MPC875ZT66 vs MPC870CZT66 对比
详细并排对比 MPC875ZT66 出自 NXP Semiconductors 和 MPC870CZT66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC875ZT66 | MPC870CZT66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 不推荐新设计 |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32-bit | — |
| 最大时钟频率 | 66 MHz | 66 MHz |
| 电源电压 | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um CMOS |
| 工作温度范围 | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Core Architecture | — | Power Architecture (PowerQUICC MPC8xx) |
| 数据总线宽度 | — | 32-bit |
| 工作温度 | — | -40C to +100C |
| 封装 | — | 256-PBGA (23x23 mm) |
| 安装类型 | — | Surface Mount |
| 安装方式 | — | Tray |
| Instruction Set | — | RISC |
| Integrated Peripherals | — | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | — | Yes (SDRAM/Flash controller) |
| MSL 等级 | — | 3 (168 hours) |