EP3SE260F1152C2 vs EP3SE110F1152C3N Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C2 dari Intel dan EP3SE110F1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C2 EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Waktu Pembelian Terakhir
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III
Logic Elements (LE) 255,000 107,500
Logic Array Blocks (LABs) 10,200 4,300
Embedded Memory (bits) 16,672,768 —
User I/Os 744 744
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm TSMC
Paket 1152-ball FC-FBGA (Flip Chip) —
Tipe Mounting Surface Mount Surface Mount
Speed Grade C2 (commercial) C3
Suhu Kerja Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] 0 °C to 85 °C (commercial)
Status RoHS Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Level MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Mounting — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Tipe Memori — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon