H5AN8G8NDJR vs AS4C512M16D4A-62BCN Comparison

Detailed side-by-side comparison of H5AN8G8NDJR by SK hynix and AS4C512M16D4A-62BCN by Alliance Memory. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G8NDJR H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR ✓ Active
Alliance Memory
AS4C512M16D4A-62BCN AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN ✓ Active

Specification Comparison

Parameter H5AN8G8NDJR AS4C512M16D4A-62BCN
Brand SK hynix Alliance Memory
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
Organization 1G x 8 512M x 16
Data Rate 3200 MT/s 1600 MHz (3200 Mbps)
Supply Voltage (VDD) 1.2 V (1.14V to 1.26V) —
VDDQ 1.2 V —
VPP 2.5 V —
Operating Temperature 0°C to +95°C (Tc) 0°C to 95°C
Package FBGA-78 (7.5x11 mm) 96-FBGA (7.5x13 mm)
CAS Latency 22 (typical) 18 ns
tRCD 22 ns —
tRP 22 ns —
Burst Length 8 and 4 (with burst chop) —
Self-Refresh Current 30 mA (typical) —
Active Standby Current 60 mA (typical) —
RoHS Compliant —
Lead-Free Yes —
Memory Size — 8 Gbit
Supply Voltage — 1.2 V
Mounting Type — Surface Mount
JEDEC Standard — Compliant
Interface — POD (Pseudo Open Drain)
Refresh — Auto-refresh and self-refresh
On-Die Termination — Yes
RoHS Status — Compliant
Packaging — Tray

Datasheets & Resources

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