EP3SL200F1517I4LN vs EP3SL200F1517I3N 比較
詳細並排比較 EP3SL200F1517I4LN 由 Intel 與 EP3SL200F1517I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL200F1517I4LN | EP3SL200F1517I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/O Pins | 976 | — |
| 封裝 | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-FBGA) |
| Process Technology | 65 nm TSMC low-power | 65 nm |
| 工作溫度 | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL 等級 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: max transceiver rate] | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| DSP Performance | 288 GMACS | — |
| Configuration Method | Passive Parallel / Active Serial / JTAG | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 40 mm x 40 mm | — |
| Number of LABs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| User I/Os | — | 976 |
| Number of Logic Cells | — | 200000 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Supplier Device Package | — | 1517-FBGA |
| Configuration Memory | — | SRAM-based |
| Number of 18x18 Multipliers | — | 384 |