MPXC2012DT1 vs MPXC2011DT1 Perbandingan

Perbandingan bersamaan detil MPXC2012DT1 dari NXP Semiconductors dan MPXC2011DT1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MPXC2012DT1 MPXC2011DT1
Merek NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup NRND Aktif
Pressure Type Differential Differential
Operating Pressure 1.45 PSI (10 kPa) —
Maximum Over Pressure [DATA_NEEDED: maximum overpressure rating] —
Tipe Output Wheatstone Bridge (analog mV) Analog Wheatstone bridge (ratiometric)
Full-Scale Output 24 mV to 26 mV (typ. 25 mV) at 10 V excitation 25 mV typical at 10 V excitation
Offset (Null) 0 mV nominal at 10 V excitation —
Excitation Voltage 10 V DC typical 3 V DC to 10 V DC (10 V nominal)
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity %FS] —
Pressure Port Size Female, 0.128 in (3.25 mm) side port —
Port Style Side port, single barbed inlet Female, 3.25 mm (0.128 in) barbed side port
Paket / Case 4-SSIP Module (chip-pak, no gel) —
Termination Style Through-hole PCB (vertical mount) Through-hole PCB, 4 leads
Gel Protection No (bare die in chip-pak cavity) —
Suhu Kerja [DATA_NEEDED: operating temperature range] 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature range] —
Tipe Mounting Through-hole, vertical Through-hole (PCB mount with side-port tubing)
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not in web data]
Level MSL Not applicable (through-hole sensor module) —
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Operating Pressure Range — 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity — 2.5 mV/kPa typical
Paket — 4-SSIP Chip Pak module, side port
Compensation — On-chip temperature compensated and calibrated
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

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