FPGA & CPLD
Products (6352)
10M50DAF672I7G - MAX 10 FPGA 50K LE, 672-FBGA | Intel / Altera
The Intel / Altera 10M50DAF672I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) integrating 50,000 logic elements (LE), 1,677,312 bits of embedded SRAM, and 500 maximum user I/O pins in a 672-ball FineLine BGA package (27 mm × 27 mm, 1.0 mm pitch). It is fabricated on a low-power 55 nm CMOS process and operates from a 1.2 V core supply with on-die Flash configuration memory, eliminating external boot PROMs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a user-defined bitstream. Modern FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below custom ASICs, and are deployed when designers need hardware-level parallelism, deterministic latency, and post-production reconfigurability. The MAX 10 family further integrates hard IP such as ADCs, PLLs, and DDR3 memory controllers, bridging the gap between traditional FPGAs and microcontrollers. Key features of the 10M50DAF672I7G include 50,000 logic elements, 1,677,312 M9K bits of embedded memory, 144 (18×18) multipliers, 4 PLLs, 2 hard memory controllers, dual-configuration Flash, and a 12-bit successive-approximation ADC. The 672-FBGA package delivers 500 user I/Os at a 1.0 mm pitch, enabling dense board-level integration for industrial, automotive, and communication platforms. Architecturally, the device combines a low-power 55 nm logic fabric with on-die Flash and a hardened DSP/memory hierarchy, achieving deterministic real-time performance typical of FPGAs while simplifying board design (no external boot memory). The integrated ADC and PLLs make it well suited for sensor aggregation and motor-control signal chains. Operating junction temperature spans –40 °C to +100 °C (industrial, "I7G" suffix). Typical applications include industrial motor control, factory-automation I/O hubs, video-bridging and display controllers, low-cost ASIC prototyping, and embedded-vision edge nodes. Designers also deploy the part in industrial IoT gateways and portable instrumentation where Flash-based instant-on and integrated analog reduce BOM cost. When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation, and respect the 1.0 mm BGA ball pitch during PCB layout—escape routing requires microvia HDI stack-ups. Validate signal-integrity for DDR3 interfaces and observe the device's 1.2 V core-rail decoupling guidelines. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel
The Intel (formerly Altera) 10M50DCF256A7G is a MAX 10 family Field Programmable Gate Array delivering 50,000 logic elements (LE) in a 256-ball FineLine BGA (FBGA-256, 17 x 17 mm, 1.0 mm pitch) package, with 178 user I/O pins and 1,677,312 bits of embedded user flash memory. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and software-driven microcontrollers: an FPGA delivers hardware-timed parallelism and deterministic latency that microcontrollers cannot, while remaining re-spinable like software. Within Intel's portfolio, the MAX 10 family is a non-volatile, low-cost, single-chip tier positioned above CPLDs and below Cyclone/Cyclone V in density, and is built on a 55 nm TSMC process node. Key feature of this OPN is its on-chip flash configuration memory: unlike SRAM-based FPGAs that require an external boot PROM, the 10M50DCF256A7G stores its configuration in 1,677,312 bits of embedded flash, enabling instant-on single-chip operation. Additional features include an integrated 12-bit ADC, on-chip temperature-sensing diode, 178 GPIO supporting LVDS/LVCMOS/LVTTL, 4 x PLL, and an integrated 1.2 V core with 3.0/3.3 V-tolerant I/O banks for single-supply or dual-supply operation. The MAX 10 architecture combines a LAB-based logic fabric (50K LE), 9 Kbit M9K SRAM blocks, 144 x 18 x 18 hardware multipliers, and a flash-backed configuration subsystem. The DCF256 speed grade targets industrial-grade -40 C to +85 C operation, and the 1.0 mm pitch FBGA is a mainstream JEDEC-compliant footprint that PCB designers can route with standard 4-layer stack-ups. Typical applications include industrial motor control and IO-Link bridges, factory automation PLCs, low-cost video processing for machine vision, protocol bridging (UART/SPI/I2C to Ethernet), and low-volume prototyping that would otherwise justify an ASIC. The integrated ADC and flash also make it a fit for system-management and power-sequencing designs. When designing with this device, confirm that Quartus Prime (Lite or Standard edition) supports the 10M50DCF256 device symbol and plan JTAG/AS configuration header access for in-system reprogramming. The 1.0 mm pitch FBGA requires NSMD pads with via-in-pad or dog-bone fan-out; verify PCB fab capabilities before committing to layout. This page synthesizes distributor pricing, drop-in MAX 10 pin-compatible alternatives, and practical board-level design notes that go beyond the manufacturer ordering guide.
10M50DCF256C7G - MAX 10 FPGA 50K LE, 178 I/O, 256-FBGA | Intel
The Intel (formerly Altera) 10M50DCF256C7G is a MAX 10 field-programmable gate array (FPGA) in the 256-ball FineLine BGA package, offering 50,000 logic elements (LE), 1,677,312 bits of embedded user flash memory, and 178 maximum user I/O pins. Built on a 55 nm TSMC process, the device integrates dual-configuration flash, a 12-bit 1 MSPS ADC, and DSP blocks supporting up to 472.5 MHz fabric performance in a single non-volatile chip. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that sits in the hierarchy of digital semiconductors between fixed-function ASICs and microcontrollers. Unlike microcontrollers, which execute software instructions sequentially, FPGAs implement parallel hardware logic that the designer configures via HDL code (Verilog or VHDL). The MAX 10 family specifically targets low-cost, high-volume applications by combining programmable logic with hard IP peripherals, eliminating the need for a separate configuration memory device. Key features include 16 full-featured 18 x 18 multipliers, 2 PLLs, 288 Kbits of user SRAM, 1.2 V core operation, and support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device is offered in commercial (0C to 85C) temperature grade with the -7 speed grade, optimized for general-purpose logic, glue replacement, and bridging applications. From an architectural standpoint, the 10M50 uses an SRAM-based LUT-driven fabric backed by on-chip configuration flash, allowing instant-on operation at power-up without external boot devices. The integrated ADC and thermal-sensing diode reduce bill-of-materials cost for industrial control designs that previously required a separate analog companion chip. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, portable test instruments, and low-cost PCIe endpoint bridging. The non-volatile nature and small 11 x 11 mm BGA footprint make it equally attractive for space-constrained embedded modules. Designers should pay close attention to the four DDR3/x8 hard memory controller paths on this device, which require strict DQ/DQS group length matching, and to the I/O bank supply grouping (VCCIO per bank) when mixing 1.8 V, 2.5 V, and 3.3 V interfaces on the same chip. Pin assignment with the Quartus Prime Pin Planner is recommended before PCB layout commit.
10M50DCF256C8G - MAX 10 FPGA, 50K LE, 256-BGA | Intel / Altera
The Intel (formerly Altera) 10M50DCF256C8G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) delivering 50,000 logic elements, 1,677,312 bits of embedded user flash, and 178 user I/O pins in a 17x17 mm 256-ball FineLine BGA (FBGA256) package with industrial temperature grade and -8 speed grade. It belongs to the MAX 10 family, the industry's first single-chip, non-volatile programmable logic device family with integrated analog-to-digital converters and dual-configuration flash. A MAX 10 FPGA is a non-volatile SRAM-based logic device with on-chip flash configuration memory. The category hierarchy places MAX 10 within programmable logic devices (PLDs), subdivided into FPGAs (Field-Programmable Gate Arrays) and CPLDs (Complex Programmable Logic Devices). MAX 10 uniquely combines FPGA fabric, on-die flash for instant-on configuration, integrated ADC blocks, and DSP/multiplier blocks in a single low-cost monolithic silicon device, occupying the bridge position between traditional CPLDs (lower density, instant-on) and Cyclone-class FPGAs (higher density, external configuration). Key specifications of the 10M50DCF256C8G include 50,000 logic elements (LEs), 1,677,312 bits of embedded user flash, 172 18x18 multipliers, 5,151 Kbits of embedded RAM (M9K blocks), 178 general-purpose I/Os, four general-purpose PLLs, and two on-chip hard ADC blocks (12-bit, 1 MSPS). It is fabricated on TSMC 55 nm embedded flash CMOS process technology with 1.0V core and 2.5V/3.3V LVCMOS-compatible I/O banks. The device supports instant-on from on-die flash and dual-boot configuration modes for fail-safe field updates. The 10M50DCF256C8G targets industrial, automotive, and consumer applications that require non-volatile configuration, low standby power, and integrated analog. Because configuration is stored on-chip, the device needs no external boot PROM, simplifying PCB layout, lowering BOM cost, and reducing susceptibility to configuration memory corruption during in-field firmware updates. The integrated ADC eliminates an external ADC IC in many motor control and sensor-interface designs, and the dual-boot mode enables A/B firmware images for OTA-capable industrial systems. Typical applications include industrial motor control drives, factory automation I/O modules, portable medical instrumentation, automotive infotainment and ADAS pre-processing, low-cost video processing, I/O expansion bridges for microcontrollers, and replacement of legacy CPLD designs that have outgrown their density. Design considerations include using all four PLL outputs for jitter-sensitive clock domains, observing the FBGA256 PCB escape routing guidelines, and ensuring JTAG signal integrity for in-system programming.
10M50DCF484C7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
The Intel 10M50DCF484C7G is a MAX 10 family Field Programmable Gate Array (FPGA) delivering 50,000 logic elements in a 484-ball FineLine BGA package with 360 user I/O pins. Built on a 55 nm non-volatile process, the device integrates 1,677,312 bits of embedded SRAM and operates at a 1.2 V core supply with speed-grade 7 timing closure. The part ships as a commercial-temperature variant (C suffix) without the optional DDR3 hard memory controller (D prefix - dual supply). A MAX 10 FPGA is a non-volatile programmable logic device from Intel (formerly Altera) that combines LUT-based logic, embedded memory blocks, DSP blocks, and user flash memory on a single chip. In the broader taxonomy, MAX 10 sits below Cyclone V as the low-density, low-cost, instant-on tier of Intel FPGAs and is widely used as a glue-logic and I/O-expansion companion to microprocessors. The 10M50 part number decodes as 10 = MAX 10 family, M50 = 50K logic elements; the C7 suffix indicates commercial temperature range (0 C to 85 C) and speed grade 7. Key features include integrated configuration flash (no external boot PROM required), up to 360 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, hardware multipliers (18x18) for DSP, analog-to-digital converter (ADC) blocks, and dual-purpose configuration pins. The F484 package measures 23 x 23 mm with a 1.0 mm ball pitch, making it suitable for cost-sensitive mid-density designs. Architecturally, MAX 10 uses 4-input adaptive LUTs, 20 Kbit M9K memory blocks, and 144-bit wide DSP blocks. The non-volatile flash enables instant-on operation in under 10 ms, eliminating external boot memory cost and board space. A hard PCIe Gen2 endpoint (x1/x2) is present in the largest MAX 10 variants. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-cost PCIe endpoint cards, and portable test equipment. The integrated flash also enables secure boot and field-update use cases. When designing with this part, verify that Quartus Prime supports the latest tool version for MAX 10, since Intel has announced end-of-life for older Quartus support on selected MAX 10 die. Always check pin assignment compatibility for migrated designs. This page synthesizes distributor pricing across 14 sources, drop-in MAX 10 same-package alternatives, and PCB-layout design notes not collected in the manufacturer datasheet alone.
10M50DCF484C8G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
The Intel 10M50DCF484C8G is a member of the MAX 10 family of non-volatile, single-chip low-cost programmable logic devices, integrating 50,000 logic elements in a 484-ball FineLine BGA package. Built on a 55nm CMOS process, the device delivers up to 360 user I/O pins, 1,677,312 bits of embedded SRAM, and a 1.2V core supply with industrial-grade temperature support. The MAX 10 architecture combines a look-up-table (LUT)-based fabric with hardened analog and memory blocks, replacing multiple discrete components on a single die. A field-programmable gate array (FPGA) is a programmable semiconductor device that lets engineers implement custom digital logic, glue logic, and parallel processing functions after PCB fabrication. In the broader hierarchy, an FPGA sits between microcontrollers and ASICs: more flexible than a fixed-function ASIC but more deterministic and parallel than a sequential microcontroller. MAX 10 specifically adds on-chip flash, ADC blocks, and DDR3 memory controllers that bring system-on-chip (SoC) capability to a low-power, non-volatile FPGA fabric. Key features include up to 1,677 Kbits embedded SRAM, integrated flash configuration memory, on-die ADC blocks, support for DDR3/LPDDR3 external memory interfaces, and hardened DSP and multiplier blocks. Operating junction temperatures range from 0C to +85C (commercial grade), and the part is housed in a 23 mm × 23 mm 484-ball FBGA at 1.0 mm pitch for high-density board designs. Technically, the 10M50DCF484C8G variant is specified at speed grade 8, with internal core voltages of 1.2V and PLL/IO banks at 2.5V/3.3V. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and differential pairs, and integrates embedded multipliers and 18×18 hardware multipliers for high-throughput DSP operations. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost prototyping, and bridge replacement for legacy CPLD-based designs. The combination of non-volatile configuration and high I/O count makes it well suited for designs where board space and BOM integration are priorities. When designing with this part, allocate a minimum of four PCB layers with a dedicated ground plane to maintain signal integrity on high-speed transceivers, and follow Intel's power plane decoupling recommendations to keep internal rails within ±5% under inrush conditions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer datasheet page, giving procurement engineers and FPGA designers a one-stop reference for the 10M50DCF484C8G.
10M50DCF484I6G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
The Intel 10M50DCF484I6G is a member of the MAX 10 family of non-volatile FPGAs, integrating 50,000 logic elements, 1,638 Kbit embedded RAM, and a 12-bit 1 Msps ADC into a single 484-ball FineLine BGA package. It features dual-configuration flash, on-chip temperature sensing, and instant-on support, targeting industrial, automotive, and communications applications where single-chip programmability replaces discrete processor-plus-logic designs. A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, supplemented by hardened IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the wider taxonomy, an FPGA sits beneath programmable logic and above fixed-function ASICs in design flexibility, allowing in-system reconfiguration after manufacture. The MAX 10 family specifically adds non-volatile configuration and analog integration, removing the need for an external boot flash that legacy SRAM FPGAs require. Key features of the 10M50DCF484I6G include 50K logic elements, 2,140 Kbits of total embedded memory (RAM + user flash), 144 (18x18) multipliers, four general-purpose PLLs, and a 12-bit 1 Msps successive-approximation ADC with up to 18 single-ended channels. The device operates over the industrial -40C to +100C junction range, integrates a 3.3 V/2.5 V LVCMOS/LVDS capable I/O bank structure totaling 360 user I/Os, and supports JTAG, AS, PS, and JTAG-based passive serial configuration modes. Architecturally, the device is built on a 55 nm embedded-flash process that stores configuration in on-chip non-volatile memory, enabling instant-on (< 1 ms to user I/O activation in single-supply mode) and dual-boot between two configuration images. Integrated hard IP for PCIe Gen2 x1, I2C, SPI, UART, and SDR/DDR/LPDDR memory controllers shortens design time and frees logic resources for application code. Typical applications include industrial motor control and machine vision, automotive driver-assistance and infotainment bridges, factory automation I/O expansion, video bridging, and low-cost prototyping for ASIC replacement. The integrated ADC also makes the part suitable for sensor aggregation front-ends. When designing with this device, allocate at least two PCB layers for power and ground planes because the core (1.2 V) and I/O (1.2 V to 3.3 V) rails have distinct ramp requirements. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation; consult the MAX 10 device family pin connection guidelines for unused-pin termination. This page synthesizes distributor pricing, drop-in alternatives drawn from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
The Intel (formerly Altera) 10M50DCF484I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) from the MAX 10 family, integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and a 1.6 Mb user flash memory block in a 484-ball FineLine BGA package. The device is built on TSMC's 55 nm embedded flash process technology and operates across an industrial -40C to +100C junction temperature range with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as PLLs, DSP blocks, and high-speed transceivers. Within the broader hierarchy, the MAX 10 belongs to the non-volatile FPGA class - a sub-category of programmable logic devices (PLDs) - and is positioned as a low-power, instant-on replacement for CPLDs and small SRAM FPGAs in glue-logic, control, and bridging applications. Key features of the 10M50DCF484I7G include 360 general-purpose I/O pins (LVDS-capable), 4 PLLs, 144 (18x18) hardware multipliers, dual configuration flash with on-chip flash boot, an integrated ADC (12-bit, up to 17 channels), and support for external memory interfaces up to DDR3/LPDDR2. Hardened Nios II soft-core capability allows embedded processor integration without external CPUs. The 484-FBGA (F484) package has a body size of 23 x 23 mm with 1.0 mm ball pitch. Architecturally, MAX 10 FPGAs use a logic-element fabric of 8-input adaptive LUTs distributed across LABs, fed by a multi-tier routing hierarchy. The 10M50 variant places the device at the mid-density point of the MAX 10 family (between 10M25 and 10M08 at the lower end and the original Cyclone V derivatives at the higher end), making it suitable for designs that outgrow CPLDs but do not require Cyclone 10 or Arria-class resources. Typical applications for the 10M50DCF484I7G include industrial motor and motion control, I/O expansion and bridging (PCIe Gen2 root port, I2C/SPI/UART), video processing and display controllers, factory automation PLC interfaces, and portable test equipment. The integrated ADC enables sensor aggregation on the same die. When designing with this device, pay attention to the I/O bank supply structure: the F484 package supports 8 I/O banks plus a dedicated configuration/JTAG bank. Each bank requires its own VCCIO supply, and unused banks must still be powered to a valid level (typically 2.5 V) to keep I/O buffers in a defined state. The device also requires a 10 kohm external pull-up on the nCONFIG pin during configuration boot. This page synthesizes distributor pricing, drop-in pin-compatible variants from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF672C7G - MAX 10 FPGA 50K LE 672-BGA | Intel
The Intel (formerly Altera) 10M50DCF672C7G is a MAX 10 Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and a 672-pin FineLine BGA package. Built on TSMC's 55nm embedded flash process, this non-volatile FPGA integrates flash configuration memory directly on-chip, enabling instant-on operation without an external boot PROM. The -7 speed grade and C (commercial, 0C to +85C) temperature grade make this variant a general-purpose mid-density option for cost-sensitive industrial and consumer designs. What is a MAX 10 FPGA? The MAX 10 is Intel's non-volatile FPGA family that combines traditional FPGA fabric with integrated analog, memory, and configuration flash on a single die. Positioned within the programmable logic taxonomy (FPGA -> programmable logic -> semiconductor IC -> integrated circuit), MAX 10 devices deliver instant-on dual-configuration capability, on-chip ADC, and DSP blocks at low system cost compared to SRAM-based FPGAs that require external boot devices. The 10M50 specifically targets mid-range logic densities around 50K LE. Key features include 500 user I/O pins, up to 1.677 Mbit embedded SRAM, 4 PLLs, embedded 12-bit ADC blocks, and hardware multiplier/DSP blocks for signal processing. The 672-BGA FineLine package supports high I/O density with multiple LVDS/ LVCMOS / SSTL / HSTL I/O standards. The device also integrates Nios II soft processor support for embedded control tasks. Architecturally, the MAX 10 uses a logic-element-based fabric with LABs (Logic Array Blocks), MLABs (Memory Logic Array Blocks), and dedicated 18x18 multipliers. Embedded flash cells handle single-chip configuration and dual-image storage for fail-safe field updates. The integrated ADC operates up to 1 MSPS with up to 16 analog inputs, eliminating external ADC ICs in many designs. Typical applications include industrial motor control and machine vision, factory automation I/O expansion, low-cost video processing and display bridging, portable test and measurement equipment, and as a glue-logic replacement for CPLDs and discrete digital ICs. When designing with the 10M50DCF672C7G, ensure proper power decoupling with bulk and high-frequency ceramic capacitors near each supply pin, route LVDS pairs with matched-length 100 ohm differential impedance, and respect the maximum I/O toggle rate to avoid simultaneous switching noise (SSN) on adjacent outputs. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical board-level design notes not found in the manufacturer datasheet alone.
10M50DCF672C8G - MAX 10 FPGA, 50K LE, 672-BGA | Intel
The Intel (Altera) 10M50DCF672C8G is a non-volatile FPGA from the MAX 10 family, delivering 50,000 logic elements in a 672-ball FineLine BGA package with 1.0 mm pitch. It integrates 1,677,312 bits of embedded SRAM, supports up to 500 general-purpose I/O pins, and features an 8-bit speed grade C8 commercial temperature rating. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs are a category of programmable logic devices sitting under the broader hierarchy of digital ICs -> logic ICs -> programmable logic. The MAX 10 series in particular targets low-power, low-cost, non-volatile applications that require integrated features like ADCs, DSP blocks, and on-die flash configuration memory, eliminating the need for external boot ROMs. Key features include 50K logic elements, 1,677,312 bits of user flash memory, embedded 12-bit ADC blocks, hardware multiplier blocks for DSP, and a hardened Nios II soft processor support infrastructure. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards, with multi-voltage I/O banks allowing 1.2V to 3.3V interfacing on the same die. Configuration is instant-on because the configuration image is stored in on-chip flash. The MAX 10 architecture combines a traditional FPGA fabric with hardened peripherals, enabling system-level integration in a single chip. The 672-BGA package provides generous I/O count for high-pin-count designs, while the non-volatile flash memory eliminates external boot components, reducing BOM cost and board area. Typical applications include industrial motor control, factory automation I/O expansion, video processing bridges, portable medical instrumentation, and IoT edge nodes. The integrated ADC and DSP blocks make it well suited for sensor aggregation and signal conditioning, while the non-volatile configuration supports instant-on industrial PC and HMI designs. When designing with this device, verify that the 672-BGA PCB footprint supports your I/O assignment and that the Quartus Prime toolchain is used for synthesis and place-and-route. Note that the C8 speed grade represents a commercial-temperature part (0C to 85C); choose an I7 or I8 grade for industrial (40C to 100C) operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF672I7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel
The Intel 10M50DCF672I7G is a non-volatile FPGA from the MAX® 10 family, integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 500 user I/Os in a 672-ball FineLine BGA package. Built on a low-power 55 nm process, it operates at a 1.2 V core supply and targets cost-sensitive applications that require single-chip programmability, instant-on dual-configuration flash, and integrated analog-to-digital conversion. The MAX 10 architecture combines a look-up-table (LUT)-based fabric with hard memory blocks, DSP blocks, PLLs, and embedded flash, eliminating external boot memories. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic resources, routing, and I/O behavior are defined by user-supplied configuration data. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP > standard logic, and are classified within programmable logic devices (PLDs). The MAX 10 family specifically extends this concept by embedding configuration flash and analog blocks directly on-chip, allowing instant-on behavior at power-up without an external boot PROM - a feature traditionally reserved for CPLDs but now delivered with FPGA-class logic density. Key features include up to 50K logic elements (LEs), 312 Kbits of embedded memory in 9-Kbit M9K blocks, 144 18x18 multipliers for DSP workloads, four general-purpose PLLs, and a 12-bit successive-approximation analog-to-digital converter (ADC) with up to 17 external channels. The device supports LVDS, LVCMOS, SSTL, and differential I/O standards up to 500 MHz, and provides dual-configuration flash for fail-safe field upgrades and remote reconfiguration through JTAG or serial protocols. From an architectural standpoint, the 10M50DCF672I7G integrates the configuration flash, user flash (UFM), ADC, voltage regulators, and temperature-sensing diode on-die, reducing BOM count and board area. The 672-FBGA package exposes the full MAX 10 I/O count of 500, allowing dense board designs with multiple high-speed interfaces such as parallel memory buses, MIPI bridges, or industrial control peripherals. Typical applications include industrial motor control, video bridging and image processing, factory automation I/O expansion, low-cost PCIe endpoint bridging, and portable medical instrumentation where the ADC and instant-on flash simplify firmware bring-up. The integrated 12-bit ADC at 1 MSPS is particularly useful for sensor conditioning, eliminating an external analog front end. When designing with the 10M50DCF672I7G, ensure the PCB land pattern follows the 672-ball FineLine BGA 1.0 mm pitch recommended footprint and that all core/PLL/IO supply pins are decoupled per the Intel MAX 10 power distribution network (PDN) guidelines. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation; the device is supported in Quartus Prime Standard and Pro editions. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the MAX 10 family, and practical design considerations not found in the manufacturer datasheet alone.
10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel
The Intel 10M50SAE144C8G is a MAX 10 non-volatile Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 101 maximum user I/Os, packaged in a 144-pin plastic Enhanced QFP (EQFP-144) with exposed thermal pad. It is fabricated on TSMC's 55 nm NOR-flash-based embedded non-volatile process and targets low-cost, low-power, instant-on applications. A MAX 10 FPGA is a single-chip, non-volatile programmable logic device that integrates the optimal set of system components for cost-sensitive and space-constrained designs. It sits within Intel's programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> MAX 10 family -> low-density non-volatile FPGA. Unlike SRAM-based FPGAs, MAX 10 devices configure in milliseconds from on-chip flash, eliminating the need for external boot memory. Key features include dual-configuration flash with self-divided remote system upgrade support, integrated 12-bit analog-to-digital converter (ADC), on-chip temperature-sensing diode, and up to 1.4 Mb of user flash memory. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability. Per-block RAM is 9 Kbits (M9K) with independent parity/ECC. Architecturally, the 10M50 includes Logic Array Blocks (LABs) of 16 Logic Elements each, Multiplier blocks (18x18), and a high-speed serial interface absent in this density. The embedded flash subsystem allows dual-boot and instant-on operation; combined with the on-chip ADC, the part is targeted at industrial I/O modules, motor control pre-processing, and portable test equipment. Typical applications include industrial control and factory automation I/O expansion, portable medical device signal conditioning, video bridging and image aggregation, automotive driver-assistance sub-systems, and I/O expansion for microcontrollers/SoCs. Instant-on capability makes it suitable for power-sequenced industrial systems. When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the 31.6 C/W theta-JA rating. This page synthesizes authorized distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10M50SCE144A7G - MAX 10 FPGA 50KLE 144-LQFP | Intel
The Intel 10M50SCE144A7G is a MAX 10 family field-programmable gate array (FPGA) featuring 50,000 logic elements, 1,677,312 bits of embedded user flash memory, and 101 user I/O pins in a 144-pin LQFP Exposed Pad (EQFP) package with industrial-grade temperature rating. Built on TSMC's 55nm NOR-flash + SRAM process, the device integrates a non-volatile configuration flash, 2x PLLs, 1x 12-bit ADC block, and 2x I/O banks, providing true single-chip programmability without an external boot ROM. The 144-LQFP-EP package supports hand-solderable prototyping and is the largest density offered in the MAX 10 E144 footprint family. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. Unlike ASICs (Application Specific Integrated Circuits) which are factory-fixed, FPGAs use configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the engineer programs via HDL (Hardware Description Language) to implement custom digital functions, glue logic, state machines, and parallel processing pipelines. The MAX 10 line specifically targets low-cost, non-volatile, instant-on applications where microcontrollers alone lack the I/O count or parallel throughput but full Cyclone/Stratix FPGAs are oversized. Key differentiating features of the 10M50SCE144A7G include its 50KLE logic density (the maximum available in the MAX 10 family), 16 KBytes of user flash inside the die, 2.5 Mb embedded SRAM, 1.6 Mb of flash for configuration plus 64 Kb user-accessible flash, 12-bit 1-MSPS ADC with 16 analog inputs on select variants, and dual supply options for analog and digital rails. The device supports LPDDR2, DDR3, and LPDDR3 external memory interfaces via soft IP, making it well suited to video bridging and industrial HMI. The EQFP-144 exposed pad provides a thermal resistance of approximately 12-15 C/W with a properly soldered thermal pad, enabling reliable operation up to 100 C junction temperature in the industrial -40C to +100C ambient range. Architecturally, the 10M50SCE144A7G uses a Look-Up Table (LUT)-based fabric of 3,125 LABs (Logic Array Blocks), each containing 16 logic elements, fed by a global and regional routing network. Configuration is stored in on-chip flash that loads at power-up in less than 5 ms, eliminating external boot PROM requirements that earlier CPLD/FPGA families needed. This instant-on capability, combined with the dual-configuration flash region, supports fail-safe field updates - critical for industrial control and automotive aftermarket designs. Typical applications include industrial motor control and PLC I/O expansion, video processing and image aggregation for surveillance systems, factory automation bridges between legacy parallel buses and modern Ethernet/USB, automotive infotainment rear-seat displays, and consumer IoT gateway hubs. The integrated 12-bit ADC also suits battery management and analog sensor aggregation in motor-drive designs. Designers should pay particular attention to the LQFP-144 exposed-pad soldering requirements: a 4x4 thermal via array beneath the exposed pad is mandatory to meet the package's thermal specifications. Quartus Prime Lite or Standard software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives across the MAX 10 E144 family, and practical design notes not consolidated in any single manufacturer datasheet or distributor listing.
2VM3104 - Versal Prime Gen 2 Adaptive SoC | AMD | 23x23mm
The AMD 2VM3104 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications such as Pro AV, broadcast, and industrial IoT. It integrates a quad-core Arm Cortex-A78AE application processing unit (APU) with programmable logic, delivering up to 100K DMIPS of scalar compute in a compact 23 x 23 mm package. This device is part of AMD's second-generation Versal Prime family, which offers up to 10x scalar compute performance compared to previous adaptive SoCs. An adaptive SoC (System-on-Chip) combines a processor subsystem (PS) with programmable logic (PL) on a single device, enabling hardware acceleration and flexible I/O. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density and low latency, bridging the gap between traditional FPGAs and application-specific standard products (ASSPs). The 2VM3104 is positioned as an entry point for customers evaluating the Versal Prime Gen 2 family, with availability expected in 2027. Key features of the 2VM3104 include a quad-core Arm Cortex-A78AE APU with 64 KB L1 cache, a 23 x 23 mm package that is 27% smaller than previous second-generation Versal Prime devices, and higher programmable logic density per square millimeter compared to similarly sized 8-core devices. The device supports up to 100K DMIPS of scalar compute, making it suitable for real-time control and signal processing. Technically, the 2VM3104 leverages AMD's advanced process technology to achieve a balance of power efficiency and performance. The programmable logic fabric allows custom accelerators, while the APU handles general-purpose computing. The compact package enables designs with reduced board area, critical for space-constrained systems. Typical applications include Pro AV equipment (video processing, audio mixing), broadcast infrastructure (encoding, transcoding), and industrial IoT gateways (edge computing, machine vision). The device's small footprint and high compute density make it ideal for these markets. When designing with the 2VM3104, consider thermal management due to the high compute density in a small package. Adequate cooling and power delivery are essential to maintain performance and reliability.
2VM3254 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3254 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications. It integrates a 4-core Arm Cortex-A78AE application processor with programmable logic, delivering up to 100K DMIPS of scalar compute in a compact 23x23mm package. This device is part of AMD's Versal Prime Gen 2 family, which offers up to 10X scalar compute performance compared to previous generations. An adaptive SoC (System-on-Chip) combines a hardened application processor (like Arm Cortex-A78AE) with programmable logic (FPGA fabric) and customizable engines on a single device. This architecture allows designers to implement both software-defined and hardware-accelerated functions, bridging the gap between traditional microprocessors and FPGAs. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O. Key features of the 2VM3254 include a 23x23mm package (27% smaller than the previous minimum), 4-core Cortex-A78AE processor, and support for Pro AV, broadcast, and industrial IoT applications. The device provides high programmable logic density per square millimeter, enabling complex designs in compact form factors. It also supports the Versal Prime Gen 2 ecosystem, including design tools and early access programs. Technically, the 2VM3254 leverages AMD's adaptive compute acceleration platform (ACAP) architecture, combining scalar engines (Arm cores), adaptable engines (programmable logic), and intelligent engines (AI cores) with a network-on-chip (NoC) interconnect. This heterogeneous architecture allows concurrent execution of software and hardware tasks, optimizing performance per watt for edge applications. Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package makes it ideal for space-constrained designs where board area is critical. The device also serves as an entry point for customers evaluating Versal Prime Gen 2 before migrating to larger devices like the 2VM3654. When designing with the 2VM3254, consider the power delivery network (PDN) requirements for the multi-rail SoC, including core, I/O, and memory voltages. Use AMD's power estimation tools and reference designs to optimize decoupling and thermal management in the 23x23mm package.
2VM3358 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3358 is a Versal Prime Series Gen 2 adaptive SoC, featuring 8 Arm Cortex-A78AE application cores and 10 Cortex-R52 real-time cores. This device delivers up to 10x scalar compute compared to previous AMD Versal or Zynq UltraScale+ adaptive SoCs, making it a high-performance heterogeneous computing platform for demanding embedded applications. The 2VM3358 is part of the earliest Versal Prime Gen 2 devices, alongside the 2VM3858 and 2VM3558, and is available in the SFVA1089 package. An adaptive SoC (System-on-Chip) is a heterogeneous computing device that combines programmable logic (FPGA fabric) with hardened processing subsystems, including application processors, real-time processors, and various I/O interfaces. In the Versal architecture, the scalar engines (Cortex-A78AE and Cortex-R52) handle general-purpose and real-time processing, while the programmable logic provides custom hardware acceleration. This hierarchy enables a single device to replace multiple discrete components, reducing system complexity and power consumption. Key features of the 2VM3358 include 8 Arm Cortex-A78AE application cores for high-performance Linux or RTOS applications, 10 Cortex-R52 real-time cores for deterministic, low-latency control tasks, and the Versal adaptive architecture that allows hardware acceleration to be tailored to specific workloads. The device supports up to 10x scalar compute performance versus prior generations, enabling advanced AI, signal processing, and control applications in a single chip. Technically, the 2VM3358 leverages AMD's advanced process technology and the Versal platform's integrated design tools, including Vitis and Vivado. The device's heterogeneous architecture allows developers to partition workloads between scalar processing, programmable logic, and dedicated AI engines (if present in the specific variant). The SFVA1089 package provides a high-density interconnect, supporting high-speed transceivers and memory interfaces for system-level integration. Typical applications for the 2VM3358 include avionics, factory automation, building automation, grid infrastructure, and other industrial or aerospace systems requiring high compute density and real-time responsiveness. The device's combination of scalar performance and programmable logic makes it suitable for edge computing, machine vision, and motor control applications. When designing with the 2VM3358, consider the power consumption of the smallest system configuration, as documented in AMD's support forums. Proper thermal management and power supply design are critical due to the device's high performance and integration level. The SFVA1089 package requires careful PCB layout to manage signal integrity and power distribution.
2VM3454 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3454 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications such as Pro AV, broadcast, and industrial IoT. It integrates a quad-core Arm Cortex-A78AE application processor, six real-time Arm Cortex-R52 cores, and a Mali-G78AE GPU, delivering up to 100K DMIPS of scalar compute in a compact 23 x 23 mm package. This device is part of AMD's second-generation Versal Prime family, which offers up to 10x scalar compute performance compared to existing adaptive SoCs. An adaptive SoC (System-on-Chip) combines programmable logic (FPGA fabric) with a hardened processor subsystem (PS) and other dedicated engines on a single device. This architecture allows designers to implement custom hardware accelerators in the programmable logic while running complex software on the application cores, bridging the gap between traditional FPGAs and application processors. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O. Key features of the 2VM3454 include the quad-core Cortex-A78AE with 64 KB L1 cache, six Cortex-R52 real-time cores, and a Mali-G78AE GPU. The device is available in a 23 x 23 mm package, enabling compact PCB designs. It supports up to 100K DMIPS of scalar compute, making it suitable for real-time processing and AI inference at the edge. The Versal architecture provides a unified design environment with AMD Vivado and Vitis tools. Technically, the 2VM3454 leverages AMD's advanced 7nm-class process technology, offering a balance of performance and power efficiency. The programmable logic fabric supports high-speed transceivers and flexible I/O standards, while the processor subsystem handles complex control and data processing tasks. The device includes integrated security features and supports functional safety for industrial and automotive applications. Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package and high compute density make it ideal for space-constrained designs where performance and power efficiency are critical. When designing with the 2VM3454, consider the power delivery network and thermal management. The device requires multiple voltage rails and adequate decoupling. Use the AMD power estimator tool to calculate power consumption and design the thermal solution accordingly.
2VM3558 - Versal Prime Gen2 Adaptive SoC | AMD
The AMD 2VM3558 is a Versal Prime Series Gen 2 Adaptive SoC, part of the second-generation Versal family that integrates Arm Cortex-A78AE application processors, Cortex-R52 real-time processors, and programmable logic in a single device. It is designed for high-performance embedded applications requiring up to 10x scalar compute compared to previous Versal or Zynq UltraScale+ devices. The 2VM3558 is available in the SSVA1440 package, offering a balance of logic density, I/O, and transceiver capabilities for mid-range designs. An Adaptive SoC is a heterogeneous computing platform that combines scalar processing (Arm cores), adaptable hardware (FPGA fabric), and intelligent engines (DSP, AI) on a single chip. This architecture allows hardware acceleration to be customized post-manufacturing, enabling performance and efficiency gains over fixed-function SoCs. The Versal Prime Gen2 series targets embedded systems where flexibility, performance, and long-term adaptability are critical. Key features of the 2VM3558 include 8 Arm Cortex-A78AE application cores and 10 Cortex-R52 real-time cores, delivering up to 10x scalar compute versus prior generations. It supports PCIe Gen5, 4GB LPDDR5x memory, and GTYP transceivers up to 32Gbps, making it suitable for high-bandwidth data movement. The device also includes a Video Codec Unit and Image Signal Processor, enabling advanced media processing. With up to 1188K logic cells and 543K LUTs, it provides substantial programmable logic resources. Technically, the 2VM3558 leverages AMD's 7nm process technology and advanced packaging to integrate multiple dies, including the programmable logic, processing system, and transceivers. The SSVA1440 package offers a high pin count for extensive I/O and memory interfaces. The device supports industrial temperature ranges (-40°C to +85°C) and is designed for reliability in harsh environments. Typical applications include avionics, defense, industrial automation, and edge computing, where the combination of high-performance scalar processing and adaptable hardware is essential. The 2VM3558 is also used in system-on-modules (SoMs) for rapid prototyping and deployment. When designing with the 2VM3558, consider power delivery complexity: the device requires multiple voltage rails (e.g., 0.85V core, 1.8V I/O) and careful sequencing. Use AMD's power management reference designs and ensure adequate decoupling for high-speed transceivers.
5962-9851001NTB - Military FPGA, 22K Gates | AMD Xilinx
The 5962-9851001NTB is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, designed for demanding aerospace and defense applications. It features 1296 Configurable Logic Blocks (CLBs) and an equivalent gate count of 22,000, with a maximum usable gate count of 65,000. The device is packaged in a 240-pin FQFP (Fine-pitch Quad Flat Package) with gull-wing terminals, and operates over the full military temperature range of -55°C to +125°C. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. They offer reconfigurability, parallel processing, and rapid prototyping capabilities, making them essential in applications where flexibility and time-to-market are critical. Key features of the 5962-9851001NTB include its military temperature grade, high-reliability qualification to MIL-PRF-38535 QML, and a maximum clock frequency of 166 MHz. The device provides 3078 logic cells and supports a wide range of I/O standards, enabling integration with various system interfaces. The FQFP package offers a compact footprint with 0.5 mm pitch, suitable for space-constrained military electronics. Technically, the 5962-9851001NTB is based on Xilinx's mature FPGA architecture, featuring a sea-of-gates structure with configurable logic blocks interconnected by programmable routing. This architecture allows designers to implement complex digital systems, including state machines, DSP functions, and communication protocols. The device is supported by Xilinx's ISE design suite, which provides synthesis, place-and-route, and bitstream generation tools. Typical applications include military avionics, satellite communication systems, radar signal processing, and secure communication equipment. Its high reliability and extended temperature range make it suitable for harsh environments where commercial-grade components would fail. When designing with this FPGA, careful attention must be paid to power supply decoupling and signal integrity, as the high-speed I/O and internal logic can generate significant switching noise. Proper PCB layout with multiple ground planes and bypass capacitors is essential for reliable operation.
5CEBA2F17C8N - Cyclone V E FPGA, 25K LE, 256-BGA | Altera
The Altera (Intel) 5CEBA2F17C8N is a Cyclone® V E family field-programmable gate array (FPGA) featuring 25,000 logic elements, 128 user I/O pins, and 2,002,944 bits of embedded memory in a 256-ball FineLine BGA (FBGA-256) package. Operating from a 1.1 V core supply, the device targets low-power, cost-sensitive applications across industrial, automotive, video processing, and communications segments. The Cyclone V E family is built on TSMC's 28 nm low-power process, delivering an optimal balance of logic density, DSP capability, and transceivers for mid-range programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and digital ICs, enabling hardware-level parallelism that microcontrollers and DSPs cannot match. Unlike fixed-function ASICs, FPGAs are reprogrammable in-system, which makes them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. Cyclone V E devices specifically address the cost- and power-optimized tier of the Altera/Intel FPGA portfolio. Key features of the 5CEBA2F17C8N include approximately 66 embedded 18×18 multipliers for DSP workloads, dedicated on-chip memory blocks totaling ~270 Kbits of M10K plus 1,536 Kbits of MLAB RAM, four general-purpose PLLs, and hard memory controller blocks for DDR2/DDR3/LPDDR2 interfaces. The device supports up to 128 general-purpose I/O pins arranged in banks that support multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with hot-socketing capability. The FBGA-256 package provides a compact footprint suitable for space-constrained designs while maintaining signal integrity for high-speed interfaces. Architecturally, the Cyclone V E integrates hardened PCIe Gen2 controllers (in some package variants), embedded transceivers in selected speed grades, and an efficient routing fabric that connects logic, memory, and I/O elements. The 28 nm LP process enables static power consumption below typical 40-45 nm Cyclone IV designs, while the 1.1 V core voltage (VCCINT) keeps dynamic power in check. Configuration is supported via JTAG, serial (AS) flash, or parallel (PS) interfaces, with built-in decompression and encryption options. Typical applications for the 5CEBA2F17C8N include industrial motor control, factory automation I/O expansion, video surveillance image processing, LED video wall driving, software-defined radio baseband, and automotive driver-assistance subsystems. The combination of logic density, memory bandwidth, and DSP blocks makes it well-suited for parallel sensor fusion, image pipeline stages, and protocol bridging. The device is also widely used as a cost-optimized ASIC/ASSP replacement in low-volume production runs where NRE costs are prohibitive. When designing with this Cyclone V E variant, designers must respect the bank-based I/O supply grouping (VCCIO), provide proper decoupling across VCCINT/VCCA/VCCPD rails, and validate timing closure in Quartus Prime at the target speed grade. The -8 speed grade suffix (C8) indicates the slowest commercial speed bin, which simplifies timing closure at the cost of Fmax — pick a -6 or -7 variant if higher performance is required. Configuration scheme selection (EPCS or EPCQ flash) must also be decided early, since the chosen scheme affects board-level pin usage and BOM. This page synthesizes distributor pricing across DigiKey, Mouser, Arrow, LCSC, and Octopart, plus drop-in same-package and family alternatives, comparison parameters, and practical design notes not found in the standalone manufacturer datasheet.
5CEBA2F17I7N - Cyclone V E FPGA, 25K LE, 256-FBGA | Intel
The Intel (formerly Altera) 5CEBA2F17I7N is a low-power, low-cost Cyclone V E Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 28 nm low-power process, the device integrates 25,000 logic elements, 2,002,944 bits of embedded memory, and 156 (18x18) hardware multipliers, delivering an optimal balance of logic capacity, DSP throughput, and power efficiency for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture using an HDL-defined bitstream. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital IC hierarchy, but uniquely offer hardware-level parallelism with re-programmability, making them ideal for interface bridging, custom acceleration, and rapid prototyping before ASIC tape-out. The 5CEBA2F17I7N delivers key features including up to 364 user I/O pins, 66 (18x18) multipliers per device variant (2 per logic array block column), a memory controller with DDR3/LPDDR2 support, and integrated transceiver-free I/O with LVDS, LVCMOS, and SSTL support. The 256-FBGA package offers 1.0 mm ball pitch, making it suitable for space-constrained industrial designs. Architecturally, the Cyclone V E family uses an Adaptive Logic Module (ALM) of 8-input fracturable look-up tables, providing better logic packing than 4-input LUT predecessors. The fabric includes variable-precision DSP blocks, embedded M10K memory blocks, and a hard PCIe Gen2 IP core option. Typical applications include industrial motor control, video processing and image sensor bridging, low-cost software-defined radio front-ends, factory automation I/O expansion, and portable test equipment. The wide temperature range and small package make it well-suited to embedded vision and human-machine interface (HMI) designs. When designing with the 5CEBA2F17I7N, ensure the 256-FBGA PCB land pattern uses 1.0 mm pitch BGA escape routing with microvia stacks. Power sequencing for the core, I/O, and auxiliary rails must follow the Cyclone V PowerPlay guidelines, and decoupling must include 100 nF and 10 uF ceramic capacitors adjacent to every supply pin. This page synthesizes distributor pricing, drop-in Cyclone V E family alternatives, and practical design notes not aggregated in a single manufacturer document.
5CEBA2U15I7 - Cyclone V E FPGA, 25K LE, 324-BGA | Intel
The Intel (formerly Altera) 5CEBA2U15I7 is a Cyclone V E family Field-Programmable Gate Array (FPGA) built on TSMC's 28 nm low-power process, integrating 25,000 logic elements, 2002 Kbits of embedded memory, and 176 user I/O pins in a 324-ball UFBGA (also documented as 324-LFBGA) package. The device operates from a 1.1 V core supply with dedicated phase-locked loops for clock management, embedded multipliers, and a hard memory controller block for DDR2/DDR3/LPDDR2 external memory interfaces. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LCLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and memory controllers. FPGAs sit at the top of the digital logic hierarchy: ASIC -> CPLD -> FPGA -> programmable SoC, and are widely used for parallel processing, hardware acceleration, and glue logic in applications where time-to-market, reprogrammability, and high I/O density outweigh the per-unit cost of an ASIC. The Cyclone V E family targets cost- and power-sensitive applications such as industrial control, video bridging, and motor control. Key features of the 5CEBA2U15I7 include 25,000 logic elements, 156 embedded 18x18 multipliers for DSP-style operations, up to 2002 Kbits of embedded SRAM, four general-purpose PLLs, and hard memory controllers supporting DDR2/DDR3/LPDDR2 with ECC. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards on the 176 user I/O pins, and integrates a Configuration via JTAG or Active Serial (AS) flash. Compared with the Cyclone IV E family, the Cyclone V E delivers roughly 2x higher logic performance and significantly lower static power from the 28 nm process. Typical use cases include industrial motor drives, video surveillance pipelines, machine vision pre-processing, factory automation controllers, and PCIe-over-GPIO bridging where designers need a balance of DSP throughput, logic capacity, and low power. Designers also leverage this device for custom peripheral expansion on SoC-based systems and as a flexible I/O front-end for ASIC prototyping. When designing with the 5CEBA2U15I7, follow Intel's PCB layout guidelines for the UFBGA-324 (1.0 mm pitch) land pattern and use a 6- or 8-layer stack-up with dedicated power and ground planes. The device requires 0.9 V, 1.1 V, 2.5 V, and 3.3 V supplies; use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet to size decoupling and predict junction temperature before committing to layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from Cyclone V datasheets and Altera/Intel application notes, providing information not found in the manufacturer datasheet alone.
5CEBA4F17I7 - Cyclone V E FPGA, 49K LE, 256-LBGA | Intel / Altera
The Intel (Altera) 5CEBA4F17I7 is a Cyclone® V E field-programmable gate array (FPGA) integrating 49,000 logic elements, 3,464,192 bits of embedded memory, and 128 embedded 18x18 multipliers in a 256-ball FineLine BGA (F17, 17x17 mm) package. Built on TSMC's 28 nm low-power process, it operates from a 1.1 V core supply and supports commercial temperature-grade operation per the 'I' speed-grade ordering code. A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing through programmable interconnect and configurable logic blocks. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and they sit within the integrated circuits (ICs) family, specifically the programmable logic sub-category. Cyclone V E is the logic-optimized family in Intel's Cyclone V generation, optimized for low static and dynamic power while providing DSP blocks, embedded M10K RAM, and high-speed transceivers in higher-tier variants. Key features of the 5CEBA4F17I7 include 49,000 logic elements (LEs), 3,464,192 embedded memory bits (approximately 424 Kbits of M10K block RAM plus 128 Kbits MLAB), 56 embedded 18x18 multipliers, 4 PLLs, and 2 user I/O banks supporting a wide range of single-ended and differential I/O standards. The device supports configuration via Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG modes, enabling flexible boot from EPCS or EPCQ flash devices. The 256-pin LBGA package exposes approximately 164 user I/O pins depending on the I/O assignment, making it suitable for mid-density logic designs. The Cyclone V E architecture separates a power-optimized logic fabric from dedicated memory, DSP, and I/O subsystems. Hardened IP blocks (PCIe Gen2, memory controllers, and transceivers on other Cyclone V variants) reduce soft-logic overhead. The 28 nm process enables lower core power (typically 200-400 mW static plus dynamic depending on utilization and clock rate) versus previous-generation 40 nm Cyclone IV devices, making 5CEBA4F17I7 attractive for power-sensitive industrial designs. Typical applications include industrial motor control and machine vision, video processing and display controllers, automotive infotainment pre-development, low-cost software-defined radio front-ends, and embedded vision pipelines. The combination of mid-density logic, embedded RAM, and DSP blocks suits designs where a microcontroller plus CPLD would be insufficient but a high-end FPGA is overkill. When designing with this part, plan power sequencing for the 1.1 V core and 2.5 V/3.3 V I/O rails. Use the Altera/Intel Quartus II or Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 17x17 mm LBGA package requires PCB design with 1.0 mm ball pitch and matched-impedance routing for high-speed DDR or LVDS signals. This page synthesizes distributor pricing, drop-in Cyclone V E alternatives, and practical design considerations not consolidated on any single distributor or manufacturer page.
5CEBA4F23C8N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
The Intel 5CEBA4F23C8N is a Cyclone® V E family Field Programmable Gate Array (FPGA) built on TSMC's low-power 28 nm process, offering 49,000 logic elements, 3,464,192 bits of embedded memory, and 224 general-purpose I/O pins in a 484-ball FineLine BGA (FBGA) package. It is supplied in the commercial temperature grade (0 °C to +85 °C junction) with the speed grade 8 silicon revision and ships in tray packaging. The device targets cost- and power-sensitive applications that still need substantial DSP and memory resources. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy alongside CPLDs and sit below ASICs in NRE cost but above microcontrollers in raw parallel processing capability. Cyclone V E is Intel's logic-optimized sub-family within Cyclone V, intentionally trading transceiver count for the lowest static and dynamic power per logic element of any 28 nm FPGA family. Key features of the 5CEBA4F23C8N include 49,000 logic elements, 224 GPIO organized across eight I/O banks supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated hardware multipliers and variable-precision DSP blocks, embedded M10K block RAM totaling 3,464,192 bits, and a phase-locked loop (PLL) clock management network. The F23 package variant (23 mm × 23 mm body) provides high I/O density for memory-rich and parallel-interface designs. Architecturally the device combines logic fabric with hard IP for PCIe Gen2, hard memory controllers for DDR3, and up to 3.125 Gbps transceivers in mixed variants, enabling single-chip implementation of industrial imaging, motor control, and video bridging pipelines. The Altera/Intel Quartus Prime design toolchain provides synthesis, place-and-route, and timing closure support; the device is supported by both Quartus Prime Standard and the freely downloadable Quartus Prime Lite edition for entry-level development. Typical applications include industrial motor control, factory automation, video surveillance, machine vision, and low-cost ASIC prototyping. The combination of large logic capacity and rich memory also suits software-defined radio pre-processing and broadcast video routing. When designing with this device, allocate at least 4-layer PCB routing with continuous GND plane beneath the FBGA, follow Intel's IBIS-AMI models for signal integrity simulation, and validate DDR3 interface timing with Quartus Prime's TimeQuest timing analyzer before sign-off. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical board-level design notes not aggregated in the manufacturer datasheet or on distributor catalog pages.