EP3SL200H780I4 vs EP3SE260H780I4 Perbandingan
Perbandingan bersamaan detil EP3SL200H780I4 dari Intel dan EP3SE260H780I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780I4 | EP3SE260H780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III Enhanced (Stratix III E) |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | 10,200 |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | — |
| DSP Multipliers (18x18) | 384 | — |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | 4 |
| Suhu Hubung Kerja | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 255,000 |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Paket | — | 780-ball FC-HFBGA (HBGA) |
| Suhu Kerja | — | -40C to +100C (industrial, 'I' grade) |
| Tipe Mounting | — | Surface Mount (BGA) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |