EP2AGZ300FH29I4G vs EP2AGZ300FH29C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FH29I4G disebabkan oleh Intel dan EP2AGZ300FH29C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FH29I4G | EP2AGZ300FH29C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | 298,000 |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Gambaran Suhu Operasi | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | C4 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | Up to 28 (up to 6.375 Gbps) |
| DSP Blocks | Yes (variable-precision, per family) | [DATA_NEEDED: exact DSP block count for EP2AGZ300] |
| Block RAM | Embedded M9K / M144K blocks | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Logic Array Blocks (LABs) | — | 11,920 |
| Adaptive Logic Modules (ALMs) | — | 119,200 |
| Embedded Memory (bits) | — | 18,854,912 |
| User I/O Pins | — | 281 |
| Core Voltage | — | 0.9 V |
| Kemasan | — | 780-ball FC-HFBGA (FH29) |
| Temperature Grade | — | Industrial (N suffix) |