K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics
部品番号: K9PDG08U5M ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.85 | $58.50 |
| 100 | $5.2 | $520.00 |
| 500 | $4.68 | $2,340.00 |
| 1,000 | $4.2 | $4,200.00 |
K9PDG08U5M 概要
NAND flash is a type of non-volatile memory that stores data in memory cells arranged in series, enabling very high density and low cost per bit compared to NOR flash. Within the memory hierarchy, NAND flash sits in the solid-state storage class, bridging volatile DRAM and permanent system firmware. It is accessed over an asynchronous 8-bit multiplexed address/data bus with command, address latch enable (CLE/ALE) control, making it the dominant storage medium for embedded systems, SSDs, and memory cards.
Key characteristics of the K9PDG08U5M include its x8 multiplexed I/O interface, page-based program and block-based erase operation, and a 3.3V (2.7V to 3.6V) supply rail. The device uses the industry-standard NAND command set (00h-10h page program, 00h-30h page read, 60h-44h block erase per common Samsung conventions), simplifying controller design and software reuse across Samsung NAND generations.
Architecturally, the device organizes the 4Gbit array into pages and blocks with a spare area per page for ECC data. Because it is SLC (single-level cell), each cell stores one bit, giving higher endurance and faster access than MLC parts of the same family - a key advantage for industrial and code-storage designs. Ready/Busy (R/B) signaling with open-drain output supports polled or interrupt-driven operation.
Typical applications include solid-state drives, USB flash drives, memory cards, set-top boxes, industrial data loggers, and embedded boot code storage where reliability and endurance matter.
Design consideration: NAND flash requires error correction code (ECC) - implement Hamming or BCH ECC in the host controller and manage bad blocks per Samsung's bad-block management guidelines; the spare area must be reserved for ECC and bad-block markers.
This page synthesizes distributor sourcing data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing freshness signals as of 2026-09-04.
ドロップイン代替品: K9PDG08U5M — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: K9PDG08U5M （同一形状・フットプリント） — 相違点: Package, Interface, Memory Type, Cell Type, Density.
クイック比較ツール — 並列比較する代替部品を選択:
K9MDG08U5M
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$35.5 / 個
データシートを見る →K9F2808Q0B
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →K9XXG08U0M
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.6 / 個
データシートを見る →K9XXG08UXM
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →K9F6408U0B
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.2 / 個
データシートを見る →K9PDG08U5M 仕様
| メモリタイプ | NAND Flash (SLC) |
| Density | 4 Gbit |
| メモリ構成 | x8 (multiplexed I/O) |
| パッケージ | TSOP1-48 |
| 実装タイプ | Surface Mount |
| Access Interface | Asynchronous multiplexed address/data, CLE/ALE control |
| Ready/Busy Output | Yes (R/B, open-drain) |
| Write Protect Pin | Yes (/WP) |
K9PDG08U5M ピン構成
| ピン 1 | NC — Not connected (per datasheet) |
| ピン 2 | NC — Not connected (per datasheet) |
| ピン 3 | NC — Not connected (per datasheet) |
| ピン 4 | NC — Not connected (per datasheet) |
| ピン 5 | NC — Not connected (per datasheet) |
| ピン 6 | NC — Not connected (per datasheet) |
| ピン 7 | NC — Not connected (per datasheet) |
| ピン 8 | NC — Not connected (per datasheet) |
| ピン 9 | NC — Not connected (per datasheet) |
| ピン 10 | NC — Not connected (per datasheet) |
| ピン 11 | NC — Not connected (per datasheet) |
| ピン 12 | NC — Not connected (per datasheet) |
| ピン 13 | R/B — Ready/Busy output (open-drain) |
| ピン 14 | /RE — Read enable |
| ピン 15 | /CE — Chip enable |
| ピン 16 | NC — Not connected (per datasheet) |
| ピン 17 | NC — Not connected (per datasheet) |
| ピン 18 | NC — Not connected (per datasheet) |
| ピン 19 | VSS — Ground |
| ピン 20 | NC — Not connected (per datasheet) |
| ピン 21 | NC — Not connected (per datasheet) |
| ピン 22 | NC — Not connected (per datasheet) |
| ピン 23 | NC — Not connected (per datasheet) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | NC — Not connected (per datasheet) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | NC — Not connected (per datasheet) |
| ピン 31 | NC — Not connected (per datasheet) |
| ピン 32 | NC — Not connected (per datasheet) |
| ピン 33 | /WE — Write enable |
| ピン 34 | ALE — Address latch enable |
| ピン 35 | CLE — Command latch enable |
| ピン 36 | /WP — Write protect (active low) |
| ピン 37 | VCC — Power supply |
| ピン 38 | NC — Not connected (per datasheet) |
| ピン 39 | I/O7 — Data input/output bit 7 |
| ピン 40 | I/O6 — Data input/output bit 6 |
| ピン 41 | I/O5 — Data input/output bit 5 |
| ピン 42 | I/O4 — Data input/output bit 4 |
| ピン 43 | I/O3 — Data input/output bit 3 |
| ピン 44 | I/O2 — Data input/output bit 2 |
| ピン 45 | I/O1 — Data input/output bit 1 |
| ピン 46 | I/O0 — Data input/output bit 0 / I/O0-7 LSB |
| ピン 47 | NC — Not connected (per datasheet) |
| ピン 48 | NC — Not connected (per datasheet) |
主な用途
K9PDG08U5M の用途: 6 件s: Solid-State Storage Modules, Industrial Data Loggers, Set-Top Boxes and Consumer Electronics, Embedded Boot Code Storage, USB Flash Drives and Memory Cards, Networking and Telecom Equipment.
Solid-State Storage Modules
The K9PDG08U5M's 4Gbit SLC array in a TSOP1-48 package is well suited to compact solid-state storage modules such as IDE/CF adapters and embedded storage boards. Its x8 multiplexed interface connects directly to common NAND controllers, and SLC operation delivers higher endurance and deterministic timing than MLC, important for module write-life guarantees. Designers typically parallel or cascade multiple devices behind a controller with BCH ECC and wear-leveling firmware; the 3.3V rail and standard K9 command set minimize board and firmware changes when scaling capacity across Samsung generations.
おすすめ
Industrial Data Loggers
Industrial data loggers benefit from the K9PDG08U5M's SLC endurance and 3.3V operation in harsh environments where repeated logging cycles wear out MLC media faster. The 48-pin TSOP1 footprint mounts on standard industrial PCBs, and the R/B output allows interrupt-driven logging on MCU platforms, reducing polling overhead. With host-side ECC, bad-block management, and wear leveling, the 512MByte array holds years of sensor data; the /WP pin protects stored logs during brownout or tamper conditions, a common requirement in utility and field-instrumentation designs.
おすすめ
Set-Top Boxes and Consumer Electronics
Set-top boxes and consumer media devices use the K9PDG08U5M to store firmware, channel databases, and application code. The standard K9 asynchronous NAND command set is supported by all major SoC boot-ROMs, allowing direct XIP-free boot from NAND, and the 3.3V I/O matches typical consumer board rails without level shifting. Because the device is SLC, boot-code integrity is higher than on MLC at low cost. Designers reserve spare area for ECC and keep a golden firmware copy, leveraging bad-block skipping in the boot loader for long product lifetimes.
おすすめ
Embedded Boot Code Storage
The K9PDG08U5M serves as boot and configuration storage in embedded processors whose boot ROM loads code from raw NAND. Its predictable SLC timing and standard 00h/30h read command sequence simplify first-stage loader implementation, and the factory bad-block markers let boot ROMs skip defective blocks deterministically. The 512MByte capacity comfortably holds bootloader, kernel, and file-system images. A pull-up on R/B and correct CLE/ALE timing per the Samsung datasheet AC tables are the key hardware requirements for reliable cold-boot behavior.
おすすめ
USB Flash Drives and Memory Cards
Removable media products such as USB flash drives and card modules historically used the K9PDG08U5M-class 4Gbit SLC NAND behind a UFI/SD controller. SLC construction gives faster sustained write speeds and longer card life than consumer MLC, valuable in ruggedized or professional media variants. The controller performs ECC, wear leveling, and bad-block remapping transparently. The TSOP1-48 footprint supports automated assembly in thin card form factors, and the 3.3V supply integrates directly with card power switches and level translators for dual-voltage card interfaces.
おすすめ
Networking and Telecom Equipment
Routers, switches, and telecom line cards use the K9PDG08U5M to store firmware images, configuration files, and event logs. SLC reliability reduces field-failure risk in always-on equipment where MLC retention under heat is marginal, and the 4Gbit density accommodates dual-firmware A/B update schemes for safe over-the-network upgrades. The standard K9 command set is supported by common networking SoCs, and 3.3V operation fits telecom board power budgets. Designers pair the device with a supervisor/reset IC and hold /WP asserted during power-up to protect the golden image.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: K9PDG08U5M — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | K9MDG08U5M | K9F2808Q0B | K9XXG08U0M | K9XXG08UXM | K9F6408U0B |
|---|---|---|---|---|---|---|
| Package | TSOP1-48 | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Organization | x8 | x8 | x8 | x8 | x8 | x8 |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Supply Voltage | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class |
| Interface | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE (faster EDO timing) | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE |
主な差別化要因
- 4Gbit SLC density in the standard footprint （vs K9F2808Q0B)
- SLC endurance vs newer-generation parts （vs K9XXG08UXM)
- Honest trade-off: EOL sourcing risk （vs K9MDG08U5M)
設計ノート
Use the standard JEDEC TSOP1-48 land pattern for the K9PDG08U5M and place 0.1uF ceramic decoupling capacitors within 3-5 mm of each VCC/VSS pair, plus 10uF bulk capacitance near the device. NAND flash draws short, high-current bursts during program and erase operations; insufficient decoupling manifests as intermittent program failures and ECC errors rather than hard faults. Because same-family drop-ins (K9MDG08U5M, K9XXG08U0M) share the footprint, layout reuse across densities is safe.
The R/B output is open-drain and requires a pull-up resistor (typically 10k to VCC). Keep CLE, ALE, /CE, /RE, /WE trace lengths matched and short; the asynchronous interface tolerates modest skew, but clocking /RE beyond datasheet tRC limits causes read-corruption at higher temperatures. Avoid routing I/O0-I/O7 adjacent to switching-regulator nodes to prevent glitch-induced latch errors during the command phase.
Do not assume bad blocks are blank: the factory marks initial bad blocks in the first page of each block, and host software must scan and skip them before any erase. Never erase a block containing a factory bad-block marker, and never rely on block 0 being defect-free without checking (Samsung guarantees valid block 0 on this generation, but firmware should still verify). Always enable ECC on both main and spare area, and assert /WP during power transitions to prevent spurious programs.
コンプライアンス情報
Compliance data was not present in the provided verified web data; consult the Samsung product page or datasheet for RoHS/REACH status of the specific orderable suffix (e.g., K9PDG08U5M-LCB0).
