K4A8G085WB-BICH vs K4A8G085WB-BICR Perbandingan
Perbandingan bersamaan detil K4A8G085WB-BICH dari Samsung Electronics dan K4A8G085WB-BICR dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K4A8G085WB-BICH | K4A8G085WB-BICR |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8Gb | 8 Gb |
| Organisasi | 1G x 8 | 1G x 8 |
| Tegangan Pemuat | 1.2V | 1.2 V (VDD/VDDQ) |
| Laju Data | 2400 Mbps (DDR4-2400) | 2400 Mbps |
| Paket | 78-ball FBGA | 78-ball FBGA |
| Suhu Kerja | 0°C to 85°C | — |
| Max Supply Current | 170mA | — |
| Burst Length | BL8, BL16 | — |
| Latensi CAS | Programmable | — |
| On-Die ECC | Yes | — |
| Data Bus Inversion | Yes | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Die Revision | B-die | — |
| Number of Banks | — | 16 |
| Refresh Cycles | — | 8192 |
| Jumlah Pin | — | 78 |
| Tipe Mounting | — | Surface Mount |
| Temperature Grade | — | Industrial (I-grade) |
| Rentang Suhu Kerja | — | [DATA_NEEDED: exact temperature range for BICR industrial suffix] |
| Die / Process | — | Samsung 8Gb B-die DDR4 |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| Status RoHS | — | Compliant |
| Refresh Management | — | Row refresh, auto-refresh and self-refresh supported |