EP3SE260H780C4N vs EP3SE260H780C2N 比較

詳細並排比較 EP3SE260H780C4N 由 Intel 與 EP3SE260H780C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ 最後購買機會

規格比較

參數 EP3SE260H780C4N EP3SE260H780C2N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 16,672,768
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS 40 nm
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
封裝 780-ball FCBGA (Flip Chip BGA) 780-BGA FCBGA
安裝類型 Surface Mount Surface Mount
濕度敏感等級 (MSL) 3 (168 hours) —
工作溫度 0C to +85C (commercial) —
Configuration Method Serial/Parallel via Quartus II —
Series — Stratix III E
LABs / CLBs — 10,200
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
工作溫度範圍 — Commercial (0C to +85C)
Speed Grade — C2
MSL 等級 — 3 (168 hours)
Reflow Peak Time Max — 40 s
RoHS 狀態 — [DATA_NEEDED: rohs status]
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780

資料表與資源

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