K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics
Teilenummer: K9PDG08U5M ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.68 | $2.340,00 |
| 1.000 | $4.2 | $4.200,00 |
K9PDG08U5M Übersicht
NAND flash is a type of non-volatile memory that stores data in memory cells arranged in series, enabling very high density and low cost per bit compared to NOR flash. Within the memory hierarchy, NAND flash sits in the solid-state storage class, bridging volatile DRAM and permanent system firmware. It is accessed over an asynchronous 8-bit multiplexed address/data bus with command, address latch enable (CLE/ALE) control, making it the dominant storage medium for embedded systems, SSDs, and memory cards.
Key characteristics of the K9PDG08U5M include its x8 multiplexed I/O interface, page-based program and block-based erase operation, and a 3.3V (2.7V to 3.6V) supply rail. The device uses the industry-standard NAND command set (00h-10h page program, 00h-30h page read, 60h-44h block erase per common Samsung conventions), simplifying controller design and software reuse across Samsung NAND generations.
Architecturally, the device organizes the 4Gbit array into pages and blocks with a spare area per page for ECC data. Because it is SLC (single-level cell), each cell stores one bit, giving higher endurance and faster access than MLC parts of the same family - a key advantage for industrial and code-storage designs. Ready/Busy (R/B) signaling with open-drain output supports polled or interrupt-driven operation.
Typical applications include solid-state drives, USB flash drives, memory cards, set-top boxes, industrial data loggers, and embedded boot code storage where reliability and endurance matter.
Design consideration: NAND flash requires error correction code (ECC) - implement Hamming or BCH ECC in the host controller and manage bad blocks per Samsung's bad-block management guidelines; the spare area must be reserved for ECC and bad-block markers.
This page synthesizes distributor sourcing data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing freshness signals as of 2026-09-04.
Drop-in-Alternativen für K9PDG08U5M – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit K9PDG08U5M (gleiche Bauform und Footprint) – abweichend in Package, Interface, Memory Type, Cell Type, Density.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
K9MDG08U5M
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$35.5 / Stück
Datenblatt ansehen →K9F2808Q0B
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →K9XXG08U0M
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.6 / Stück
Datenblatt ansehen →K9XXG08UXM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →K9F6408U0B
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.2 / Stück
Datenblatt ansehen →K9PDG08U5M Technische Daten
| Speichertyp | NAND Flash (SLC) |
| Density | 4 Gbit |
| Speicherorganisation | x8 (multiplexed I/O) |
| Gehäuse | TSOP1-48 |
| Montageart | Surface Mount |
| Access Interface | Asynchronous multiplexed address/data, CLE/ALE control |
| Ready/Busy Output | Yes (R/B, open-drain) |
| Write Protect Pin | Yes (/WP) |
K9PDG08U5M Pin-Konfiguration
| Pin 1 | NC — Not connected (per datasheet) |
| Pin 2 | NC — Not connected (per datasheet) |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | NC — Not connected (per datasheet) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | NC — Not connected (per datasheet) |
| Pin 9 | NC — Not connected (per datasheet) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | R/B — Ready/Busy output (open-drain) |
| Pin 14 | /RE — Read enable |
| Pin 15 | /CE — Chip enable |
| Pin 16 | NC — Not connected (per datasheet) |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | VSS — Ground |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | /WE — Write enable |
| Pin 34 | ALE — Address latch enable |
| Pin 35 | CLE — Command latch enable |
| Pin 36 | /WP — Write protect (active low) |
| Pin 37 | VCC — Power supply |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | I/O7 — Data input/output bit 7 |
| Pin 40 | I/O6 — Data input/output bit 6 |
| Pin 41 | I/O5 — Data input/output bit 5 |
| Pin 42 | I/O4 — Data input/output bit 4 |
| Pin 43 | I/O3 — Data input/output bit 3 |
| Pin 44 | I/O2 — Data input/output bit 2 |
| Pin 45 | I/O1 — Data input/output bit 1 |
| Pin 46 | I/O0 — Data input/output bit 0 / I/O0-7 LSB |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
Typische Anwendungen
K9PDG08U5M ist geeignet für 6 Anwendungs: Solid-State Storage Modules, Industrial Data Loggers, Set-Top Boxes and Consumer Electronics, Embedded Boot Code Storage, USB Flash Drives and Memory Cards, Networking and Telecom Equipment.
Solid-State Storage Modules
The K9PDG08U5M's 4Gbit SLC array in a TSOP1-48 package is well suited to compact solid-state storage modules such as IDE/CF adapters and embedded storage boards. Its x8 multiplexed interface connects directly to common NAND controllers, and SLC operation delivers higher endurance and deterministic timing than MLC, important for module write-life guarantees. Designers typically parallel or cascade multiple devices behind a controller with BCH ECC and wear-leveling firmware; the 3.3V rail and standard K9 command set minimize board and firmware changes when scaling capacity across Samsung generations.
Empfohlen
Industrial Data Loggers
Industrial data loggers benefit from the K9PDG08U5M's SLC endurance and 3.3V operation in harsh environments where repeated logging cycles wear out MLC media faster. The 48-pin TSOP1 footprint mounts on standard industrial PCBs, and the R/B output allows interrupt-driven logging on MCU platforms, reducing polling overhead. With host-side ECC, bad-block management, and wear leveling, the 512MByte array holds years of sensor data; the /WP pin protects stored logs during brownout or tamper conditions, a common requirement in utility and field-instrumentation designs.
Empfohlen
Set-Top Boxes and Consumer Electronics
Set-top boxes and consumer media devices use the K9PDG08U5M to store firmware, channel databases, and application code. The standard K9 asynchronous NAND command set is supported by all major SoC boot-ROMs, allowing direct XIP-free boot from NAND, and the 3.3V I/O matches typical consumer board rails without level shifting. Because the device is SLC, boot-code integrity is higher than on MLC at low cost. Designers reserve spare area for ECC and keep a golden firmware copy, leveraging bad-block skipping in the boot loader for long product lifetimes.
Empfohlen
Embedded Boot Code Storage
The K9PDG08U5M serves as boot and configuration storage in embedded processors whose boot ROM loads code from raw NAND. Its predictable SLC timing and standard 00h/30h read command sequence simplify first-stage loader implementation, and the factory bad-block markers let boot ROMs skip defective blocks deterministically. The 512MByte capacity comfortably holds bootloader, kernel, and file-system images. A pull-up on R/B and correct CLE/ALE timing per the Samsung datasheet AC tables are the key hardware requirements for reliable cold-boot behavior.
Empfohlen
USB Flash Drives and Memory Cards
Removable media products such as USB flash drives and card modules historically used the K9PDG08U5M-class 4Gbit SLC NAND behind a UFI/SD controller. SLC construction gives faster sustained write speeds and longer card life than consumer MLC, valuable in ruggedized or professional media variants. The controller performs ECC, wear leveling, and bad-block remapping transparently. The TSOP1-48 footprint supports automated assembly in thin card form factors, and the 3.3V supply integrates directly with card power switches and level translators for dual-voltage card interfaces.
Empfohlen
Networking and Telecom Equipment
Routers, switches, and telecom line cards use the K9PDG08U5M to store firmware images, configuration files, and event logs. SLC reliability reduces field-failure risk in always-on equipment where MLC retention under heat is marginal, and the 4Gbit density accommodates dual-firmware A/B update schemes for safe over-the-network upgrades. The standard K9 command set is supported by common networking SoCs, and 3.3V operation fits telecom board power budgets. Designers pair the device with a supervisor/reset IC and hold /WP asserted during power-up to protect the golden image.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für K9PDG08U5M – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | K9MDG08U5M | K9F2808Q0B | K9XXG08U0M | K9XXG08UXM | K9F6408U0B |
|---|---|---|---|---|---|---|
| Package | TSOP1-48 | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Organization | x8 | x8 | x8 | x8 | x8 | x8 |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Supply Voltage | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class |
| Interface | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE (faster EDO timing) | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE |
Wichtigste Unterscheidungsmerkmale
- 4Gbit SLC density in the standard footprint (vs. K9F2808Q0B)
- SLC endurance vs newer-generation parts (vs. K9XXG08UXM)
- Honest trade-off: EOL sourcing risk (vs. K9MDG08U5M)
Designhinweise
Use the standard JEDEC TSOP1-48 land pattern for the K9PDG08U5M and place 0.1uF ceramic decoupling capacitors within 3-5 mm of each VCC/VSS pair, plus 10uF bulk capacitance near the device. NAND flash draws short, high-current bursts during program and erase operations; insufficient decoupling manifests as intermittent program failures and ECC errors rather than hard faults. Because same-family drop-ins (K9MDG08U5M, K9XXG08U0M) share the footprint, layout reuse across densities is safe.
The R/B output is open-drain and requires a pull-up resistor (typically 10k to VCC). Keep CLE, ALE, /CE, /RE, /WE trace lengths matched and short; the asynchronous interface tolerates modest skew, but clocking /RE beyond datasheet tRC limits causes read-corruption at higher temperatures. Avoid routing I/O0-I/O7 adjacent to switching-regulator nodes to prevent glitch-induced latch errors during the command phase.
Do not assume bad blocks are blank: the factory marks initial bad blocks in the first page of each block, and host software must scan and skip them before any erase. Never erase a block containing a factory bad-block marker, and never rely on block 0 being defect-free without checking (Samsung guarantees valid block 0 on this generation, but firmware should still verify). Always enable ECC on both main and spare area, and assert /WP during power transitions to prevent spurious programs.
Compliance-Informationen
Compliance data was not present in the provided verified web data; consult the Samsung product page or datasheet for RoHS/REACH status of the specific orderable suffix (e.g., K9PDG08U5M-LCB0).
