K4A8G085WB-BICH vs K4A8G085WB-BICR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A8G085WB-BICH disebabkan oleh Samsung Electronics dan K4A8G085WB-BICR disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ AktifPengandingan Spesifikasi
| Parametr | K4A8G085WB-BICH | K4A8G085WB-BICR |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8Gb | 8 Gb |
| Organisasi | 1G x 8 | 1G x 8 |
| Tegangan Pemberi Arus | 1.2V | 1.2 V (VDD/VDDQ) |
| Kadar Data | 2400 Mbps (DDR4-2400) | 2400 Mbps |
| Kemasan | 78-ball FBGA | 78-ball FBGA |
| Suhu Operasi | 0°C to 85°C | — |
| Max Supply Current | 170mA | — |
| Burst Length | BL8, BL16 | — |
| Latensi CAS | Programmable | — |
| On-Die ECC | Yes | — |
| Data Bus Inversion | Yes | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Die Revision | B-die | — |
| Number of Banks | — | 16 |
| Refresh Cycles | — | 8192 |
| Kiraan Pin | — | 78 |
| Jenis Pemasangan | — | Surface Mount |
| Temperature Grade | — | Industrial (I-grade) |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: exact temperature range for BICR industrial suffix] |
| Die / Process | — | Samsung 8Gb B-die DDR4 |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| Status RoHS | — | Compliant |
| Refresh Management | — | Row refresh, auto-refresh and self-refresh supported |