MPXC2012DT1 vs MPXC2011DT1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXC2012DT1 disebabkan oleh NXP Semiconductors dan MPXC2011DT1 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ AktifPengandingan Spesifikasi
| Parametr | MPXC2012DT1 | MPXC2011DT1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | NRND | Aktif |
| Pressure Type | Differential | Differential |
| Operating Pressure | 1.45 PSI (10 kPa) | — |
| Maximum Over Pressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Jenis Output | Wheatstone Bridge (analog mV) | Analog Wheatstone bridge (ratiometric) |
| Full-Scale Output | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation | 25 mV typical at 10 V excitation |
| Offset (Null) | 0 mV nominal at 10 V excitation | — |
| Excitation Voltage | 10 V DC typical | 3 V DC to 10 V DC (10 V nominal) |
| Bridge Resistance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Pressure Port Size | Female, 0.128 in (3.25 mm) side port | — |
| Port Style | Side port, single barbed inlet | Female, 3.25 mm (0.128 in) barbed side port |
| Kemasan / Case | 4-SSIP Module (chip-pak, no gel) | — |
| Termination Style | Through-hole PCB (vertical mount) | Through-hole PCB, 4 leads |
| Gel Protection | No (bare die in chip-pak cavity) | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Jenis Pemasangan | Through-hole, vertical | Through-hole (PCB mount with side-port tubing) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not in web data] |
| Aras MSL | Not applicable (through-hole sensor module) | — |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Sensitivity | — | 2.5 mV/kPa typical |
| Kemasan | — | 4-SSIP Chip Pak module, side port |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |