MPC8250ACZQIHBC vs MPC8250AZQIHBC Perbandingan
Perbandingan bersamaan detil MPC8250ACZQIHBC dari NXP Semiconductors dan MPC8250AZQIHBC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
Perbandingan Spesifikasi
| Parameter Umum | MPC8250ACZQIHBC | MPC8250AZQIHBC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| Lebar Bus Data | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Suhu Kerja | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | 516-Pin TEPBGA |
| Jumlah Pin | 516 | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Ball Pitch | 1.0 mm | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Frekuensi Bawah Maximum | — | 200 MHz |
| Tegangan Pemuat | — | 3.3 V |
| External Bus Width | — | 64-bit |
| Operating Temperature Grade | — | Commercial |
| Integrated Peripherals | — | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |