen3 x8 IP cores. The 'S' suffix indicates transceivers with the highest speed bin, while 'F45' denotes the 1932-ball flip-chip BGA package with 45mm row pitch and lead-free RoHS-compliant balls. Architecturally, Arria 10 GX uses a coherent 20nm monolithic fabric combined with hardened protocol IP blocks for PCIe, memory controllers, and serial transceivers. The hard IP approach reduces power by up to 40% and die area by 30% compared to soft implementations. The fabric contains Adaptive Logic Modules (ALMs), M20K memory blocks, and variable-precision DSP blocks that can be cascaded to support IEEE 754 single-precision floating-point at full DSP block rate. Typical applications include 4K UHD video broadcast and pro-AV equipment, 100G/400G optical transport networking line cards, radar and electronic-warfare signal processing, military secure communications, medical imaging accelerators, and ASIC prototyping platforms. The combination of high logic density and 17.4 Gbps transceivers makes it particularly suitable for bandwidth-intensive DSP and packet-processing workloads. Designers should budget for the 1932-ball FCBGA which requires a multi-layer PCB with microvia and HDI stack-up. Power estimation requires Intel's PowerPlay or Early Power Estimator tools, and the device supports both core and transceiver power rails that must be sequenced per the datasheet. Configuration can be done via JTAG, serial flash, or PCI Express. This page synthesizes distributor pricing, drop-in same-package alternatives, parametric comparisons, and practical design notes that go beyond the manufacturer datasheet to support faster design-in and sourcing decisions.
10AX115S3F45I2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Altera (Intel)
The Altera (Intel) 10AX115S3F45I2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) in the 1932-ball FCBGA package, fabricated on a 20 nm process. The device integrates 1,150,000 logic elements, 68,857,600 bits of embedded memory, and 624 user I/O pins, and is rated for the industrial temperature grade. Arria 10 GX devices belong to the mid-range, transceiver-rich FPGA family in Intel's programmable-logic portfolio. Architecturally, an Arria 10 GX combines a hardened 28 Gbps-capable transceiver array, variable-precision DSP blocks, and on-chip memory into a single die, enabling designers to implement high-bandwidth signal processing, backplane aggregation, and protocol bridging in a single chip. The Arria 10 family sits between the lower-cost Cyclone/MAX families and the high-end Stratix family in the Intel FPGA hierarchy. Key features of the 10AX115S3F45I2LG include: 1,150,000 logic elements for parallel data-path implementation; 68.86 Mb of embedded memory for packet buffering and lookup tables; up to 624 user I/O for wide memory-channel or backplane connectivity; on-die 14.1 Gbps / 28.05 Gbps-capable transceivers for PCIe Gen3, 10G/40G Ethernet, and CPRI; and hard memory controllers and variable-precision DSP blocks that reduce soft-logic overhead and power. The part is built on a TSMC 20 nm process and uses a 0.9 V core supply. The 'F45' suffix indicates the 45 mm x 45 mm package body. The 'S3' suffix denotes the speed grade 3, while 'I2' indicates the industrial temperature grade and 'LG' denotes lead-free RoHS-compliant packaging. Designers should consult the official Arria 10 datasheet for transceiver counts, PLL counts, PCIe hard IP availability, and exact I/O bank breakdown for this OPN. Typical applications include high-speed serial backplane aggregation, 100G/40G Ethernet line-card prototyping, radar and EW signal processing, 4K/UHD video processing, ASIC prototyping, and PCIe Gen3 root-complex or endpoint designs. When designing with this device, pay particular attention to PCB stack-up, transceiver channel length matching, and thermal management - the 1932-ball FCBGA package has a high pin count and significant power dissipation under load. Use Intel Quartus Prime to compile, simulate, and place-and-route the device, and follow Intel's Arria 10 hardware-design guidelines for power-rail sequencing and PCB layout. This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design considerations not found in the manufacturer datasheet.
10AX115S3F45I2SG - Arria 10 GX FPGA 1150K LE, 1932-FCBGA | Intel
The Intel / Altera 10AX115S3F45I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 maximum user I/O pins, fabricated on a 20 nm process and housed in a 1932-ball FC-BGA package measuring 45 x 45 mm. It integrates up to 1,150,000 logic elements along with 24 transceivers operating up to 14.1 Gbps and 4 hard memory controllers, targeting mid-to-high-end programmable logic designs. An FPGA is a reprogrammable integrated circuit whose logic fabric, interconnect, block RAM, DSP blocks, and I/O can be configured by the user after manufacture. FPGAs sit above general-purpose microcontrollers in performance and below ASICs in unit cost, making them the standard choice for prototyping, low-volume production, and designs requiring hardware-level parallelism. The Arria 10 GX family specifically targets applications that combine high-speed serial transceivers, moderate logic density, and hard floating-point DSP blocks. Key features include 1,150,000 logic elements, 24 high-speed transceivers with data rates up to 14.1 Gbps (suitable for PCIe Gen3 x4, 10 GbE, and CPRI), dual-core ARM Cortex-A9 hard processor subsystem options in the SoC variants, 8-input adaptive logic modules (ALMs), 1,728 18x19 multipliers, and 24 fractional PLLs. The device is rated for industrial temperature operation (-40C to +100C) and supports both 0.85 V core and 0.9 V core voltage options. Hard memory controllers support DDR3, DDR4, QDR IV, and RLDRAM III external memories. The Arria 10 architecture uses a heterogeneous fabric combining ALMs, M20K block RAM blocks, DSP blocks with hard IEEE 754 floating-point support, and a routing interconnect optimized for timing closure. The transceiver tiles are physically distributed for signal integrity at multi-gigabit speeds, and the device includes hardened PCIe Gen3 IP blocks plus 100 GbE MAC and Reed-Solomon FEC cores in the higher-tier Arria 10 variants. Typical applications include 4K video broadcast equipment, 100G OTN line cards, radar and electronic warfare signal processing, 5G baseband processing, medical imaging accelerators, high-performance computing (HPC) inference engines, test and measurement instrumentation, and ASIC prototyping. The 14.1 Gbps transceivers also support CPRI for 4G/5G fronthaul and 10 GbE backhaul aggregation. When designing with the 10AX115S3F45I2SG, plan the PCB stack-up for the FC-BGA1932 package - typically a high-layer-count board (12+ layers) with microvia construction is required to escape the dense 1 mm pitch BGA. Power sequencing must follow the Intel / Altera Arria 10 power management guidelines; use a dedicated sequencer IC such as the LTC2974 or equivalent to ramp the 0.85 V core, 1.8 V I/O, and auxiliary rails in the correct order. Always refer to the official Intel Arria 10 datasheet and pin connection guidelines. This page synthesizes distributor pricing, same-package (1932-FCBGA) same-family alternatives within the Intel FPGA portfolio, and practical design notes not found in a single distributor listing.
10AX115S4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel 10AX115S4F45E3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on a 20 nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/Os in a 1932-ball FCBGA package measuring 45 x 45 mm. Speed grade -3 (E3) indicates an extended-temperature industrial device positioned in the middle of the Arria 10 GX speed tier for balanced performance and power efficiency. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, transceivers, and routing resources that can be electrically reconfigured post-manufacture to implement custom digital logic, signal-processing pipelines, or hardware accelerators. FPGAs belong to the broader category of programmable logic devices, sitting between general-purpose microcontrollers and fixed-function ASICs in the design-flexibility vs. unit-cost spectrum, and they are widely deployed in networking, video processing, prototyping, and compute-acceleration workloads. The Arria 10 GX family delivers up to 96 integrated transceivers operating at 17.4 Gbps (chip-to-chip) and 12.5 Gbps (backplane), hardware floating-point DSP blocks rated at up to 1.5 TFLOPS, a hardened memory controller, and partial reconfiguration support. The 'S' suffix in 10AX115S4F45E3LG denotes a transceiver-rich variant that also incorporates PCIe Gen3 hard IP blocks, making it suitable for heterogeneous systems combining high-speed serial links with parallel processing. Operationally, the device uses a 0.9 V core supply with separate rails for transceivers and I/O banks supporting LVDS, LVCMOS, and DDR3/4 memory interfaces. Compared with the prior Arria V and Stratix V generations, Arria 10 offers roughly 2x the DSP performance per watt and a more integrated hardened protocol stack. Typical applications include 4K/8K video processing, broadcast infrastructure, 100G/400G networking line cards, radar and DSP front-ends, and ASIC prototyping. When designing with this FPGA, thermal management is critical because of its 624 I/O and 1.15M LE density; a multi-layer PCB with at least 1 oz copper pours and forced-air cooling is recommended. Quartus Prime is the primary toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, lead-time information, drop-in alternative part numbers, and practical PCB and thermal design notes not found in the manufacturer datasheet. XAIPART cross-references the entire 10AX115 Arria 10 GX family to help engineers choose the right speed grade, temperature grade, and pin-compatible variant for their design.
10AX115S4F45E3SG - Arria 10 GX 1150K LE FPGA, 624 I/O FCBGA-1932 | Intel
The Intel (formerly Altera) 10AX115S4F45E3SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on a 20nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 624 user I/O into a 1932-ball FCBGA package. It operates from a 0.9V core supply and targets data-path acceleration, high-throughput DSP, and transceiver-based connectivity applications. As an Arria 10 GX family member, it includes hardened 14.1 Gbps transceivers and variable-precision DSP blocks, distinguishing it from the Arria 10 GT (28.3 Gbps) and Arria 10 SX (embedded HPS) variants. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP slices, block RAM, and modern variants additionally include high-speed transceivers and hard processor subsystems. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuits hierarchy: PLD -> FPGA -> high-end SoC FPGA. Unlike an ASIC, an FPGA can be reconfigured in the field, enabling rapid prototyping, hardware versioning, and time-to-market advantages in communications infrastructure, defense, and industrial imaging. Key features of the 10AX115S4F45E3SG include 1,150,000 logic elements (LEs), 68.86 Mbit embedded RAM, a generous DSP slice population, and integrated transceivers supporting protocols such as PCI Express Gen3, 10GbE, Interlaken, and CPRI. The FCBGA-1932 package provides high signal/IO density for line-card designs. The 'S' speed grade, 'F45' package designator (45mm FCBGA), 'E3' (commercial, -40C to +100C junction, lead-free RoHS), and 'SG' (RoHS compliant) ordering suffix are decoded in the Arria 10 device handbook. Architecturally, the Arria 10 GX core fabric uses adaptive logic modules (ALMs), 20 Kbit M20K block RAM blocks, and variable-precision DSP blocks capable of fixed-point, floating-point, and AI inference workloads. Transceiver channels support data rates up to 14.1 Gbps with adaptive equalization suitable for backplane and optical modules. Hard IP for PCIe Gen3 x8 and 10GbE reduces soft-logic footprint and power. Typical applications include 100G/200G line-card processing, radar and electronic-warfare DSP pipelines, medical imaging accelerators, ASIC prototyping, and high-performance test & measurement. Designers choose this part when 14.1 Gbps transceiver bandwidth and large logic capacity are required without moving to a 28 Gbps Arria 10 GT. When designing with this device, plan thermal management carefully: the 1932-ball FCBGA typically requires a heatsink and forced-air cooling for sustained operation. Validate signal-integrity of high-speed serial links using Intel's Transceiver Toolkit, and adhere to the FPGA's power-up sequencing requirements documented in the Arria 10 handbook. This page synthesizes distributor pricing, drop-in package equivalents within the Arria 10 family, and PCB thermal guidance not collected in any single datasheet chapter.
10AX115S4F45I3LG - Arria 10 GX FPGA 1150K LE | Intel
The Intel (Altera) 10AX115S4F45I3LG is a high-performance Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 RAM bits, and 624 user I/O pins, housed in a 1932-ball FBGA (F45) package. It operates at a core voltage of 0.9V and is fabricated on a 20nm process technology, delivering industry-leading performance and power efficiency for demanding applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits above CPLDs in complexity and capability. They consist of configurable logic blocks, programmable interconnects, and I/O blocks, allowing designers to implement complex digital systems without the high NRE costs of ASICs. FPGAs are widely used in prototyping, high-performance computing, and applications requiring hardware flexibility. The 10AX115S4F45I3LG features 1,150,000 logic elements, 68,857,856 RAM bits, and 624 user I/O pins. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The device includes 96 transceivers capable of up to 17.4 Gbps, making it suitable for high-bandwidth communication systems. The 20nm process technology ensures low power consumption while maintaining high performance. This FPGA is part of the Arria 10 GX family, which integrates a hard processor system (HPS) with dual-core ARM Cortex-A9, enabling system-on-chip (SoC) designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down. It also features advanced security features including AES bitstream encryption and tamper detection. Typical applications include high-performance computing, data center acceleration, 100G optical transport, radar and electronic warfare systems, and broadcast video processing. The 624 user I/O pins and 96 transceivers provide ample connectivity for complex system integration. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (0.9V core, 1.8V, 2.5V, 3.3V) and a robust power distribution network. Adequate cooling is essential due to the high power dissipation of large FPGAs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the 10AX115S4F45I3LG.
10AX115U1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel 10AX115U1F45E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,560 memory bits, and 480 user I/Os in a 1932-ball FCBGA (45 x 45 mm) package. Built on a 20 nm process, this Arria 10 GX variant supports up to 14.4 Gbps transceiver data rates for high-bandwidth serial interconnect. What is a FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O routing are defined after manufacture via a hardware description language and configuration bitstream. FPGAs sit between fixed-function ASICs and software-driven CPUs in the programmable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The Arria 10 GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceiver bandwidth, and power efficiency. Key features of the 10AX115U1F45E1SG include 1,150,000 logic elements, 68,857,560 embedded memory bits, 427,200 adaptive logic modules (ALMs), and 480 user I/Os supporting multiple I/O standards. The device integrates up to 24 transceivers capable of 14.4 Gbps, embedded DSP blocks for fixed‑ and floating‑point signal processing, and a Hard Processor System option via external host CPU. Configuration is via SRAM-based volatile bitstream with AES-256 encryption support. Architecturally, the Arria 10 GX fabric uses 20 nm Tri-Gate transistors combined with a redundant Adaptive Logic Module (ALM) structure, an embedded Hard Memory Block (M20K) hierarchy, and variable-precision DSP blocks. The transceiver tiles integrate hard PCIe Gen3 and 10 Gbps Ethernet PCS, offloading MAC-layer functions from the programmable fabric. The 0.9 V core supply achieves up to 40% lower power than the prior 28 nm Arria V generation at equivalent throughput. Typical applications include 10/40/100 Gbps packet processing line cards, wireless baseband aggregation units, broadcast video processing, software-defined radio, ASIC prototyping, and high-speed serial backplane bridging. The high transceiver count also suits test and measurement instrumentation requiring multi-channel serial capture. A key design consideration is PCB BGA breakout routing - 1932 balls on a 45 x 45 mm substrate typically requires an 8- to 10-layer stackup with microvia-in-pad. Power delivery to the 0.9 V core must use a multiphase VRM with bulk decoupling placed adjacent to the BGA footprint. Quartus Prime is the required design-entry and synthesis tool. This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and BGA layout guidance not found in the manufacturer datasheet alone.
10AX115U1F45I1SG - Arria 10 GX 1.15M LE FPGA | Intel
The Intel (formerly Altera) 10AX115U1F45I1SG is a high-performance Arria 10 GX Field Programmable Gate Array (FPGA) built on a 20 nm process, delivering 1,150,000 logic elements, 68,857,856 embedded memory bits, and 480 user I/O pins in a 1932-ball FCBGA (F45) package. This industrial-temperature variant operates from -40°C to +100°C and is offered in an F45 package with 1.15M logic elements and 28nm-equivalent transceiver-rich fabric typical of the Arria 10 GX family. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceivers that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface protocols. FPGAs sit in the wider taxonomy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined microcontrollers, providing hardware-timed performance with software-like design flexibility. Key differentiating features of the 10AX115U1F45I1SG include up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, 28.05 Gbps serial connectivity, partial reconfiguration support, and SoC emulation capability. The device integrates hardened PCIe Gen3 hard IP blocks and supports external memory interfaces such as DDR4, QDR-IV, and RLDRAM3 for high-throughput system designs. The Arria 10 GX architecture combines a programmable fabric with hardened intellectual property for floating-point DSP and variable-precision arithmetic, allowing efficient implementation of signal-processing pipelines at lower power than competing FPGAs in the same node. The 20 nm process and SmartVID adaptive voltage scaling reduce dynamic power compared to older 28 nm Arria V and Stratix V devices. Typical applications include 100G/400G optical transport platforms, FPGA-based hardware accelerators for compute and storage, 4K/8K video broadcast infrastructure, ASIC prototyping and emulation, and test-and-measurement equipment such as oscilloscopes and protocol analyzers. When designing with this device, ensure your PCB has a high-layer-count stack-up with continuous reference planes to support the 1932-ball BGA fanout, and confirm that your power tree delivers the multiple SmartVID rails the Arria 10 GX requires. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not consolidated on any single manufacturer or distributor page.
10AX115U2F45E1SG - Arria 10 GX FPGA 1.15M LE | Intel
The Intel 10AX115U2F45E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,600 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA package. Built on TSMC's 20 nm process, this Arria 10 GX device integrates up to 24 transceiver channels supporting data rates up to 17.4 Gbps (chip-to-chip and backplane) and up to 12.5 Gbps to optical modules, making it a mid-range workhorse for bandwidth-bound applications that do not require Stratix 10-class performance. The part targets applications such as 4K video processing, PCIe Gen3 x8 endpoint/rootport, 10G/40G Ethernet bridging, and DSP-heavy signal intelligence workloads. An FPGA (Field Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, high-speed transceivers, and programmable I/O cells, all interconnected via a programmable routing fabric. FPGAs sit above Application-Specific Standard Products (ASSPs) in flexibility and below Application-Specific Integrated Circuits (ASICs) in unit cost and per-unit power; Arria 10 specifically occupies Intel's mid-range tier between Cyclone 10 (cost-optimized) and Stratix 10 (high-end). This part is part of the broader programmable logic category inside semiconductors, alongside CPLDs, microcontrollers, and DSPs. Key features include 1,150,000 logic elements, 68.86 Mbits of embedded SRAM, 1,518 embedded 18x18 multipliers, six hard memory controllers supporting DDR4/DDR3/QDRII+/RLDRAM3, and 24 backplane-capable transceivers. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and supports -40C to +100C (E1SG = extended industrial) junction temperature. The 1932-ball FCBGA uses a 45 x 45 mm body with a 1.0 mm ball pitch and an integrated heat-spreader-compatible lid. Architecturally, the Arria 10 GX family introduced a hard floating-point DSP block and a partial reconfiguration region controller that enables runtime swapping of FPGA fabric without halting adjacent logic. The 20 nm SoC-style back end-of-line enables lower static leakage than the 28 nm prior generation while sustaining transceiver line rates suitable for 100G Ethernet aggregation and CPRI wireless fronthaul. Typical applications include 4K/8K broadcast video processing, 100G Ethernet switching fabrics, PCIe Gen3 acceleration cards, radar and electronic-warfare DSP front-ends, and medical imaging reconstruction. The combination of transceiver bandwidth and floating-point DSP makes the device equally suited to wireline backhaul and software-defined radio prototyping. When designing with this FPGA, ensure the PCB supports the 1932-ball BGA escape routing (typically 1.0 mm pitch with microvia stack-ups) and provides a thermal solution sized for 25-40 W typical board power. Quartus Prime software is mandatory for synthesis, place-and-route, and bitstream generation; legacy Quartus II is no longer supported for this device. This page synthesizes distributor pricing, in-stock availability, same-family Arria 10 drop-in alternatives, and practical board-design notes not found in the manufacturer datasheet alone, giving procurement and hardware engineers an at-a-glance view of the part's position in the Arria 10 lineup.
10AX115U2F45E2LG - Arria 10 GX 1.15M LE FPGA | Intel F45 FCBGA-1932
The Intel / Altera 10AX115U2F45E2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) containing 1,150,000 logic elements, 427,200 adaptive logic modules (ALMs), and approximately 52.99 Mbit of embedded memory, integrated into a 1932-ball FC-FBGA (F45 package, 45 mm) at the 20 nm process node with a 0.9 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) > complex programmable logic device (CPLD) > FPGA, and compete with ASICs and ASSPs in parallel-processing, low-latency, and reconfigurable-compute roles. The Arria 10 GX family in particular targets mid-range transceiver-heavy applications, balancing performance and power efficiency against the lower-cost Cyclone and higher-end Stratix families. Key features of 10AX115U2F45E2LG include up to 480 user I/O pins, integrated 28.05 Gbps transceivers for high-speed serial, dedicated fractional PLLs, variable-precision DSP blocks, and hard PCI Express Gen3 IP. The F45 package is the largest Arria 10 GX ball grid array at 45 mm square with 1.0 mm ball pitch, optimized for line-card designs that need maximum logic and transceiver count per board area. Embedded memory of 52.99 Mbit is distributed across M20K block RAM and MLAB resources, enabling on-die buffering for high-throughput data pipelines. Architecturally, Arria 10 GX uses a coherent 20 nm fabric with adaptive logic modules that combine fracturable 8-input look-up-tables, dedicated carry chains, and dual-output registers. The device is built for power-efficient transceiver performance, and the F45 variant exposes the full transceiver count of the 115 K-LE silicon die. Partial reconfiguration is supported, allowing regions of the fabric to be reprogrammed while the rest of the device continues operating - a key requirement for telecom and compute accelerator workloads. Typical applications include 100 Gbps and 400 Gbps optical transport, 4K/8K video broadcast and pro-AV signal processing, 5G fronthaul and backhaul baseband cards, radar and electronic warfare DSP, test and measurement instrumentation, and high-performance PCIe Gen3 accelerator cards. The device is also used in defense and medical imaging systems where mid-density FPGA fabric is paired with deterministic transceiver performance. When designing with 10AX115U2F45E2LG, careful PCB layout is required for the 1932-ball FCBGA: matched-length routing for the 28 Gbps transceivers, a multi-layer stackup with continuous GND references for the BGA breakout region, and strict decoupling per the Intel power distribution network (PDN) design guidelines. Thermal management at high transceiver utilization requires the included thermal pad, heatsink, and sufficient airflow to keep the junction within industrial limits. This page synthesizes distributor pricing for the F45 package variant, identifies drop-in same-brand and cross-brand alternatives within the Arria 10 GX family, and provides design guidance that goes beyond what is found in the official Intel datasheet.