5CSXFC5D6F31I7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9
Teilenummer: 5CSXFC5D6F31I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $192.5 | $192,50 |
| 10 | $178.4 | $1.784,00 |
| 100 | $162.1 | $16.210,00 |
| 500 | $148.75 | $74.375,00 |
| 1.000 | $138.2 | $138.200,00 |
5CSXFC5D6F31I7N Übersicht
A Cyclone V SX SoC is a heterogeneous computing device that merges a Field-Programmable Gate Array (FPGA) fabric with a Hard Processor System (HPS) in one package, allowing deterministic hardware acceleration and software programmability to coexist on the same silicon. Within the broader taxonomy, it sits as an SoC variant of the Cyclone V family under low-power FPGAs and is typically used where designers need parallel I/O processing, custom peripherals, or DSP acceleration alongside a Linux-capable ARM host. The integrated dual-core ARM Cortex-A9 MPCore delivers 800 MHz of application-class compute, while the FPGA fabric provides parallel datapaths for protocol bridging, motor control, and signal conditioning.
Key features of the 5CSXFC5D6F31I7N include 85,000 logic elements, embedded 18x18 multipliers for DSP, hard memory controllers supporting DDR2/DDR3/LPDDR2, high-speed transceivers, and FPGA-to-HPS bridges that enable tightly coupled data movement between the two domains. The 896-ball FBGA footprint also exposes multi-standard I/O banks that support LVDS, LVTTL, LVCMOS, and RSDS at speeds up to several hundred megabits per second. Industrial-grade screening plus the SoC integration reduce board area and BOM cost compared to a discrete host processor plus FPGA approach.
Typical applications span industrial motor control, factory automation gateways, automotive ADAS prototyping, video surveillance encoders, Software Defined Radio (SDR) baseband stages, and portable medical instrumentation. Engineers choose the 5CSXFC5D6F31I7N when a design requires deterministic hardware logic for I/O or DSP tightly coupled with a Linux-capable host, all in a single industrial-temperature SoC.
When designing the board, pay close attention to the FPGA-HPS bridge topology, multi-rail power sequencing (1.1V core plus 2.5V/3.3V I/O), and DDR3 trace length matching. Because the device is BGA with a 1.0 mm ball pitch, a 6- or 8-layer PCB with microvia stackups is recommended; decoupling must follow Intel's Cyclone V hardware design guide for signal-integrity and thermal relief.
Drop-in-Alternativen für 5CSXFC5D6F31I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC5D6F31I7N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Embedded Memory, Transceivers, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC5D6F31C8N
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →5CSXFC5D6F31C7N
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →5CSXFC5D6F31C6N
✅ Drop-In✓ Auf Lager
$184.85 / Stück
Datenblatt ansehen →5CSXFC6D6F31A7N
✅ Drop-In✓ Auf Lager
$345.5 / Stück
Datenblatt ansehen →5CSEMA5F31C6N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CSXFC5D6F31I7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm low-power |
| Gehäuse | 896-ball FBGA (31 x 31 mm) |
| Package Pitch | 1.0 mm |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40 C to +100 C (Industrial, TJ) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 |
| DSP Blocks | 18 x 18 multipliers |
| I/O Standards | LVDS, LVTTL, LVCMOS, RSDS |
| Transceivers | Present (Cyclone V SX transceiver variants) |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA) |
| RoHS-Status | Compliant |
5CSXFC5D6F31I7N 1.0 mm Pinbelegungsleitfaden
Pinbelegung für 5CSXFC5D6F31I7N (1.0 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC5D6F31I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC5D6F31I7N ist geeignet für 6 Anwendungs: Industrial Motor Control, Software Defined Radio Baseband, Video Surveillance Encoder, Factory Automation Gateway, Automotive ADAS Prototyping, Portable Medical Instrumentation.
Industrial Motor Control
The 5CSXFC5D6F31I7N fits industrial motor control because its 85K logic elements run multi-axis field-oriented control loops at PWM switching frequencies up to several hundred kHz, while the dual-core ARM Cortex-A9 HPS at 800 MHz executes the higher-level motion control stack and EtherCAT/CANopen communication. The FPGA fabric delivers deterministic loop timing that software-only MCUs cannot match. Engineers typically instantiate the IP cores for encoder feedback, current sensing, and PWM generation in the fabric, while reserving the HPS for trajectory planning.
Empfohlen
Software Defined Radio Baseband
For Software Defined Radio (SDR) baseband processing, the 5CSXFC5D6F31I7N's FPGA fabric implements parallel DSP pipelines for FFT, channelization, and modulation/demodulation, while the dual-core ARM Cortex-A9 HPS at 800 MHz handles MAC-layer processing and network stack integration. The 18x18 embedded multipliers support efficient polyphase filter banks, and the industrial -40C to +100C temperature range allows deployment in outdoor or ruggedized enclosures. The HPS-FPGA bridge enables zero-copy data movement between the radio PHY and IP networking layers.
Empfohlen
Video Surveillance Encoder
The 5CSXFC5D6F31I7N supports video surveillance encoder designs where the FPGA fabric accelerates H.264/H.265 motion estimation, deinterlacing, and noise reduction, while the ARM Cortex-A9 HPS runs the streaming stack, RTSP server, and analytics. The dual-core 800 MHz HPS can manage 2-4 streams at D1 resolution alongside the FPGA-accelerated encoding pipeline. Multi-standard I/O banks (LVDS, LVCMOS) simplify connection to image sensors and HDMI outputs without external bridge chips.
Empfohlen
Factory Automation Gateway
The 5CSXFC5D6F31I7N fits factory automation gateways because its FPGA fabric implements real-time industrial protocols (PROFINET, EtherCAT, EtherNet/IP) while the dual-core ARM Cortex-A9 HPS runs the OPC UA server, edge analytics, and cloud connectivity. The industrial -40C to +100C temperature rating supports factory floor deployment. The HPS-FPGA bridge enables sub-millisecond latency for closed-loop control traffic, which discrete host + FPGA designs typically cannot match.
Empfohlen
Automotive ADAS Prototyping
The 5CSXFC5D6F31I7N is widely used in automotive ADAS prototyping where the FPGA fabric accelerates sensor fusion from cameras, radar, and LiDAR, while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the perception and decision-making stack. The industrial -40C to +100C temperature range supports under-hood and cabin-mounted applications. Note: this part is not AEC-Q100 qualified - production automotive programs should migrate to the automotive-grade 5CSXFC6D6F31A7N variant in the same FBGA-896 footprint.
Empfohlen
Portable Medical Instrumentation
The 5CSXFC5D6F31I7N fits portable medical instrumentation such as ultrasound front-ends, patient monitors, and point-of-care diagnostics. The FPGA fabric implements the DSP pipeline (beamforming, FFT, filter banks) while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the user interface, data logging, and wireless connectivity (Wi-Fi/Bluetooth). The 28nm low-power process minimizes battery drain in portable form factors. The FBGA-896 package supports miniaturized PCB designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC5D6F31I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC5D6F31C8N | 5CSXFC5D6F31C7N | 5CSXFC6D6F31A7N | 5CSEMA5F31C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (31x31 mm) | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 | 85,000 | 85,000 | 110,000 | 85,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Single ARM Cortex-A9 |
| HPS Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 700 MHz | 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | 0 to +85C (Commercial) | 0 to +85C (Commercial) | -40C to +125C (Automotive) | 0 to +85C (Commercial) |
| Speed Grade | I7 | C8 | C7 | A7 | C6 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade in same FBGA-896 footprint (vs. 5CSXFC5D6F31C8N)
- Higher logic density in same FBGA-896 footprint (vs. 5CSXFC6D6F31A7N)
- Dual-core vs single-core ARM Cortex-A9 HPS (vs. 5CSEMA5F31C6N)
Designhinweise
Estimated: the 896-ball FBGA at 1.0 mm pitch requires a 6- or 8-layer PCB with microvia stackups (laser-drilled 0.1 mm microvias recommended). Implement a continuous GND plane beneath the BGA to provide a low-impedance return path for high-speed transceivers; route all differential pairs (LVDS, transceiver channels) with 100 ohm differential impedance and length matching to within 150 mils. Use buried vias for signal escape to avoid obstructing BGA fanout routing on outer layers.
The Cyclone V SX SoC requires multiple power rails (1.1V core, 2.5V/3.3V I/O, HPS-specific rails, transceiver PLLs). Power sequencing must follow Intel's Cyclone V hardware design guide: VCCINT must rise before or simultaneously with VCCPD to prevent latch-up. Place at least 10 ceramic decoupling capacitors (10 nF, 100 nF, 1 uF, 10 uF mix) within 5 mm of the BGA. Use a dedicated power management IC such as the LTM4677 or Enpirion EM22x series for best efficiency and sequencing accuracy.
Estimated: at maximum utilization (~85K LE, dual-core Cortex-A9 at 800 MHz, transceivers active), the 5CSXFC5D6F31I7N dissipates approximately 5-8 W. The 31x31 mm FBGA package has a typical theta_JA of 10-12 C/W with a 4-layer JEDEC test board. Provide a thermal copper pour of at least 4 square inches on the top layer connected to the central BGA ground balls for heat spreading. For fanless industrial enclosures, ensure ambient temperature stays below +85C to maintain the +100C junction limit with margin.
Do not assume BGA ball-to-ball compatibility between Cyclone V SX and SE families without checking the pin table - the HPS ball map differs between SX (dual-core) and SE (single-core) variants even though both use the 896-ball FBGA footprint. Also note that this 5CSXFC5D6F31I7N is industrial temperature grade and not AEC-Q100 qualified; for production automotive programs, migrate to the 5CSXFC6D6F31A7N (automotive grade) in the same footprint. Always validate DDR3 trace lengths against Intel's DDR3 pin assignment table before PCB fabrication.
Compliance-Informationen
RoHS compliant per distributor product pages. Not AEC-Q100 qualified - migrate to 5CSXFC6D6F31A7N for automotive programs. Halogen-free status not stated in verified data.
