MPXC2012DT1 vs MPXC2011DT1 तुलना

विस्तृत दोनों ओर की तुलना MPXC2012DT1 द्वारा NXP Semiconductors और MPXC2011DT1 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ सक्रिय

विशेषता तुलना

पैरामीटर MPXC2012DT1 MPXC2011DT1
ब्रांड NXP Semiconductors NXP Semiconductors
श्रेणी Pressure Sensors Pressure Sensors
लाइफसाइकिल स्थिति NRND सक्रिय
Pressure Type Differential Differential
Operating Pressure 1.45 PSI (10 kPa) —
Maximum Over Pressure [DATA_NEEDED: maximum overpressure rating] —
आउटपुट प्रकार Wheatstone Bridge (analog mV) Analog Wheatstone bridge (ratiometric)
Full-Scale Output 24 mV to 26 mV (typ. 25 mV) at 10 V excitation 25 mV typical at 10 V excitation
Offset (Null) 0 mV nominal at 10 V excitation —
Excitation Voltage 10 V DC typical 3 V DC to 10 V DC (10 V nominal)
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity %FS] —
Pressure Port Size Female, 0.128 in (3.25 mm) side port —
Port Style Side port, single barbed inlet Female, 3.25 mm (0.128 in) barbed side port
पैकेज / केस 4-SSIP Module (chip-pak, no gel) —
Termination Style Through-hole PCB (vertical mount) Through-hole PCB, 4 leads
Gel Protection No (bare die in chip-pak cavity) —
ऑपरेटिंग तापमान [DATA_NEEDED: operating temperature range] 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature range] —
माउंटिंग प्रकार Through-hole, vertical Through-hole (PCB mount with side-port tubing)
RoHS स्थिति [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not in web data]
MSL स्तर Not applicable (through-hole sensor module) —
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Operating Pressure Range — 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity — 2.5 mV/kPa typical
पैकेज — 4-SSIP Chip Pak module, side port
Compensation — On-chip temperature compensated and calibrated
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

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