EP3SL200H780I4 vs EP3SE260H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4 sa pamamagitan ng Intel at EP3SE260H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I4 | EP3SE260H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III Enhanced (Stratix III E) |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | 10,200 |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | — |
| DSP Multipliers (18x18) | 384 | — |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | 4 |
| Temperature ng Junction na Operasyon | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 255,000 |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Packhaging | — | 780-ball FC-HFBGA (HBGA) |
| Temperature na Operasyon | — | -40C to +100C (industrial, 'I' grade) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |