MPC8250ACZQIHBC vs MPC8250AZQIHBC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8250ACZQIHBC sa pamamagitan ng NXP Semiconductors at MPC8250AZQIHBC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
Pagsanggunian na paghahambing
| Parametro | MPC8250ACZQIHBC | MPC8250AZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| Width ng Data Bus | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Temperature na Operasyon | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | 516-Pin TEPBGA |
| Bilang ng Pin | 516 | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| Level ng MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Maksimum na Taktiko ng Oras | — | 200 MHz |
| Volte ng Pagbibigay | — | 3.3 V |
| External Bus Width | — | 64-bit |
| Operating Temperature Grade | — | Commercial |
| Integrated Peripherals | — | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |