MPC8250ACZQIHBC vs MPC8250AZQIHBC 比較
詳細並排比較 MPC8250ACZQIHBC 由 NXP Semiconductors 與 MPC8250AZQIHBC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
規格比較
| 參數 | MPC8250ACZQIHBC | MPC8250AZQIHBC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| 資料匯流排寬度 | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 工作溫度 | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | 516-Pin TEPBGA |
| 腳位數 | 516 | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Ball Pitch | 1.0 mm | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 等級 | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| 最大時脈頻率 | — | 200 MHz |
| 供應電壓 | — | 3.3 V |
| External Bus Width | — | 64-bit |
| Operating Temperature Grade | — | Commercial |
| Integrated Peripherals | — | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| RoHS 狀態 | — | Compliant |
| Lead-Free | — | Yes |