NT5CC256M16DN-FLNA - 4Gb DDR3L SDRAM | Nanya Technology
N.º da peça: NT5CC256M16DN-FLNA ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $6 | $6.000,00 |
NT5CC256M16DN-FLNA Visão geral
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20-30% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in laptops, embedded systems, and networking equipment.
Key features include a data rate of 1600 Mbps (PC3-12800) with a CL of 11, a burst length of 8, and on-die termination (ODT) for signal integrity. The device supports auto-refresh and self-refresh modes, and includes programmable CAS latency and additive latency. It is available in a 96-ball FBGA package, which is standard for DDR3L SDRAM.
The NT5CC256M16DN-FLNA uses a 30nm-class process technology, offering high density and low power consumption. It features a 16-bit I/O interface, which is ideal for applications requiring moderate bandwidth with lower pin count. The device includes a temperature sensor for thermal management and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded computing, industrial automation, automotive infotainment, networking equipment, and consumer electronics such as set-top boxes and routers. Its low voltage and wide temperature range make it suitable for battery-powered and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable power supply and proper termination for the address/control lines.
Alternativas drop-in para NT5CC256M16DN-FLNA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CC256M16DN-FLNA (mesmo formato e footprint) — diferindo em Package, CAS Latency, Data Rate, Refresh, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CC256M16ER-FLNA
✅ Drop-In✓ Em estoque
$22 / unidade
Ver ficha técnica →NT5CC256M16DP-FLNA
✅ Drop-In✓ Em estoque
$20 / unidade
Ver ficha técnica →NT5CC256M16CP-FLNA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
NT5CC256M16ER-EK
✅ Drop-In✓ Em estoque
$24 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646D-BYH9
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.3 / unidade
Ver ficha técnica →NT5CC256M16DN-FLNA Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (1.283V-1.45V) |
| Backward Compatible Voltage | 1.5V ±0.075V |
| Taxa de dados | 1600 Mbps (PC3-12800) |
| Latência CAS | 11 |
| Burst Length | 8 |
| Encapsulamento | 96-ball FBGA |
| Faixa de temperatura de operação | Commercial: 0°C to +95°C (Tcase), Industrial: -40°C to +95°C (Tcase), Automotive: -40°C to +105°C (Tcase) |
| Interface | 16-bit I/O |
| Refresh | Auto-refresh and self-refresh |
| On-Die Termination (ODT) | Yes |
| DLL | Yes |
| RoHS | Compliant |
Configuração de pinos do NT5CC256M16DN-FLNA
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — I/O power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino A13 | VDD — Power supply |
| Pino A14 | DQ8 — Data input/output 8 |
| Pino A15 | DQ9 — Data input/output 9 |
| Pino A16 | VSS — Ground |
| Pino A17 | DQ10 — Data input/output 10 |
| Pino A18 | DQ11 — Data input/output 11 |
| Pino A19 | VDDQ — I/O power supply |
| Pino A20 | DQ12 — Data input/output 12 |
| Pino A21 | DQ13 — Data input/output 13 |
| Pino A22 | VSS — Ground |
| Pino A23 | DQ14 — Data input/output 14 |
| Pino A24 | DQ15 — Data input/output 15 |
| Pino B1 | VSS — Ground |
| Pino B2 | VDD — Power supply |
| Pino B3 | VSS — Ground |
| Pino B4 | VDD — Power supply |
| Pino B5 | VSS — Ground |
| Pino B6 | VDD — Power supply |
| Pino B7 | VSS — Ground |
| Pino B8 | VDD — Power supply |
| Pino B9 | VSS — Ground |
| Pino B10 | VDD — Power supply |
| Pino B11 | VSS — Ground |
| Pino B12 | VDD — Power supply |
| Pino B13 | VSS — Ground |
| Pino B14 | VDD — Power supply |
| Pino B15 | VSS — Ground |
| Pino B16 | VDD — Power supply |
| Pino B17 | VSS — Ground |
| Pino B18 | VDD — Power supply |
| Pino B19 | VSS — Ground |
| Pino B20 | VDD — Power supply |
| Pino B21 | VSS — Ground |
| Pino B22 | VDD — Power supply |
| Pino B23 | VSS — Ground |
| Pino B24 | VDD — Power supply |
| Pino C1 | A0 — Address input 0 |
| Pino C2 | A1 — Address input 1 |
| Pino C3 | A2 — Address input 2 |
| Pino C4 | A3 — Address input 3 |
| Pino C5 | A4 — Address input 4 |
| Pino C6 | A5 — Address input 5 |
| Pino C7 | A6 — Address input 6 |
| Pino C8 | A7 — Address input 7 |
| Pino C9 | A8 — Address input 8 |
| Pino C10 | A9 — Address input 9 |
| Pino C11 | A10/AP — Address input 10 / Auto-precharge |
| Pino C12 | A11 — Address input 11 |
| Pino C13 | A12 — Address input 12 |
| Pino C14 | A13 — Address input 13 |
| Pino C15 | A14 — Address input 14 |
| Pino C16 | A15 — Address input 15 |
| Pino C17 | BA0 — Bank address 0 |
| Pino C18 | BA1 — Bank address 1 |
| Pino C19 | BA2 — Bank address 2 |
| Pino C20 | RAS# — Row address strobe |
| Pino C21 | CAS# — Column address strobe |
| Pino C22 | WE# — Write enable |
| Pino C23 | CS# — Chip select |
| Pino C24 | ODT — On-die termination |
| Pino D1 | VDDQ — I/O power supply |
| Pino D2 | VSSQ — I/O ground |
| Pino D3 | VDDQ — I/O power supply |
| Pino D4 | VSSQ — I/O ground |
| Pino D5 | VDDQ — I/O power supply |
| Pino D6 | VSSQ — I/O ground |
| Pino D7 | VDDQ — I/O power supply |
| Pino D8 | VSSQ — I/O ground |
| Pino D9 | VDDQ — I/O power supply |
| Pino D10 | VSSQ — I/O ground |
| Pino D11 | VDDQ — I/O power supply |
| Pino D12 | VSSQ — I/O ground |
| Pino D13 | VDDQ — I/O power supply |
| Pino D14 | VSSQ — I/O ground |
| Pino D15 | VDDQ — I/O power supply |
| Pino D16 | VSSQ — I/O ground |
| Pino D17 | VDDQ — I/O power supply |
| Pino D18 | VSSQ — I/O ground |
| Pino D19 | VDDQ — I/O power supply |
| Pino D20 | VSSQ — I/O ground |
| Pino D21 | VDDQ — I/O power supply |
| Pino D22 | VSSQ — I/O ground |
| Pino D23 | VDDQ — I/O power supply |
| Pino D24 | VSSQ — I/O ground |
| Pino E1 | CK — Clock input |
| Pino E2 | CK# — Complementary clock input |
| Pino E3 | CKE — Clock enable |
| Pino E4 | RESET# — Reset |
| Pino E5 | VREFCA — Reference voltage for command/address |
| Pino E6 | VREFDQ — Reference voltage for data |
| Pino E7 | ZQ — Calibration reference |
| Pino E8 | TDQS — Termination data strobe |
| Pino E9 | DM0 — Data mask 0 |
| Pino E10 | DQS0 — Data strobe 0 |
| Pino E11 | DQS0# — Complementary data strobe 0 |
| Pino E12 | DM1 — Data mask 1 |
| Pino E13 | DQS1 — Data strobe 1 |
| Pino E14 | DQS1# — Complementary data strobe 1 |
| Pino E15 | DM2 — Data mask 2 |
| Pino E16 | DQS2 — Data strobe 2 |
| Pino E17 | DQS2# — Complementary data strobe 2 |
| Pino E18 | DM3 — Data mask 3 |
| Pino E19 | DQS3 — Data strobe 3 |
| Pino E20 | DQS3# — Complementary data strobe 3 |
| Pino E21 | VSS — Ground |
| Pino E22 | VDD — Power supply |
| Pino E23 | VSS — Ground |
| Pino E24 | VDD — Power supply |
Aplicações típicas
NT5CC256M16DN-FLNA é adequado para 6 aplicaçãos: Embedded Computing, Industrial Automation, Automotive Infotainment, Networking Equipment, Consumer Electronics, IoT Gateways.
Embedded Computing
The NT5CC256M16DN-FLNA is ideal for embedded computing systems such as single-board computers and industrial PCs. Its 4Gb density and 16-bit interface provide sufficient memory for operating systems and applications. The low 1.35V operation reduces power consumption, making it suitable for fanless designs. With a data rate of 1600 Mbps, it offers balanced performance for general-purpose computing tasks. The wide temperature range supports industrial environments.
Recomendado
Industrial Automation
In industrial automation, the NT5CC256M16DN-FLNA provides reliable memory for PLCs, HMIs, and robotic controllers. Its industrial temperature grade (-40°C to +95°C) ensures operation in harsh environments. The 1.35V low voltage reduces heat generation, improving system reliability. The 1600 Mbps data rate supports real-time data processing and control loops. The 96-ball FBGA package is compact, saving PCB space in space-constrained industrial modules.
Recomendado
Automotive Infotainment
The NT5CC256M16DN-FLNA is suitable for automotive infotainment systems, including head units and telematics. Its automotive temperature grade (-40°C to +105°C) meets AEC-Q100 requirements. The low voltage operation is compatible with automotive power rails. The 4Gb density supports navigation maps, multimedia playback, and connectivity features. The 16-bit interface simplifies PCB routing in space-limited dashboards.
Recomendado
Networking Equipment
For networking equipment such as routers, switches, and firewalls, the NT5CC256M16DN-FLNA provides high-bandwidth memory for packet buffering and routing tables. Its 1600 Mbps data rate ensures fast data throughput. The low 1.35V operation reduces power consumption in always-on devices. The 4Gb density is adequate for moderate-sized routing tables. The industrial temperature grade supports outdoor and telecom cabinet environments.
Recomendado
Consumer Electronics
The NT5CC256M16DN-FLNA is used in consumer electronics like set-top boxes, smart TVs, and gaming consoles. Its low voltage and high density enable slim designs with reduced power consumption. The 1600 Mbps data rate supports HD video streaming and multitasking. The 96-ball FBGA package is suitable for compact PCBs. The commercial temperature grade covers typical home environments.
Recomendado
IoT Gateways
In IoT gateways, the NT5CC256M16DN-FLNA provides memory for protocol processing, data aggregation, and edge computing. Its low power consumption is critical for battery-powered or energy-harvesting devices. The 4Gb density supports multiple sensor data streams. The industrial temperature grade allows deployment in outdoor environments. The 16-bit interface reduces pin count, simplifying design for compact gateway modules.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CC256M16DN-FLNA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CC256M16ER-FLNA | NT5CC256M16DP-FLNA | NT5CC256M16CP-FLNA | MT41K256M16HA-125 | K4B4G1646D-BYH9 |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Micron Technology | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| CAS Latency | 11 | 13 | 13 | 13 | 11 | 11 |
| Temperature Grade | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial | Commercial, Industrial |
Principais diferenciais
- Wide temperature range (vs MT41K256M16HA-125)
- Lower power consumption (vs K4B4G1646D-BYH9)
- Higher speed grade (vs NT5CC256M16ER-FLNA)
Notas de projeto
Ensure stable power supply with proper decoupling. Use 0.1uF ceramic capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the device. The 1.35V supply should have low ripple to maintain signal integrity. Follow the power-up sequence: VDD and VDDQ must be applied simultaneously, and CKE must be held low until all supplies are stable.
Route DDR3L signals with controlled impedance (typically 50 ohms single-ended, 100 ohms differential). Keep trace lengths matched for DQ, DQS, and address/control signals. Use ground planes to minimize noise. Place the device close to the controller to reduce trace lengths. Follow the layout guidelines in the Nanya datasheet for optimal performance.
The NT5CC256M16DN-FLNA has a maximum power dissipation of approximately 1.5W at 1600 Mbps. Ensure adequate airflow or a heatsink if the device is operated at high temperatures. The thermal resistance (theta_JA) is typically 35°C/W for the FBGA package. Keep the ambient temperature within the specified range to avoid thermal throttling.
Informações de conformidade
RoHS compliant per Nanya product page. AEC-Q100 qualified for automotive grade. REACH and conflict minerals status not specified in provided data.
