NT5CC256M16DN-FLNA - 4Gb DDR3L SDRAM | Nanya Technology
Teilenummer: NT5CC256M16DN-FLNA ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $6 | $6.000,00 |
NT5CC256M16DN-FLNA Übersicht
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20-30% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in laptops, embedded systems, and networking equipment.
Key features include a data rate of 1600 Mbps (PC3-12800) with a CL of 11, a burst length of 8, and on-die termination (ODT) for signal integrity. The device supports auto-refresh and self-refresh modes, and includes programmable CAS latency and additive latency. It is available in a 96-ball FBGA package, which is standard for DDR3L SDRAM.
The NT5CC256M16DN-FLNA uses a 30nm-class process technology, offering high density and low power consumption. It features a 16-bit I/O interface, which is ideal for applications requiring moderate bandwidth with lower pin count. The device includes a temperature sensor for thermal management and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded computing, industrial automation, automotive infotainment, networking equipment, and consumer electronics such as set-top boxes and routers. Its low voltage and wide temperature range make it suitable for battery-powered and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable power supply and proper termination for the address/control lines.
Drop-in-Alternativen für NT5CC256M16DN-FLNA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit NT5CC256M16DN-FLNA (gleiche Bauform und Footprint) – abweichend in Package, CAS Latency, Data Rate, Refresh, Burst Length.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
NT5CC256M16ER-FLNA
✅ Drop-In✓ Auf Lager
$22 / Stück
Datenblatt ansehen →NT5CC256M16DP-FLNA
✅ Drop-In✓ Auf Lager
$20 / Stück
Datenblatt ansehen →NT5CC256M16CP-FLNA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
NT5CC256M16ER-EK
✅ Drop-In✓ Auf Lager
$24 / Stück
Datenblatt ansehen →MT41K256M16HA-125
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.3636 / Stück
Datenblatt ansehen →K4B4G1646D-BYH9
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.3 / Stück
Datenblatt ansehen →NT5CC256M16DN-FLNA Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR3L SDRAM |
| Density | 4Gb |
| Speicherorganisation | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (1.283V-1.45V) |
| Backward Compatible Voltage | 1.5V ±0.075V |
| Datenrate | 1600 Mbps (PC3-12800) |
| CAS-Latenz | 11 |
| Burst Length | 8 |
| Gehäuse | 96-ball FBGA |
| Betriebstemperaturbereich | Commercial: 0°C to +95°C (Tcase), Industrial: -40°C to +95°C (Tcase), Automotive: -40°C to +105°C (Tcase) |
| Schnittstelle | 16-bit I/O |
| Refresh | Auto-refresh and self-refresh |
| On-Die Termination (ODT) | Yes |
| DLL | Yes |
| RoHS | Compliant |
NT5CC256M16DN-FLNA Pin-Konfiguration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin A13 | VDD — Power supply |
| Pin A14 | DQ8 — Data input/output 8 |
| Pin A15 | DQ9 — Data input/output 9 |
| Pin A16 | VSS — Ground |
| Pin A17 | DQ10 — Data input/output 10 |
| Pin A18 | DQ11 — Data input/output 11 |
| Pin A19 | VDDQ — I/O power supply |
| Pin A20 | DQ12 — Data input/output 12 |
| Pin A21 | DQ13 — Data input/output 13 |
| Pin A22 | VSS — Ground |
| Pin A23 | DQ14 — Data input/output 14 |
| Pin A24 | DQ15 — Data input/output 15 |
| Pin B1 | VSS — Ground |
| Pin B2 | VDD — Power supply |
| Pin B3 | VSS — Ground |
| Pin B4 | VDD — Power supply |
| Pin B5 | VSS — Ground |
| Pin B6 | VDD — Power supply |
| Pin B7 | VSS — Ground |
| Pin B8 | VDD — Power supply |
| Pin B9 | VSS — Ground |
| Pin B10 | VDD — Power supply |
| Pin B11 | VSS — Ground |
| Pin B12 | VDD — Power supply |
| Pin B13 | VSS — Ground |
| Pin B14 | VDD — Power supply |
| Pin B15 | VSS — Ground |
| Pin B16 | VDD — Power supply |
| Pin B17 | VSS — Ground |
| Pin B18 | VDD — Power supply |
| Pin B19 | VSS — Ground |
| Pin B20 | VDD — Power supply |
| Pin B21 | VSS — Ground |
| Pin B22 | VDD — Power supply |
| Pin B23 | VSS — Ground |
| Pin B24 | VDD — Power supply |
| Pin C1 | A0 — Address input 0 |
| Pin C2 | A1 — Address input 1 |
| Pin C3 | A2 — Address input 2 |
| Pin C4 | A3 — Address input 3 |
| Pin C5 | A4 — Address input 4 |
| Pin C6 | A5 — Address input 5 |
| Pin C7 | A6 — Address input 6 |
| Pin C8 | A7 — Address input 7 |
| Pin C9 | A8 — Address input 8 |
| Pin C10 | A9 — Address input 9 |
| Pin C11 | A10/AP — Address input 10 / Auto-precharge |
| Pin C12 | A11 — Address input 11 |
| Pin C13 | A12 — Address input 12 |
| Pin C14 | A13 — Address input 13 |
| Pin C15 | A14 — Address input 14 |
| Pin C16 | A15 — Address input 15 |
| Pin C17 | BA0 — Bank address 0 |
| Pin C18 | BA1 — Bank address 1 |
| Pin C19 | BA2 — Bank address 2 |
| Pin C20 | RAS# — Row address strobe |
| Pin C21 | CAS# — Column address strobe |
| Pin C22 | WE# — Write enable |
| Pin C23 | CS# — Chip select |
| Pin C24 | ODT — On-die termination |
| Pin D1 | VDDQ — I/O power supply |
| Pin D2 | VSSQ — I/O ground |
| Pin D3 | VDDQ — I/O power supply |
| Pin D4 | VSSQ — I/O ground |
| Pin D5 | VDDQ — I/O power supply |
| Pin D6 | VSSQ — I/O ground |
| Pin D7 | VDDQ — I/O power supply |
| Pin D8 | VSSQ — I/O ground |
| Pin D9 | VDDQ — I/O power supply |
| Pin D10 | VSSQ — I/O ground |
| Pin D11 | VDDQ — I/O power supply |
| Pin D12 | VSSQ — I/O ground |
| Pin D13 | VDDQ — I/O power supply |
| Pin D14 | VSSQ — I/O ground |
| Pin D15 | VDDQ — I/O power supply |
| Pin D16 | VSSQ — I/O ground |
| Pin D17 | VDDQ — I/O power supply |
| Pin D18 | VSSQ — I/O ground |
| Pin D19 | VDDQ — I/O power supply |
| Pin D20 | VSSQ — I/O ground |
| Pin D21 | VDDQ — I/O power supply |
| Pin D22 | VSSQ — I/O ground |
| Pin D23 | VDDQ — I/O power supply |
| Pin D24 | VSSQ — I/O ground |
| Pin E1 | CK — Clock input |
| Pin E2 | CK# — Complementary clock input |
| Pin E3 | CKE — Clock enable |
| Pin E4 | RESET# — Reset |
| Pin E5 | VREFCA — Reference voltage for command/address |
| Pin E6 | VREFDQ — Reference voltage for data |
| Pin E7 | ZQ — Calibration reference |
| Pin E8 | TDQS — Termination data strobe |
| Pin E9 | DM0 — Data mask 0 |
| Pin E10 | DQS0 — Data strobe 0 |
| Pin E11 | DQS0# — Complementary data strobe 0 |
| Pin E12 | DM1 — Data mask 1 |
| Pin E13 | DQS1 — Data strobe 1 |
| Pin E14 | DQS1# — Complementary data strobe 1 |
| Pin E15 | DM2 — Data mask 2 |
| Pin E16 | DQS2 — Data strobe 2 |
| Pin E17 | DQS2# — Complementary data strobe 2 |
| Pin E18 | DM3 — Data mask 3 |
| Pin E19 | DQS3 — Data strobe 3 |
| Pin E20 | DQS3# — Complementary data strobe 3 |
| Pin E21 | VSS — Ground |
| Pin E22 | VDD — Power supply |
| Pin E23 | VSS — Ground |
| Pin E24 | VDD — Power supply |
Typische Anwendungen
NT5CC256M16DN-FLNA ist geeignet für 6 Anwendungs: Embedded Computing, Industrial Automation, Automotive Infotainment, Networking Equipment, Consumer Electronics, IoT Gateways.
Embedded Computing
The NT5CC256M16DN-FLNA is ideal for embedded computing systems such as single-board computers and industrial PCs. Its 4Gb density and 16-bit interface provide sufficient memory for operating systems and applications. The low 1.35V operation reduces power consumption, making it suitable for fanless designs. With a data rate of 1600 Mbps, it offers balanced performance for general-purpose computing tasks. The wide temperature range supports industrial environments.
Empfohlen
Industrial Automation
In industrial automation, the NT5CC256M16DN-FLNA provides reliable memory for PLCs, HMIs, and robotic controllers. Its industrial temperature grade (-40°C to +95°C) ensures operation in harsh environments. The 1.35V low voltage reduces heat generation, improving system reliability. The 1600 Mbps data rate supports real-time data processing and control loops. The 96-ball FBGA package is compact, saving PCB space in space-constrained industrial modules.
Empfohlen
Automotive Infotainment
The NT5CC256M16DN-FLNA is suitable for automotive infotainment systems, including head units and telematics. Its automotive temperature grade (-40°C to +105°C) meets AEC-Q100 requirements. The low voltage operation is compatible with automotive power rails. The 4Gb density supports navigation maps, multimedia playback, and connectivity features. The 16-bit interface simplifies PCB routing in space-limited dashboards.
Empfohlen
Networking Equipment
For networking equipment such as routers, switches, and firewalls, the NT5CC256M16DN-FLNA provides high-bandwidth memory for packet buffering and routing tables. Its 1600 Mbps data rate ensures fast data throughput. The low 1.35V operation reduces power consumption in always-on devices. The 4Gb density is adequate for moderate-sized routing tables. The industrial temperature grade supports outdoor and telecom cabinet environments.
Empfohlen
Consumer Electronics
The NT5CC256M16DN-FLNA is used in consumer electronics like set-top boxes, smart TVs, and gaming consoles. Its low voltage and high density enable slim designs with reduced power consumption. The 1600 Mbps data rate supports HD video streaming and multitasking. The 96-ball FBGA package is suitable for compact PCBs. The commercial temperature grade covers typical home environments.
Empfohlen
IoT Gateways
In IoT gateways, the NT5CC256M16DN-FLNA provides memory for protocol processing, data aggregation, and edge computing. Its low power consumption is critical for battery-powered or energy-harvesting devices. The 4Gb density supports multiple sensor data streams. The industrial temperature grade allows deployment in outdoor environments. The 16-bit interface reduces pin count, simplifying design for compact gateway modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für NT5CC256M16DN-FLNA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | NT5CC256M16ER-FLNA | NT5CC256M16DP-FLNA | NT5CC256M16CP-FLNA | MT41K256M16HA-125 | K4B4G1646D-BYH9 |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Micron Technology | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| CAS Latency | 11 | 13 | 13 | 13 | 11 | 11 |
| Temperature Grade | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial | Commercial, Industrial |
Wichtigste Unterscheidungsmerkmale
- Wide temperature range (vs. MT41K256M16HA-125)
- Lower power consumption (vs. K4B4G1646D-BYH9)
- Higher speed grade (vs. NT5CC256M16ER-FLNA)
Designhinweise
Ensure stable power supply with proper decoupling. Use 0.1uF ceramic capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the device. The 1.35V supply should have low ripple to maintain signal integrity. Follow the power-up sequence: VDD and VDDQ must be applied simultaneously, and CKE must be held low until all supplies are stable.
Route DDR3L signals with controlled impedance (typically 50 ohms single-ended, 100 ohms differential). Keep trace lengths matched for DQ, DQS, and address/control signals. Use ground planes to minimize noise. Place the device close to the controller to reduce trace lengths. Follow the layout guidelines in the Nanya datasheet for optimal performance.
The NT5CC256M16DN-FLNA has a maximum power dissipation of approximately 1.5W at 1600 Mbps. Ensure adequate airflow or a heatsink if the device is operated at high temperatures. The thermal resistance (theta_JA) is typically 35°C/W for the FBGA package. Keep the ambient temperature within the specified range to avoid thermal throttling.
Compliance-Informationen
RoHS compliant per Nanya product page. AEC-Q100 qualified for automotive grade. REACH and conflict minerals status not specified in provided data.
