MPC875ZT66 vs MPC870CZT66 Perbandingan
Perbandingan bersamaan detil MPC875ZT66 dari NXP Semiconductors dan MPC870CZT66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC875ZT66 | MPC870CZT66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32-bit | — |
| Frekuensi Bawah Maximum | 66 MHz | 66 MHz |
| Tegangan Pemuat | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um CMOS |
| Rentang Suhu Kerja | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Core Architecture | — | Power Architecture (PowerQUICC MPC8xx) |
| Lebar Bus Data | — | 32-bit |
| Suhu Kerja | — | -40C to +100C |
| Paket | — | 256-PBGA (23x23 mm) |
| Tipe Mounting | — | Surface Mount |
| Gaya Mounting | — | Tray |
| Instruction Set | — | RISC |
| Integrated Peripherals | — | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | — | Yes (SDRAM/Flash controller) |
| Level MSL | — | 3 (168 hours) |