EP3SE260H780C4N vs EP3SE260H780C2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4N sa pamamagitan ng Intel at EP3SE260H780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260H780C4N EP3SE260H780C2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 16,672,768
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS 40 nm
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
Packhaging 780-ball FCBGA (Flip Chip BGA) 780-BGA FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Temperature na Operasyon 0C to +85C (commercial) —
Configuration Method Serial/Parallel via Quartus II —
Series — Stratix III E
LABs / CLBs — 10,200
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Hanay ng Temperature na Operasyon — Commercial (0C to +85C)
Speed Grade — C2
Level ng MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Tindminan RoHS — [DATA_NEEDED: rohs status]
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780

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