EP2AGZ300FH29I4G vs EP2AGZ300FH29C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29I4G sa pamamagitan ng Intel at EP2AGZ300FH29C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29I4G | EP2AGZ300FH29C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | 298,000 |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | C4 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | Up to 28 (up to 6.375 Gbps) |
| DSP Blocks | Yes (variable-precision, per family) | [DATA_NEEDED: exact DSP block count for EP2AGZ300] |
| Block RAM | Embedded M9K / M144K blocks | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Logic Array Blocks (LABs) | — | 11,920 |
| Adaptive Logic Modules (ALMs) | — | 119,200 |
| Embedded Memory (bits) | — | 18,854,912 |
| User I/O Pins | — | 281 |
| Core Voltage | — | 0.9 V |
| Packhaging | — | 780-ball FC-HFBGA (FH29) |
| Temperature Grade | — | Industrial (N suffix) |