K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics
N.º da peça: K9PDG08U5M ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.68 | $2.340,00 |
| 1.000 | $4.2 | $4.200,00 |
K9PDG08U5M Visão geral
NAND flash is a type of non-volatile memory that stores data in memory cells arranged in series, enabling very high density and low cost per bit compared to NOR flash. Within the memory hierarchy, NAND flash sits in the solid-state storage class, bridging volatile DRAM and permanent system firmware. It is accessed over an asynchronous 8-bit multiplexed address/data bus with command, address latch enable (CLE/ALE) control, making it the dominant storage medium for embedded systems, SSDs, and memory cards.
Key characteristics of the K9PDG08U5M include its x8 multiplexed I/O interface, page-based program and block-based erase operation, and a 3.3V (2.7V to 3.6V) supply rail. The device uses the industry-standard NAND command set (00h-10h page program, 00h-30h page read, 60h-44h block erase per common Samsung conventions), simplifying controller design and software reuse across Samsung NAND generations.
Architecturally, the device organizes the 4Gbit array into pages and blocks with a spare area per page for ECC data. Because it is SLC (single-level cell), each cell stores one bit, giving higher endurance and faster access than MLC parts of the same family - a key advantage for industrial and code-storage designs. Ready/Busy (R/B) signaling with open-drain output supports polled or interrupt-driven operation.
Typical applications include solid-state drives, USB flash drives, memory cards, set-top boxes, industrial data loggers, and embedded boot code storage where reliability and endurance matter.
Design consideration: NAND flash requires error correction code (ECC) - implement Hamming or BCH ECC in the host controller and manage bad blocks per Samsung's bad-block management guidelines; the spare area must be reserved for ECC and bad-block markers.
This page synthesizes distributor sourcing data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing freshness signals as of 2026-09-04.
Alternativas drop-in para K9PDG08U5M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K9PDG08U5M (mesmo formato e footprint) — diferindo em Package, Interface, Memory Type, Cell Type, Density.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K9MDG08U5M
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$35.5 / unidade
Ver ficha técnica →K9F2808Q0B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →K9XXG08U0M
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.6 / unidade
Ver ficha técnica →K9XXG08UXM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →K9F6408U0B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.2 / unidade
Ver ficha técnica →K9PDG08U5M Especificações
| Tipo de memória | NAND Flash (SLC) |
| Density | 4 Gbit |
| Organização da memória | x8 (multiplexed I/O) |
| Encapsulamento | TSOP1-48 |
| Tipo de montagem | Surface Mount |
| Access Interface | Asynchronous multiplexed address/data, CLE/ALE control |
| Ready/Busy Output | Yes (R/B, open-drain) |
| Write Protect Pin | Yes (/WP) |
Configuração de pinos do K9PDG08U5M
| Pino 1 | NC — Not connected (per datasheet) |
| Pino 2 | NC — Not connected (per datasheet) |
| Pino 3 | NC — Not connected (per datasheet) |
| Pino 4 | NC — Not connected (per datasheet) |
| Pino 5 | NC — Not connected (per datasheet) |
| Pino 6 | NC — Not connected (per datasheet) |
| Pino 7 | NC — Not connected (per datasheet) |
| Pino 8 | NC — Not connected (per datasheet) |
| Pino 9 | NC — Not connected (per datasheet) |
| Pino 10 | NC — Not connected (per datasheet) |
| Pino 11 | NC — Not connected (per datasheet) |
| Pino 12 | NC — Not connected (per datasheet) |
| Pino 13 | R/B — Ready/Busy output (open-drain) |
| Pino 14 | /RE — Read enable |
| Pino 15 | /CE — Chip enable |
| Pino 16 | NC — Not connected (per datasheet) |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | VSS — Ground |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | NC — Not connected (per datasheet) |
| Pino 33 | /WE — Write enable |
| Pino 34 | ALE — Address latch enable |
| Pino 35 | CLE — Command latch enable |
| Pino 36 | /WP — Write protect (active low) |
| Pino 37 | VCC — Power supply |
| Pino 38 | NC — Not connected (per datasheet) |
| Pino 39 | I/O7 — Data input/output bit 7 |
| Pino 40 | I/O6 — Data input/output bit 6 |
| Pino 41 | I/O5 — Data input/output bit 5 |
| Pino 42 | I/O4 — Data input/output bit 4 |
| Pino 43 | I/O3 — Data input/output bit 3 |
| Pino 44 | I/O2 — Data input/output bit 2 |
| Pino 45 | I/O1 — Data input/output bit 1 |
| Pino 46 | I/O0 — Data input/output bit 0 / I/O0-7 LSB |
| Pino 47 | NC — Not connected (per datasheet) |
| Pino 48 | NC — Not connected (per datasheet) |
Aplicações típicas
K9PDG08U5M é adequado para 6 aplicaçãos: Solid-State Storage Modules, Industrial Data Loggers, Set-Top Boxes and Consumer Electronics, Embedded Boot Code Storage, USB Flash Drives and Memory Cards, Networking and Telecom Equipment.
Solid-State Storage Modules
The K9PDG08U5M's 4Gbit SLC array in a TSOP1-48 package is well suited to compact solid-state storage modules such as IDE/CF adapters and embedded storage boards. Its x8 multiplexed interface connects directly to common NAND controllers, and SLC operation delivers higher endurance and deterministic timing than MLC, important for module write-life guarantees. Designers typically parallel or cascade multiple devices behind a controller with BCH ECC and wear-leveling firmware; the 3.3V rail and standard K9 command set minimize board and firmware changes when scaling capacity across Samsung generations.
Recomendado
Industrial Data Loggers
Industrial data loggers benefit from the K9PDG08U5M's SLC endurance and 3.3V operation in harsh environments where repeated logging cycles wear out MLC media faster. The 48-pin TSOP1 footprint mounts on standard industrial PCBs, and the R/B output allows interrupt-driven logging on MCU platforms, reducing polling overhead. With host-side ECC, bad-block management, and wear leveling, the 512MByte array holds years of sensor data; the /WP pin protects stored logs during brownout or tamper conditions, a common requirement in utility and field-instrumentation designs.
Recomendado
Set-Top Boxes and Consumer Electronics
Set-top boxes and consumer media devices use the K9PDG08U5M to store firmware, channel databases, and application code. The standard K9 asynchronous NAND command set is supported by all major SoC boot-ROMs, allowing direct XIP-free boot from NAND, and the 3.3V I/O matches typical consumer board rails without level shifting. Because the device is SLC, boot-code integrity is higher than on MLC at low cost. Designers reserve spare area for ECC and keep a golden firmware copy, leveraging bad-block skipping in the boot loader for long product lifetimes.
Recomendado
Embedded Boot Code Storage
The K9PDG08U5M serves as boot and configuration storage in embedded processors whose boot ROM loads code from raw NAND. Its predictable SLC timing and standard 00h/30h read command sequence simplify first-stage loader implementation, and the factory bad-block markers let boot ROMs skip defective blocks deterministically. The 512MByte capacity comfortably holds bootloader, kernel, and file-system images. A pull-up on R/B and correct CLE/ALE timing per the Samsung datasheet AC tables are the key hardware requirements for reliable cold-boot behavior.
Recomendado
USB Flash Drives and Memory Cards
Removable media products such as USB flash drives and card modules historically used the K9PDG08U5M-class 4Gbit SLC NAND behind a UFI/SD controller. SLC construction gives faster sustained write speeds and longer card life than consumer MLC, valuable in ruggedized or professional media variants. The controller performs ECC, wear leveling, and bad-block remapping transparently. The TSOP1-48 footprint supports automated assembly in thin card form factors, and the 3.3V supply integrates directly with card power switches and level translators for dual-voltage card interfaces.
Recomendado
Networking and Telecom Equipment
Routers, switches, and telecom line cards use the K9PDG08U5M to store firmware images, configuration files, and event logs. SLC reliability reduces field-failure risk in always-on equipment where MLC retention under heat is marginal, and the 4Gbit density accommodates dual-firmware A/B update schemes for safe over-the-network upgrades. The standard K9 command set is supported by common networking SoCs, and 3.3V operation fits telecom board power budgets. Designers pair the device with a supervisor/reset IC and hold /WP asserted during power-up to protect the golden image.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K9PDG08U5M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K9MDG08U5M | K9F2808Q0B | K9XXG08U0M | K9XXG08UXM | K9F6408U0B |
|---|---|---|---|---|---|---|
| Package | TSOP1-48 | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same | TSOP1-48 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Organization | x8 | x8 | x8 | x8 | x8 | x8 |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Supply Voltage | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class | 3.3 V class |
| Interface | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE (faster EDO timing) | Asynchronous NAND, CLE/ALE | Asynchronous NAND, CLE/ALE |
Principais diferenciais
- 4Gbit SLC density in the standard footprint (vs K9F2808Q0B)
- SLC endurance vs newer-generation parts (vs K9XXG08UXM)
- Honest trade-off: EOL sourcing risk (vs K9MDG08U5M)
Notas de projeto
Use the standard JEDEC TSOP1-48 land pattern for the K9PDG08U5M and place 0.1uF ceramic decoupling capacitors within 3-5 mm of each VCC/VSS pair, plus 10uF bulk capacitance near the device. NAND flash draws short, high-current bursts during program and erase operations; insufficient decoupling manifests as intermittent program failures and ECC errors rather than hard faults. Because same-family drop-ins (K9MDG08U5M, K9XXG08U0M) share the footprint, layout reuse across densities is safe.
The R/B output is open-drain and requires a pull-up resistor (typically 10k to VCC). Keep CLE, ALE, /CE, /RE, /WE trace lengths matched and short; the asynchronous interface tolerates modest skew, but clocking /RE beyond datasheet tRC limits causes read-corruption at higher temperatures. Avoid routing I/O0-I/O7 adjacent to switching-regulator nodes to prevent glitch-induced latch errors during the command phase.
Do not assume bad blocks are blank: the factory marks initial bad blocks in the first page of each block, and host software must scan and skip them before any erase. Never erase a block containing a factory bad-block marker, and never rely on block 0 being defect-free without checking (Samsung guarantees valid block 0 on this generation, but firmware should still verify). Always enable ECC on both main and spare area, and assert /WP during power transitions to prevent spurious programs.
Informações de conformidade
Compliance data was not present in the provided verified web data; consult the Samsung product page or datasheet for RoHS/REACH status of the specific orderable suffix (e.g., K9PDG08U5M-LCB0).
