MPXC2012DT1 vs MPXC2011DT1 موازنہ
تفصیلی ساتھ ساتھ موازنہ از MPXC2012DT1 بذریعہ NXP Semiconductors اور MPXC2011DT1 بذریعہ NXP Semiconductors. اہم خصوصیات، برقی پیرامیٹرز، پیکیجنگ، لائف سائیکل اسٹیٹس، قیمتوں اور دستیابی کا موازنہ کریں تاکہ آپ کی ڈیزائن ضروریات کے لیے بہترین کمپوننٹ کا تعین ہو سکے۔
خصوصیات کا موازنہ
| پیرامیٹر | MPXC2012DT1 | MPXC2011DT1 |
|---|---|---|
| برانڈ | NXP Semiconductors | NXP Semiconductors |
| زمرہ | Pressure Sensors | Pressure Sensors |
| لائف سائیکل کی حالت | NRND | فعال |
| Pressure Type | Differential | Differential |
| Operating Pressure | 1.45 PSI (10 kPa) | — |
| Maximum Over Pressure | [DATA_NEEDED: maximum overpressure rating] | — |
| آؤٹ پٹ کی قسم | Wheatstone Bridge (analog mV) | Analog Wheatstone bridge (ratiometric) |
| Full-Scale Output | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation | 25 mV typical at 10 V excitation |
| Offset (Null) | 0 mV nominal at 10 V excitation | — |
| Excitation Voltage | 10 V DC typical | 3 V DC to 10 V DC (10 V nominal) |
| Bridge Resistance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Pressure Port Size | Female, 0.128 in (3.25 mm) side port | — |
| Port Style | Side port, single barbed inlet | Female, 3.25 mm (0.128 in) barbed side port |
| پیکیج / کیس | 4-SSIP Module (chip-pak, no gel) | — |
| Termination Style | Through-hole PCB (vertical mount) | Through-hole PCB, 4 leads |
| Gel Protection | No (bare die in chip-pak cavity) | — |
| آپریٹنگ درجہ حرارت | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| ماؤنٹنگ ٹائپ | Through-hole, vertical | Through-hole (PCB mount with side-port tubing) |
| RoHS اسٹیٹس | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not in web data] |
| MSL لیول | Not applicable (through-hole sensor module) | — |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Sensitivity | — | 2.5 mV/kPa typical |
| پیکیج | — | 4-SSIP Chip Pak module, side port |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |