MPC860DEVR80D4 vs MPC860TZQ80D4 Perbandingan
Perbandingan bersamaan detil MPC860DEVR80D4 dari NXP Semiconductors dan MPC860TZQ80D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP
MPC860DEVR80D4 ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | MPC860DEVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit |
| Core Count | 1 | — |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Bawah Maximum | 80 MHz | — |
| Operating Process Technology | 0.32 um CMOS | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) | — |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Tegangan Pemuat | [DATA_NEEDED: core and I/O supply voltage] | — |
| Status RoHS | Compliant (lead-free VR suffix) | RoHS non-compliant (legacy PBGA, contains lead) |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Frequency | — | 80 MHz |
| Bus Width | — | 32-bit |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Paket | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |
| Packaging | — | Tray |
| Process Technology | — | 0.25 micron CMOS |