K4B4G1646D-BCMA0 vs K4B4G1646D-BFMA Comparison
Detailed side-by-side comparison of K4B4G1646D-BCMA0 by Samsung Electronics and K4B4G1646D-BFMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646D-BCMA0 - 4Gb DDR3 SDRAM 256Mx16 | Samsung
K4B4G1646D-BCMA0 ✗ End of LifeSpecification Comparison
| Parameter | K4B4G1646D-BCMA0 | K4B4G1646D-BFMA |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | End of Life | Active |
| Memory Type | DDR3 SDRAM | DDR3 SDRAM |
| Memory Size | 4 Gb | — |
| Organization | 256M x 16 | 256M x 16 |
| Data Rate | 1866 Mbps | 1866 Mbps |
| Supply Voltage | 1.5 V | 1.5V |
| Operating Temperature | 0°C to 85°C | — |
| Package | 96-FBGA | 96-ball FBGA |
| Mounting Type | Surface Mount | — |
| Memory Interface | Parallel | — |
| RoHS | Compliant | Compliant |
| Halogen Free | Yes | — |
| Lead Free | Yes | — |
| Lifecycle Status | EOL | — |
| Technology | DDR3 | — |
| Number of Terminals | 96 | — |
| Density | — | 4Gb |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| Burst Length | — | 8 and 4 (with burst chop) |
| CAS Latency | — | Programmable |
| On-Die Termination | — | Yes |
| Temperature Range | — | 0°C to 95°C (case) |
| Lead-Free | — | Yes |
| Halogen Free | — | Yes |