EP3SE260F1152C2 vs EP3SE110F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C2 disebabkan oleh Intel dan EP3SE110F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1152C2 EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III
Logic Elements (LE) 255,000 107,500
Logic Array Blocks (LABs) 10,200 4,300
Embedded Memory (bits) 16,672,768 —
User I/Os 744 744
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm TSMC
Kemasan 1152-ball FC-FBGA (Flip Chip) —
Jenis Pemasangan Surface Mount Surface Mount
Speed Grade C2 (commercial) C3
Suhu Operasi Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] 0 °C to 85 °C (commercial)
Status RoHS Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Aras MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Pemasangan — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Jenis Ingatan — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

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