EP2AGZ300FH29I4G vs EP2AGZ300FH29C4N Perbandingan
Perbandingan bersamaan detil EP2AGZ300FH29I4G dari Intel dan EP2AGZ300FH29C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FH29I4G | EP2AGZ300FH29C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | 298,000 |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Rentang Suhu Kerja | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | C4 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | Up to 28 (up to 6.375 Gbps) |
| DSP Blocks | Yes (variable-precision, per family) | [DATA_NEEDED: exact DSP block count for EP2AGZ300] |
| Block RAM | Embedded M9K / M144K blocks | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Logic Array Blocks (LABs) | — | 11,920 |
| Adaptive Logic Modules (ALMs) | — | 119,200 |
| Embedded Memory (bits) | — | 18,854,912 |
| User I/O Pins | — | 281 |
| Core Voltage | — | 0.9 V |
| Paket | — | 780-ball FC-HFBGA (FH29) |
| Temperature Grade | — | Industrial (N suffix) |