EP3SE260H780C4N vs EP3SE260H780C2N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C4N dari Intel dan EP3SE260H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C4N EP3SE260H780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 16,672,768
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS 40 nm
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
Paket 780-ball FCBGA (Flip Chip BGA) 780-BGA FCBGA
Tipe Mounting Surface Mount Surface Mount
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 hours) —
Suhu Kerja 0C to +85C (commercial) —
Configuration Method Serial/Parallel via Quartus II —
Series — Stratix III E
LABs / CLBs — 10,200
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Rentang Suhu Kerja — Commercial (0C to +85C)
Speed Grade — C2
Level MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Status RoHS — [DATA_NEEDED: rohs status]
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780

Spek dan Sumber

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