MPC875ZT66 vs MPC870CZT66 Comparison
Detailed side-by-side comparison of MPC875ZT66 by NXP Semiconductors and MPC870CZT66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC875ZT66 | MPC870CZT66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | NRND |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32-bit | — |
| Maximum Clock Frequency | 66 MHz | 66 MHz |
| Supply Voltage | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um CMOS |
| Operating Temperature Range | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Core Architecture | — | Power Architecture (PowerQUICC MPC8xx) |
| Data Bus Width | — | 32-bit |
| Operating Temperature | — | -40C to +100C |
| Package | — | 256-PBGA (23x23 mm) |
| Mounting Type | — | Surface Mount |
| Mounting Style | — | Tray |
| Instruction Set | — | RISC |
| Integrated Peripherals | — | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | — | Yes (SDRAM/Flash controller) |
| MSL Level | — | 3 (168 hours) |