MPXC2012DT1 vs MPXC2011DT1 השוואה
השוואה מפורטת זה לצד זה של MPXC2012DT1 מאת NXP Semiconductors ו MPXC2011DT1 מאת NXP Semiconductors. השווה מפרטים עיקריים, פרמטרים חשמליים, אריזה, סטטוס מחזור חיים, תמחור וזמינות כדי לקבוע את הרכיב הטוב ביותר לדרישות העיצוב שלך.
השוואת מפרטים
| פרמטר | MPXC2012DT1 | MPXC2011DT1 |
|---|---|---|
| מותג | NXP Semiconductors | NXP Semiconductors |
| קטגוריה | Pressure Sensors | Pressure Sensors |
| סטטוס מחזור חיים | NRND | פעיל |
| Pressure Type | Differential | Differential |
| Operating Pressure | 1.45 PSI (10 kPa) | — |
| Maximum Over Pressure | [DATA_NEEDED: maximum overpressure rating] | — |
| סוג פלט | Wheatstone Bridge (analog mV) | Analog Wheatstone bridge (ratiometric) |
| Full-Scale Output | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation | 25 mV typical at 10 V excitation |
| Offset (Null) | 0 mV nominal at 10 V excitation | — |
| Excitation Voltage | 10 V DC typical | 3 V DC to 10 V DC (10 V nominal) |
| Bridge Resistance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Pressure Port Size | Female, 0.128 in (3.25 mm) side port | — |
| Port Style | Side port, single barbed inlet | Female, 3.25 mm (0.128 in) barbed side port |
| מארז / Case | 4-SSIP Module (chip-pak, no gel) | — |
| Termination Style | Through-hole PCB (vertical mount) | Through-hole PCB, 4 leads |
| Gel Protection | No (bare die in chip-pak cavity) | — |
| טמפרטורת פעולה | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| סוג הרכבה | Through-hole, vertical | Through-hole (PCB mount with side-port tubing) |
| סטטוס RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not in web data] |
| רמת MSL | Not applicable (through-hole sensor module) | — |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Sensitivity | — | 2.5 mV/kPa typical |
| מארז | — | 4-SSIP Chip Pak module, side port |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |