EP3SL50F780C3 vs EP3SL50F780C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3 disebabkan oleh Intel dan EP3SL50F780C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Bahagian terakhir untuk beliIntel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SL50F780C3 | EP3SL50F780C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | SRAM-based, JTAG/AS configuration |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Tingkat sensitiviti Air Nama (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Embedded Memory (bits) | — | 2,184,192 |
| Distributed RAM | — | 2.08 Mbit |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Temperature Grade Suffix | — | C (commercial, "3" speed grade) |
| Kemasan | — | 780-ball FBGA |
| Jenis Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Process Technology | — | TSMC 40 nm low-power |
| Design Software | — | Intel Quartus II (v9.0+) |