MPC875ZT66 vs MPC870CZT66 Vergleich
Detaillierter Direktvergleich von MPC875ZT66 von NXP Semiconductors und MPC870CZT66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875ZT66 | MPC870CZT66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32-bit | — |
| Maximale Taktfrequenz | 66 MHz | 66 MHz |
| Versorgungsspannung | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um CMOS |
| Betriebstemperaturbereich | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Core Architecture | — | Power Architecture (PowerQUICC MPC8xx) |
| Datenbusbreite | — | 32-bit |
| Betriebstemperatur | — | -40C to +100C |
| Gehäuse | — | 256-PBGA (23x23 mm) |
| Montageart | — | Surface Mount |
| Montagestil | — | Tray |
| Instruction Set | — | RISC |
| Integrated Peripherals | — | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | — | Yes (SDRAM/Flash controller) |
| MSL-Level | — | 3 (168 hours) |