MPC875ZT66 vs MPC870CZT66 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC875ZT66 disebabkan oleh NXP Semiconductors dan MPC870CZT66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC875ZT66 | MPC870CZT66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32-bit | — |
| Frekuensi Klock Maksimum | 66 MHz | 66 MHz |
| Tegangan Pemberi Arus | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um CMOS |
| Gambaran Suhu Operasi | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Core Architecture | — | Power Architecture (PowerQUICC MPC8xx) |
| Lebar Bus Data | — | 32-bit |
| Suhu Operasi | — | -40C to +100C |
| Kemasan | — | 256-PBGA (23x23 mm) |
| Jenis Pemasangan | — | Surface Mount |
| Gaya Pemasangan | — | Tray |
| Instruction Set | — | RISC |
| Integrated Peripherals | — | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | — | Yes (SDRAM/Flash controller) |
| Aras MSL | — | 3 (168 hours) |