EP3SL50F780C3 vs EP3SL50F780C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3 sa pamamagitan ng Intel at EP3SL50F780C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Huling PagbiliIntel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SL50F780C3 | EP3SL50F780C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | SRAM-based, JTAG/AS configuration |
| Tindminan RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Embedded Memory (bits) | — | 2,184,192 |
| Distributed RAM | — | 2.08 Mbit |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Temperature Grade Suffix | — | C (commercial, "3" speed grade) |
| Packhaging | — | 780-ball FBGA |
| Uri ng Pagpapasok | — | SMD/SMT |
| Packaging | — | Tray |
| Process Technology | — | TSMC 40 nm low-power |
| Design Software | — | Intel Quartus II (v9.0+) |