EPM3512AFC256-23 - MAX 3000A CPLD, 512 Macrocells, 256-BGA | Altera
MPN: EPM3512AFC256-23 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.5 | $9,250.00 |
| 1,000 | $15.75 | $15,750.00 |
Drop-in alternatives for EPM3512AFC256-23 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM3512AFC256-23 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 (32 macrocells each) |
| Maximum Operating Frequency | 178.6 MHz |
| Propagation Delay (tPD) | 5.5 ns |
| Pin-to-Pin Delay | 23 ns |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Package | 256-ball FineLine BGA (FC256), 17 mm x 17 mm |
| Programming Interface | JTAG (IEEE Std. 1149.1) / ISP |
| Process Technology | 0.30 µm CMOS EEPROM |
| Mounting Type | Surface Mount (BGA) |
EPM3512AFC256-23 256-ball fineline bga (fc256), 17 mm x 17 mm Pin Configuration Guide
Complete pinout information for EPM3512AFC256-23 (256-ball fineline bga (fc256), 17 mm x 17 mm package) with [DATA_NEEDED: user I/O count for FC256] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-23.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count for FC256] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-23 is suitable for 6 applications: Industrial Glue Logic Consolidation, Address Decoding for Microprocessor Systems, Mixed-Voltage Bus Interfacing (5 V / 3.3 V / 2.5 V), Peripheral Controller Replacement of 74-series Logic, Test and Measurement Equipment State Machines, Legacy System Sustainment and Obsolete-Part Bridge.
Industrial Glue Logic Consolidation
The EPM3512AFC256-23's 512 macrocells and 10,000 usable gates make it ideal for replacing dozens of 74-series TTL/CMOS logic chips with a single programmable device in industrial control systems. With a 5.5 ns internal propagation delay, it delivers deterministic timing for interlock logic, mode decoding, and peripheral chip-select generation in PLC backplanes. The MultiVolt I/O architecture lets the same CPLD interface with both 5 V legacy peripherals and 3.3 V modern MCUs on a per-bank basis, eliminating external level shifters. In-system programmability via JTAG enables field firmware updates on deployed equipment without removing boards.
Recommended
Address Decoding for Microprocessor Systems
The EPM3512AFC256-23 is well suited for address decoding and chip-select generation in 8/16/32-bit microprocessor and DSP systems, where its 512 macrocells can decode wide address buses and generate multiple peripheral selects in a single device. The 5.5 ns tPD ensures decoder outputs settle within a single clock cycle at typical 33-50 MHz bus frequencies, avoiding wait-state insertion. The non-volatile EEPROM configuration means the decoder becomes active at power-up with zero configuration delay, eliminating the boot-time penalty of SRAM-based FPGAs.
Recommended
Mixed-Voltage Bus Interfacing (5 V / 3.3 V / 2.5 V)
With MultiVolt I/O banks supporting 2.5 V, 3.3 V, and 5.0 V signaling on the same device, the EPM3512AFC256-23 bridges legacy 5 V peripherals with modern 3.3 V or 2.5 V processors without external level-translator ICs. The 512 macrocells can implement multiple bidirectional bus switches, voltage-translating FIFOs, or protocol converters in a single chip. The 23 ns pin-to-pin delay (-23 speed grade) is acceptable for bus speeds up to about 40 MHz, covering most asynchronous peripheral interconnects including UART, SPI, and parallel data buses.
Recommended
Peripheral Controller Replacement of 74-series Logic
The EPM3512AFC256-23 can absorb entire boards of discrete 74LS/74HC/74F-series glue logic, reducing component count, board area, and BOM cost in mature designs. Its 16 LABs with 32 macrocells each provide abundant product-term resources for wide combinational functions and registered state machines. JTAG-based ISP enables last-minute logic changes during prototype bring-up without board respins, accelerating development cycles. The 256-ball BGA package keeps the footprint compact despite the high logic density.
Recommended
Test and Measurement Equipment State Machines
The EPM3512AFC256-23's deterministic 5.5 ns tPD and non-volatile instant-on behavior make it a reliable choice for state-machine implementation in test and measurement instruments such as bench multimeters, oscilloscope front panels, and protocol analyzers. The 512 macrocells support deep FSMs with many states and complex output decoding, while the JTAG interface provides built-in boundary-scan test capability that simplifies board-level manufacturing test. The MultiVolt I/O interfaces directly with both legacy 5 V displays and modern 3.3 V ADCs.
Recommended
Legacy System Sustainment and Obsolete-Part Bridge
For designs originally implemented with the EPM3512AFC256-23 that have reached end-of-production, the same Altera MAX 3000A family continues to be supported by Altera's Quartus II toolchain, allowing new firmware revisions to be compiled and programmed without hardware redesign. Engineers can also migrate to the pin-compatible EPM3512AFC256-10N (same FC256 BGA, same 512 macrocells, faster timing) to gain performance headroom on the existing PCB footprint. Distributors including VEKEMO, FPGAkey, and Ampheo stock remaining inventory for legacy sustainment programs.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-23 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-22 | EPM3512AFC256-20 | EPM3512AFC256-2 | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FC256) | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 | 256 |
| Pin-to-Pin Delay | 23 ns | 10 ns (faster) | 10 ns (faster) | 22 ns (near-identical) | 20 ns (faster) | 2 ns (much faster) | 10 ns (faster) |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| Logic Array Blocks | 16 | 16 | 16 | 16 | 16 | 16 | 8 |
| I/O Voltage Support | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP |
Key Differentiators
- Highest-density MAX 3000A with 512 macrocells in FC256 BGA (vs EPM3256AFC256-10)
- Drop-in upgrade path to faster 10 ns timing (vs EPM3512AFC256-10N)
- MultiVolt I/O supports 2.5 V / 3.3 V / 5.0 V mixed-voltage buses (vs MAX II (EPM1270F256C5N))
Design Notes
The MAX 3000A family separates VCCINT (3.3 V core supply) from VCCIO (2.5 V/3.3 V/5.0 V output driver supply). Each supply must be decoupled locally with at least one 0.1 µF ceramic capacitor per supply ball group plus a bulk 10-47 µF tantalum or polymer capacitor near the package. Power sequencing is not strictly required, but VCCINT and VCCIO should ramp within 100 ms of each other to avoid latch-up. Estimated: ICCINT current at 50 MHz operation is approximately 100-200 mA depending on logic utilization - consult the MAX 3000A datasheet power calculator for your specific design.
The 256-ball FineLine BGA package uses a 1.0 mm ball pitch, which requires 0.5 mm via-pad geometry and 4-layer PCB stack-up with continuous ground and power planes for signal return paths. All BGA balls must be routed out using dog-bone fan-out or via-in-pad technology; escape routing requires at least 4 routing layers. Follow Altera's recommended land pattern from the package mechanical drawing. Production solder joint inspection requires X-ray or cross-sectioning; AOI is insufficient for hidden BGA joints.
The MAX 3000A EEPROM configuration memory is rated for a minimum of 100 program/erase cycles - do not use ISP for high-frequency in-field updates without verifying the endurance budget. The -23 speed grade's 23 ns pin-to-pin delay limits fMAX to about 178 MHz internal but typically 40-50 MHz for complex multi-level logic; if timing closure fails in Quartus timing analysis, switch to a faster speed grade (e.g., EPM3512AFC256-10N at 10 ns) rather than reducing design complexity. Always connect unused JTAG pins per datasheet to avoid floating-input issues.
Compliance Information
Compliance information not explicitly stated in the verified web data. The MAX 3000A family was originally launched before RoHS mandates; later production runs may be RoHS-compliant, but this should be verified per lot from the distributor. AEC-Q100 not applicable - the device is not marketed for automotive use.
