EP3SL200F1517I4LN vs EP3SL200F1517I3N Perbandingan
Perbandingan bersamaan detil EP3SL200F1517I4LN dari Intel dan EP3SL200F1517I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200F1517I4LN | EP3SL200F1517I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/O Pins | 976 | — |
| Paket | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-FBGA) |
| Process Technology | 65 nm TSMC low-power | 65 nm |
| Suhu Kerja | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: max transceiver rate] | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| DSP Performance | 288 GMACS | — |
| Configuration Method | Passive Parallel / Active Serial / JTAG | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 40 mm x 40 mm | — |
| Number of LABs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| User I/Os | — | 976 |
| Number of Logic Cells | — | 200000 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Supplier Device Package | — | 1517-FBGA |
| Configuration Memory | — | SRAM-based |
| Number of 18x18 Multipliers | — | 384 |