EP3SL200F1517I4LN vs EP3SL200F1517I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200F1517I4LN disebabkan oleh Intel dan EP3SL200F1517I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200F1517I4LN | EP3SL200F1517I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/O Pins | 976 | — |
| Kemasan | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-FBGA) |
| Process Technology | 65 nm TSMC low-power | 65 nm |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Aras MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: max transceiver rate] | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| DSP Performance | 288 GMACS | — |
| Configuration Method | Passive Parallel / Active Serial / JTAG | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 40 mm x 40 mm | — |
| Number of LABs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| User I/Os | — | 976 |
| Number of Logic Cells | — | 200000 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Supplier Device Package | — | 1517-FBGA |
| Configuration Memory | — | SRAM-based |
| Number of 18x18 Multipliers | — | 384 |