MPXC2012DT1 vs MPXC2011DT1 比較

詳細並排比較 MPXC2012DT1 由 NXP Semiconductors 與 MPXC2011DT1 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ 啟用中

規格比較

參數 MPXC2012DT1 MPXC2011DT1
品牌 NXP Semiconductors NXP Semiconductors
類別 Pressure Sensors Pressure Sensors
生命週期狀態 NRND 啟用中
Pressure Type Differential Differential
Operating Pressure 1.45 PSI (10 kPa) —
Maximum Over Pressure [DATA_NEEDED: maximum overpressure rating] —
輸出類型 Wheatstone Bridge (analog mV) Analog Wheatstone bridge (ratiometric)
Full-Scale Output 24 mV to 26 mV (typ. 25 mV) at 10 V excitation 25 mV typical at 10 V excitation
Offset (Null) 0 mV nominal at 10 V excitation —
Excitation Voltage 10 V DC typical 3 V DC to 10 V DC (10 V nominal)
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity %FS] —
Pressure Port Size Female, 0.128 in (3.25 mm) side port —
Port Style Side port, single barbed inlet Female, 3.25 mm (0.128 in) barbed side port
封裝 / 外殼 4-SSIP Module (chip-pak, no gel) —
Termination Style Through-hole PCB (vertical mount) Through-hole PCB, 4 leads
Gel Protection No (bare die in chip-pak cavity) —
工作溫度 [DATA_NEEDED: operating temperature range] 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature range] —
安裝類型 Through-hole, vertical Through-hole (PCB mount with side-port tubing)
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not in web data]
MSL 等級 Not applicable (through-hole sensor module) —
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Operating Pressure Range — 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity — 2.5 mV/kPa typical
封裝 — 4-SSIP Chip Pak module, side port
Compensation — On-chip temperature compensated and calibrated
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

資料表與資源

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