EP3SE260F1152C2 vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2 sa pamamagitan ng Intel at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2 EP3SE110F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III
Logic Elements (LE) 255,000 107,500
Logic Array Blocks (LABs) 10,200 4,300
Embedded Memory (bits) 16,672,768 —
User I/Os 744 744
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm TSMC
Packhaging 1152-ball FC-FBGA (Flip Chip) —
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade C2 (commercial) C3
Temperature na Operasyon Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] 0 °C to 85 °C (commercial)
Tindminan RoHS Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Level ng MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Style ng Pagpapasok — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Uri ng Memory — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

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