EP3SL50F780C3 vs EP3SL50F780C3G Perbandingan

Perbandingan bersamaan detil EP3SL50F780C3 dari Intel dan EP3SL50F780C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780C3 EP3SL50F780C3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Aktif
Family Stratix III L (low-power) Stratix III L
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Suhu Kerja 0C to +85C (Commercial) 0C to +85C (commercial)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration SRAM-based, JTAG/AS configuration
Status RoHS Compliant Compliant (per DigiKey listing)
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Tingkat Sensitivitas Kekeringan (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory (bits) — 2,184,192
Distributed RAM — 2.08 Mbit
User I/O Count — 488
Core Voltage — 1.1 V
Temperature Grade Suffix — C (commercial, "3" speed grade)
Paket — 780-ball FBGA
Tipe Mounting — SMD/SMT
Packaging — Tray
Process Technology — TSMC 40 nm low-power
Design Software — Intel Quartus II (v9.0+)

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