EP3SE260H780C2N vs EP3SE260H780C3 Perbandingan
Perbandingan bersamaan detil EP3SE260H780C2N dari Intel dan EP3SE260H780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C2N | EP3SE260H780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Series | Stratix III E | EP3SE |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| Paket | 780-BGA FCBGA | 780-ball FCBGA (HBGA), flip-chip |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Rentang Suhu Kerja | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C3 |
| Level MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (per product listings) |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Device Family | — | Stratix III Enhanced (Stratix III E) |
| Logic Array Blocks (LABs) | — | 10200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 488 |
| Operating Voltage (Core) | — | 0.9 V |
| Operating Voltage (Auxiliary) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Suhu Kerja | — | Commercial, 0C to +85C |
| Maximum Core Frequency | — | 500 MHz |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 (168 hours) |
| Packaging Type | — | Tray |
| Configuration Memory Support | — | Fast passive parallel, JTAG, Active Serial |