EP3SE260F1152C2 vs EP3SE110F1152C3N 比較

詳細並排比較 EP3SE260F1152C2 由 Intel 與 EP3SE110F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1152C2 EP3SE110F1152C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III
Logic Elements (LE) 255,000 107,500
Logic Array Blocks (LABs) 10,200 4,300
Embedded Memory (bits) 16,672,768 —
User I/Os 744 744
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm TSMC
封裝 1152-ball FC-FBGA (Flip Chip) —
安裝類型 Surface Mount Surface Mount
Speed Grade C2 (commercial) C3
工作溫度 Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] 0 °C to 85 °C (commercial)
RoHS 狀態 Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
MSL 等級 [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
安裝方式 — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
記憶體類型 — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

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