MPC860DEVR80D4 vs MPC860TZQ80D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860DEVR80D4 disebabkan oleh NXP Semiconductors dan MPC860TZQ80D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP
MPC860DEVR80D4 ✗ Akhir Hayat
Pengandingan Spesifikasi
| Parametr | MPC860DEVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit |
| Core Count | 1 | — |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Klock Maksimum | 80 MHz | — |
| Operating Process Technology | 0.32 um CMOS | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) | — |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Tegangan Pemberi Arus | [DATA_NEEDED: core and I/O supply voltage] | — |
| Status RoHS | Compliant (lead-free VR suffix) | RoHS non-compliant (legacy PBGA, contains lead) |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Frequency | — | 80 MHz |
| Bus Width | — | 32-bit |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Kemasan | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |
| Packaging | — | Tray |
| Process Technology | — | 0.25 micron CMOS |