EP3SE260H780C2N vs EP3SE260H780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C2N disebabkan oleh Intel dan EP3SE260H780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C2N | EP3SE260H780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Stratix III E | EP3SE |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| Kemasan | 780-BGA FCBGA | 780-ball FCBGA (HBGA), flip-chip |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Gambaran Suhu Operasi | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C3 |
| Aras MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (per product listings) |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Device Family | — | Stratix III Enhanced (Stratix III E) |
| Logic Array Blocks (LABs) | — | 10200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 488 |
| Operating Voltage (Core) | — | 0.9 V |
| Operating Voltage (Auxiliary) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Suhu Operasi | — | Commercial, 0C to +85C |
| Maximum Core Frequency | — | 500 MHz |
| Tingkat sensitiviti Air Nama (MSL) | — | 3 (168 hours) |
| Packaging Type | — | Tray |
| Configuration Memory Support | — | Fast passive parallel, JTAG, Active Serial |