EP4CE6E22C9L - Cyclone IV E FPGA, 6.3K LE, 144-LQFP | Intel
Référence : EP4CE6E22C9L ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.09 | $14,09 |
| 10 | $12.85 | $128,50 |
| 100 | $11.4 | $1 140,00 |
| 500 | $9.95 | $4 975,00 |
| 1 000 | $8.75 | $8 750,00 |
EP4CE6E22C9L Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O pads that can be reconfigured by the designer after manufacturing. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility for glue logic, digital signal processing, and custom interface bridging.
Key features of the EP4CE6E22C9L include 15 embedded 18x18 multipliers (up to 266 MHz), up to 270 Kbits of distributed RAM, configuration via standard serial/parallel modes, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V interfacing. The device family integrates PLL-based clock management and supports LVDS, SSTL, and LVTTL I/O standards.
The Cyclone IV E architecture uses a 60 nm process and emphasizes low static and dynamic power consumption, making it well-suited for battery-powered and thermally constrained embedded designs. The 144-LQFP exposed-pad package improves thermal dissipation and allows hand-solderable assembly for prototypes and low-volume builds.
Typical applications include industrial control and motor drives, video processing pipelines, software-defined radio front ends, portable test and measurement equipment, and LED display controllers. The combination of 6,272 logic elements and 91 user I/O provides headroom for medium-complexity glue logic, custom peripherals, and parallel DSP functions.
When designing with this device, ensure adequate decoupling on each VCCINT and VCCA rail and follow Intel's pin connection guidelines for the EP4CE6 family. The exposed pad must be soldered to a properly sized copper pour for thermal and electrical performance, especially when running the multipliers near their maximum frequency.
This page synthesizes drop-in alternatives, distributor pricing, and practical design considerations not consolidated in the manufacturer datasheet, helping engineers shorten evaluation cycles and avoid common PCB layout pitfalls.
Alternatives de remplacement direct pour EP4CE6E22C9L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE6E22C9L (même facteur de forme et même empreinte) — différant par Package, Speed Grade, PLLs, RoHS Status, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE6E22C8N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP4CE6E22C7N
✅ Remplacement direct✓ En stock
$18.5 / unité
Voir la fiche technique →EP4CE6E22C6N
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →EP4CE10E22C8N
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP4CE15E22C8N
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →EP4CE6E22A7N
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EP4CE6E22C9L Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Total RAM Bits | 276,480 bits |
| Embedded Multipliers (18x18) | 15 |
| Maximum User I/O | 91 |
| Core Voltage (VCCINT) | 1.2 V |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| Type de montage | Surface Mount |
| Process Node | 60 nm |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Speed Grade | C9 |
| Statut RoHS | Compliant |
Configuration des broches de EP4CE6E22C9L
| Broche 1 | I/O — User I/O pin (bank-specific voltage) |
| Broche 2 | I/O — User I/O pin (bank-specific voltage) |
| Broche 3 | I/O — User I/O pin (bank-specific voltage) |
| Broche 4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 5 | I/O — User I/O pin (bank-specific voltage) |
| Broche 6 | I/O — User I/O pin (bank-specific voltage) |
| Broche 7 | I/O — User I/O pin (bank-specific voltage) |
| Broche 8 | GND — Ground |
| Broche 9 | I/O — User I/O pin (bank-specific voltage) |
| Broche 10 | I/O — User I/O pin (bank-specific voltage) |
| Broche 11 | I/O — User I/O pin (bank-specific voltage) |
| Broche 12 | VCCINT — Core supply voltage (1.2 V) |
| Broche 13 | I/O — User I/O pin (bank-specific voltage) |
| Broche 14 | I/O — User I/O pin (bank-specific voltage) |
| Broche 15 | I/O — User I/O pin (bank-specific voltage) |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O pin (bank-specific voltage) |
| Broche 18 | I/O — User I/O pin (bank-specific voltage) |
| Broche 19 | I/O — User I/O pin (bank-specific voltage) |
| Broche 20 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 21 | I/O — User I/O pin (bank-specific voltage) |
| Broche 22 | I/O — User I/O pin (bank-specific voltage) |
| Broche 23 | I/O — User I/O pin (bank-specific voltage) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank-specific voltage) |
| Broche 26 | I/O — User I/O pin (bank-specific voltage) |
| Broche 27 | I/O — User I/O pin (bank-specific voltage) |
| Broche 28 | VCCINT — Core supply voltage (1.2 V) |
| Broche 29 | I/O — User I/O pin (bank-specific voltage) |
| Broche 30 | I/O — User I/O pin (bank-specific voltage) |
| Broche 31 | I/O — User I/O pin (bank-specific voltage) |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O pin (bank-specific voltage) |
| Broche 34 | I/O — User I/O pin (bank-specific voltage) |
| Broche 35 | I/O — User I/O pin (bank-specific voltage) |
| Broche 36 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 37 | I/O — User I/O pin (bank-specific voltage) |
| Broche 38 | I/O — User I/O pin (bank-specific voltage) |
| Broche 39 | I/O — User I/O pin (bank-specific voltage) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank-specific voltage) |
| Broche 42 | I/O — User I/O pin (bank-specific voltage) |
| Broche 43 | I/O — User I/O pin (bank-specific voltage) |
| Broche 44 | VCCINT — Core supply voltage (1.2 V) |
| Broche 45 | I/O — User I/O pin (bank-specific voltage) |
| Broche 46 | I/O — User I/O pin (bank-specific voltage) |
| Broche 47 | I/O — User I/O pin (bank-specific voltage) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O pin (bank-specific voltage) |
| Broche 50 | I/O — User I/O pin (bank-specific voltage) |
| Broche 51 | I/O — User I/O pin (bank-specific voltage) |
| Broche 52 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 53 | I/O — User I/O pin (bank-specific voltage) |
| Broche 54 | I/O — User I/O pin (bank-specific voltage) |
| Broche 55 | I/O — User I/O pin (bank-specific voltage) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank-specific voltage) |
| Broche 58 | I/O — User I/O pin (bank-specific voltage) |
| Broche 59 | I/O — User I/O pin (bank-specific voltage) |
| Broche 60 | VCCINT — Core supply voltage (1.2 V) |
| Broche 61 | I/O — User I/O pin (bank-specific voltage) |
| Broche 62 | I/O — User I/O pin (bank-specific voltage) |
| Broche 63 | I/O — User I/O pin (bank-specific voltage) |
| Broche 64 | GND — Ground |
| Broche 65 | I/O — User I/O pin (bank-specific voltage) |
| Broche 66 | I/O — User I/O pin (bank-specific voltage) |
| Broche 67 | I/O — User I/O pin (bank-specific voltage) |
| Broche 68 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 69 | I/O — User I/O pin (bank-specific voltage) |
| Broche 70 | I/O — User I/O pin (bank-specific voltage) |
| Broche 71 | I/O — User I/O pin (bank-specific voltage) |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin (bank-specific voltage) |
| Broche 74 | I/O — User I/O pin (bank-specific voltage) |
| Broche 75 | I/O — User I/O pin (bank-specific voltage) |
| Broche 76 | VCCINT — Core supply voltage (1.2 V) |
| Broche 77 | I/O — User I/O pin (bank-specific voltage) |
| Broche 78 | I/O — User I/O pin (bank-specific voltage) |
| Broche 79 | I/O — User I/O pin (bank-specific voltage) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O pin (bank-specific voltage) |
| Broche 82 | I/O — User I/O pin (bank-specific voltage) |
| Broche 83 | I/O — User I/O pin (bank-specific voltage) |
| Broche 84 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 85 | I/O — User I/O pin (bank-specific voltage) |
| Broche 86 | I/O — User I/O pin (bank-specific voltage) |
| Broche 87 | I/O — User I/O pin (bank-specific voltage) |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O pin (bank-specific voltage) |
| Broche 90 | I/O — User I/O pin (bank-specific voltage) |
| Broche 91 | I/O — User I/O pin (bank-specific voltage) |
| Broche 92 | VCCINT — Core supply voltage (1.2 V) |
| Broche 93 | I/O — User I/O pin (bank-specific voltage) |
| Broche 94 | I/O — User I/O pin (bank-specific voltage) |
| Broche 95 | I/O — User I/O pin (bank-specific voltage) |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O pin (bank-specific voltage) |
| Broche 98 | I/O — User I/O pin (bank-specific voltage) |
| Broche 99 | I/O — User I/O pin (bank-specific voltage) |
| Broche 100 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 101 | I/O — User I/O pin (bank-specific voltage) |
| Broche 102 | I/O — User I/O pin (bank-specific voltage) |
| Broche 103 | I/O — User I/O pin (bank-specific voltage) |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O pin (bank-specific voltage) |
| Broche 106 | I/O — User I/O pin (bank-specific voltage) |
| Broche 107 | I/O — User I/O pin (bank-specific voltage) |
| Broche 108 | VCCINT — Core supply voltage (1.2 V) |
| Broche 109 | I/O — User I/O pin (bank-specific voltage) |
| Broche 110 | I/O — User I/O pin (bank-specific voltage) |
| Broche 111 | I/O — User I/O pin (bank-specific voltage) |
| Broche 112 | GND — Ground |
| Broche 113 | I/O — User I/O pin (bank-specific voltage) |
| Broche 114 | I/O — User I/O pin (bank-specific voltage) |
| Broche 115 | I/O — User I/O pin (bank-specific voltage) |
| Broche 116 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 117 | I/O — User I/O pin (bank-specific voltage) |
| Broche 118 | I/O — User I/O pin (bank-specific voltage) |
| Broche 119 | I/O — User I/O pin (bank-specific voltage) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank-specific voltage) |
| Broche 122 | I/O — User I/O pin (bank-specific voltage) |
| Broche 123 | I/O — User I/O pin (bank-specific voltage) |
| Broche 124 | VCCINT — Core supply voltage (1.2 V) |
| Broche 125 | I/O — User I/O pin (bank-specific voltage) |
| Broche 126 | I/O — User I/O pin (bank-specific voltage) |
| Broche 127 | I/O — User I/O pin (bank-specific voltage) |
| Broche 128 | GND — Ground |
| Broche 129 | I/O — User I/O pin (bank-specific voltage) |
| Broche 130 | I/O — User I/O pin (bank-specific voltage) |
| Broche 131 | I/O — User I/O pin (bank-specific voltage) |
| Broche 132 | VCCA_PLL — PLL analog supply voltage |
| Broche 133 | I/O — User I/O pin (bank-specific voltage) |
| Broche 134 | I/O — User I/O pin (bank-specific voltage) |
| Broche 135 | I/O — User I/O pin (bank-specific voltage) |
| Broche 136 | GND — Ground |
| Broche 137 | nCONFIG — Configuration control (active-low) |
| Broche 138 | nSTATUS — Configuration status (active-low) |
| Broche 139 | CONFIG_DONE — Configuration done signal |
| Broche 140 | TCK — JTAG test clock |
| Broche 141 | TMS — JTAG test mode select |
| Broche 142 | TDI — JTAG test data in |
| Broche 143 | TDO — JTAG test data out |
| Broche 144 | EPAD — Exposed thermal pad (tie to GND) |
Applications typiques
EP4CE6E22C9L convient pour 6 applications: Industrial Motor Control (FOC / Servo Drive), LED Video Wall Display Controller, Software Defined Radio (SDR) Front End, Portable Test and Measurement Equipment, Automotive Infotainment / CAN Gateway, Educational FPGA Development Boards.
Industrial Motor Control (FOC / Servo Drive)
The EP4CE6E22C9L fits industrial motor control drives because its 15 embedded 18x18 multipliers and 91 user I/O pins support field-oriented control (FOC) algorithms, space-vector PWM generation, encoder quadrature decoding, and multi-axis timing. The 6,272 logic elements handle state machines for commutation, current-loop PI controllers, and safety interlocks. The 0C to +85C commercial temperature range suits sealed drive enclosures, while the 1.2 V core supply keeps dissipation low in always-on factory automation systems. The exposed-pad 144-LQFP package enables a compact, hand-solderable PCB layout suitable for low-volume industrial SKUs.
Recommandé
LED Video Wall Display Controller
The EP4CE6E22C9L is well-matched to LED video wall controllers, where its 91 user I/O drive parallel data and clock lines to hundreds of LED driver ICs while its 6,272 logic elements handle scan-line multiplexing, gamma correction, and refresh-rate conversion. The 276,480 bits of embedded RAM serve as line buffers for color-space conversion (RGB to LED PWM duty cycles). Compared with a microcontroller, the FPGA's parallel fabric supports higher refresh rates without taxing a single CPU core, eliminating visible flicker on large panels. The LQFP-144 footprint eases prototype builds in custom display enclosures.
Recommandé
Software Defined Radio (SDR) Front End
For SDR baseband processing, the EP4CE6E22C9L provides sufficient logic density to implement digital down-conversion (DDC), finite impulse response (FIR) filters, and quadrature demodulation. Its 15 hardware 18x18 multipliers accelerate complex-mix multiply-accumulate operations required for tuner I/Q channelization. The 276 Kbits of block RAM hold FIR coefficients and small FFT windows without needing external memory. Combined with an external ADC and DAC pair, the EP4CE6E22C9L can implement a single-channel HF or VHF SDR receiver. The 144-LQFP exposed-pad package fits a credit-card-sized PCB for portable SDR kits.
Recommandé
Portable Test and Measurement Equipment
Battery-powered oscilloscopes, logic analyzers, and protocol testers benefit from the EP4CE6E22C9L's low dynamic power and 91 flexible user I/O. Logic analyzers use the FPGA for sampling-channel multiplexing and trigger-pattern matching, while arbitrary waveform generators use the embedded multipliers for DDS (direct digital synthesis) phase accumulators. The 1.2 V core supply combined with multi-voltage I/O banks (1.2 V to 3.3 V) lets the same board interface legacy 5 V-tolerant signals via external level shifters. The LQFP-144 exposed pad supports hand assembly for prototype instruments.
Recommandé
Automotive Infotainment / CAN Gateway
Inside vehicle infotainment head units and CAN-to-Ethernet gateways, the EP4CE6E22C9L bridges multiple automotive buses (CAN, LIN, FlexRay) and routes audio/video streams to display controllers. Its 91 user I/O support several CAN controllers, audio I2S buses, and LVDS display links. The 6,272 logic elements accommodate protocol state machines and audio sample-rate conversion. Designers should pair this part with the industrial-temperature EP4CE6E22A7N variant for AEC-Q100-grade thermal profiles, since the EP4CE6E22C9L itself is commercial-grade. The exposed-pad package aids thermal dissipation behind dashboard enclosures.
Recommandé
Educational FPGA Development Boards
University digital logic courses and FPGA training kits favor the EP4CE6E22C9L because it pairs the Intel Quartus Prime toolchain with a hand-solderable 144-LQFP exposed-pad package, eliminating BGA rework equipment for student labs. Its 6,272 logic elements are sufficient for full RISC-V soft-core implementations, VGA controllers, and UART peripherals commonly assigned in coursework. The exposed pad also simplifies thermal benchmarking and oscilloscope probing. Combined with low unit pricing, this makes the EP4CE6E22C9L a cost-effective platform for instructors building lab kits in volume.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE6E22C9L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22C6N | EP4CE10E22C8N | EP4CE15E22C8N | EP4CE6E22A7N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) | 6,272 (same) | 10,320 (+64%) | 15,408 (+145%) | 6,272 (same) |
| Speed Grade | C9 | C8 (slower) | C7 (slower) | C6 (slowest) | C8 | C8 | A7 (industrial) |
| Embedded RAM (bits) | 276,480 | 276,480 (same) | 276,480 (same) | 276,480 (same) | 423,936 (+53%) | 516,096 (+87%) | 276,480 (same) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 23 (+53%) | 56 (+273%) | 15 (same) |
| Maximum User I/O | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Principaux différenciateurs
- Fastest Cyclone IV E speed grade in the 144-LQFP package (vs EP4CE6E22C8N)
- 6,272 logic elements - lowest density in Cyclone IV E 144-LQFP family (vs EP4CE15E22C8N)
- Commercial 0C to +85C temperature range (vs EP4CE6E22A7N)
Notes de conception
Decouple every VCCINT pin (1.2 V core) with a 0.1 uF X7R ceramic capacitor placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor near the FPGA. Each VCCIO bank (1.2 V to 3.3 V) requires its own 0.1 uF bypass cap. Failure to decouple each pin individually is a common cause of JTAG communication failures and intermittent configuration errors on Cyclone IV E devices.
The exposed pad (pin 144 / EPAD) on the 144-LQFP package MUST be soldered to a copper pour of at least 100 mm^2 on the top or bottom PCB layer, with thermal vias (0.3 mm drill, 0.5 mm pitch grid) connecting to internal ground planes. For designs running the 15 embedded multipliers near 266 MHz, the junction temperature can exceed 100C without adequate thermal copper, leading to timing failures or device damage.
Follow Intel's Pin Connection Guidelines for the Cyclone IV E family - unused I/O pins should be left floating or driven to a defined logic level per Quartus Prime device settings. Do not tie unused I/O to ground without checking the unused-pin report, as some I/O cells feed internal configuration logic that expects a default high state during power-up. Always run the Quartus Prime fitter with all pin assignments finalized before PCB layout freeze.
A frequent mistake is selecting the wrong speed grade for timing closure. The C9 grade in EP4CE6E22C9L is the fastest Cyclone IV E speed; substituting a C8 or C7 pin-compatible part can fail hold-time analysis in pipelines clocked above 200 MHz. Estimated: at 200 MHz fMAX, a C8 part provides roughly 10-15% less timing margin than C9. Always re-run timing analysis after substituting any speed grade variant.
Place the JTAG header (TCK, TMS, TDI, TDO) within 50 mm of the FPGA with 33 ohm series termination resistors on each JTAG signal to suppress ringing during programming. Route JTAG traces away from switching power supply nodes and high-speed differential pairs. For multi-FPGA JTAG chains, add a 1k pull-up on TCK and TMS to keep the chain in a benign state during board power-up.
Informations de conformité
RoHS and lead-free compliant per Cyclone IV E product page. Commercial temperature grade - not AEC-Q100 qualified. Choose EP4CE6E22A7N for industrial-grade thermal profiles.